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1. 发明申请

US20050122627A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20050122627A1
公开(公告)日：2005-06-09
申请号：US11002199
申请日：2004-12-03
申请人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
发明人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
IPC分类号： G11B5/60 , G11B5/00 , G11B5/012 , G11B5/48 , G11B21/00 , G11B21/02 , G11B21/21 , H05K1/05 , H05K1/11 , H05K3/24 , H05K3/28 , H05K3/40
CPC分类号： G11B5/486 , G11B5/484 , H05K1/056 , H05K3/243 , H05K3/28 , H05K3/4092 , H05K2201/0394 , H05K2201/0969
摘要： A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.
摘要翻译：一种具有电路的悬挂板，其具有通过添加工艺以精细布线电路形式形成的导体层，同时降低了飞行引线部分中的导体层损坏和断裂的风险。具有电路的悬挂板包括支撑板2，形成在支撑板2上的绝缘基底层3，形成在绝缘基底层3上的导体层4，形成在导体层4上的绝缘覆盖层5和飞行引导部分9，其中形成有支撑板侧开口13，基底层侧开口14和覆盖层侧开口15，使得导体层4的两侧可以从其露出。用于加强导体层4的加强部分16或23包括在导线层9的长度方向上，从绝缘基底层3和绝缘覆盖层5中的至少一个连续地形成的导体层4。

2. 发明授权

US07336446B2 Suspension board having a circuit and a flying lead portion 有权
标题翻译：悬挂板具有电路和飞行引线部分
公开(公告)号：US07336446B2
公开(公告)日：2008-02-26
申请号：US11002199
申请日：2004-12-03
申请人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
发明人： Hitoki Kanagawa , Yasuhito Funada , Tetsuya Oosawa
IPC分类号： G11B21/16
CPC分类号： G11B5/486 , G11B5/484 , H05K1/056 , H05K3/243 , H05K3/28 , H05K3/4092 , H05K2201/0394 , H05K2201/0969
摘要： A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.
摘要翻译：一种具有电路的悬挂板，其具有通过添加工艺以精细布线电路形式形成的导体层，同时降低了飞行引线部分中的导体层损坏和断裂的风险。具有电路的悬挂板包括支撑板2，形成在支撑板2上的绝缘基底层3，形成在绝缘基底层3上的导体层4，形成在导体层4上的绝缘覆盖层5，引导部分9，其中形成有支撑板侧开口13，基底层侧开口14和覆盖层侧开口15，使得导体层4的两侧可以从其露出。用于加强导体层4的加强部分16或23包括在导线层9的长度方向上，从绝缘基底层3和绝缘覆盖层5中的至少一个连续地形成的导体层4。

3. 发明授权

US07525764B2 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US07525764B2
公开(公告)日：2009-04-28
申请号：US11256800
申请日：2005-10-24
申请人： Tetsuya Ohsawa , Yasuhito Funada , Hitoki Kanagawa
发明人： Tetsuya Ohsawa , Yasuhito Funada , Hitoki Kanagawa
IPC分类号： G11B5/60 , G11B21/21
CPC分类号： G11B5/4853 , G11B5/486 , H05K1/056 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09063 , H05K2201/0969 , H05K2203/041 , H05K2203/107 , Y02P70/613
摘要： An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2.
摘要翻译：用于安装磁头的区域5形成在金属板1上，导电层4经由绝缘层2形成为电路图案，绝缘层2插入该区域的外部，直到金属板1为止。图案端4为用于与磁头的端子连接的连接端子形成在电路图案上，图案端4的端面4a与绝缘层2的正下方的端面2a对齐，或者从终端方向突出从而提供防止激光束在绝缘层2上的照射的结构。

4. 发明授权

US07182606B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07182606B2
公开(公告)日：2007-02-27
申请号：US11365845
申请日：2006-03-02
申请人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
发明人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
IPC分类号： H01R12/00
CPC分类号： H05K1/056 , H05K2201/0317 , H05K2201/0338 , H05K2203/0723
摘要： A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.
摘要翻译：一种布线电路板，其能够以简单的层状结构提供降低的传输损耗和改善金属悬挂板和金属箔之间的粘附强度，从而确保改善的长期可靠性。布线电路板1包括金属悬挂板2，通过溅射或电解电镀形成在金属悬挂板2上的薄金属膜3，通过电解电镀形成在金属薄膜3上的金属箔4，绝缘基底层形成在金属箔4和金属悬挂板2上的导电图案6和形成在绝缘基底层5上的布线电路图案的导电图案6。布线电路板1可以包括形成在绝缘基底层5上以覆盖导电图案6的绝缘覆盖层7。

5. 发明申请

US20060169486A1 Wired circuit board assembly 有权
标题翻译：有线电路板组装
公开(公告)号：US20060169486A1
公开(公告)日：2006-08-03
申请号：US11342215
申请日：2006-01-30
申请人： Yasuhito Funada , Yoshihiko Takeuchi , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasuhito Funada , Yoshihiko Takeuchi , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K1/14
CPC分类号： H05K3/0097 , H05K1/0393 , H05K1/056 , H05K3/0052 , H05K3/064 , H05K2201/0969 , H05K2203/0169 , H05K2203/0323
摘要： There is provided a wired circuit board assembly which allows effective prevention of the breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet (1), a plurality of wired circuit boards (2) each composed of a base insulating layer (5), a conductor pattern (6), and a cover insulating layer (7) which are formed on a support board (4) are supported by a support frame (3) in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit board (2) has a flexing portion (20) formed by removing the support board (4) to obtain a flexing property. In addition, second connecting portions (19) are provided in spanning relation between the flexing portion (20) and the vertical frame parts (16) of the support frame (3). The arrangement allows effective prevention of the breakage of the flexing portion (20) of each of the wired circuit boards (2) supported by the support frame (3).
摘要翻译：提供了一种布线电路板组件，其有效地防止了由支撑框架支撑的布线电路板的弯曲部分的断裂。在有线电路板支撑片（1）中，分别形成有基底绝缘层（5），导体图案（6）和覆盖绝缘层（7）的多个布线电路板（2）支撑板（4）由支撑框架（3）支撑，使得它们以相互间隔的关系布置和对准。每个布线电路板（2）具有通过去除支撑板（4）而形成的弯曲部分（20）以获得弯曲性能。此外，第二连接部分（19）以支撑框架（3）的弯曲部分（20）和垂直框架部分（16）之间的跨度设置。该布置允许有效地防止由支撑框架（3）支撑的每个有线电路板（2）的弯曲部分（20）的断裂。

6. 发明申请

US20060023435A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20060023435A1
公开(公告)日：2006-02-02
申请号：US11187865
申请日：2005-07-25
申请人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K7/06 , G11B5/49
CPC分类号： H05K1/181 , H05K1/056 , H05K3/28 , H05K2201/09972 , Y02P70/611
摘要： A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board 1 is constructed so that a suspension board portion 2 for supporting the magnetic head 15 and a control board portion 3 for controlling the magnetic head 15 are formed to be continuous and integral with each other. To be more specific, a first conductor layer 10 connected to the magnetic head 15 in the suspension board portion 2 and a second conductor layer 11 connected to a preamplifier IC 12 in the control board portion 3 are formed from the same material and formed on a common insulating base layer 9 simultaneously. Further, a common insulating cover layer 13 to cover the first conductor layer 10 and the second conductor layer 11 is formed on the common insulating base layer 9. This arrangement of the wired circuit board 1 can eliminate the need of providing the connection point for connecting the first conductor layer 10 of the suspension board portion 2 and the second conductor layer 11 of the control board portion 3 at the boundary therebetween.
摘要翻译：一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。布线电路板1被构造成使得用于支撑磁头15的悬挂板部分2和用于控制磁头15的控制板部分3彼此连续并且一体地形成。更具体地说，连接到悬挂板部分2中的磁头15的第一导体层10和连接到控制板部分3中的前置放大器IC 12的第二导体层11由相同的材料形成并形成在公共绝缘基层9同时。此外，在公共绝缘基底层9上形成覆盖第一导体层10和第二导体层11的公共绝缘覆盖层13。布线电路板1的这种布置可以消除在其间的边界处提供用于连接悬挂板部分2的第一导体层10和控制板部分3的第二导体层11的连接点的需要。

7. 发明授权

US07471519B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07471519B2
公开(公告)日：2008-12-30
申请号：US11187865
申请日：2005-07-25
申请人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： H05K1/181 , H05K1/056 , H05K3/28 , H05K2201/09972 , Y02P70/611
摘要： A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board is constructed so that a suspension board portion for supporting the magnetic head and a control board portion for controlling the magnetic head are formed to be continuous and integral with each other. To be more specific, a first conductor layer connected to the magnetic head in the suspension board portion and a second conductor layer connected to a preamplifier IC in the control board portion are formed from the same material and formed on a common insulating base layer simultaneously. Further, a common insulating cover layer to cover the first conductor layer and the second conductor layer is formed on the common insulating base layer.
摘要翻译：一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。布线电路板被构造成使得用于支撑磁头的悬架板部分和用于控制磁头的控制板部分彼此连续并且一体地形成。更具体地说，连接到悬架板部分中的磁头的第一导体层和连接到控制板部分中的前置放大器IC的第二导体层由相同的材料形成并同时形成在公共绝缘基底层上。此外，在公共绝缘基底层上形成覆盖第一导体层和第二导体层的公共绝缘覆盖层。

8. 发明申请

US20050186332A1 Production method of suspension board with circuit 审中-公开
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US20050186332A1
公开(公告)日：2005-08-25
申请号：US11059465
申请日：2005-02-16
申请人： Yasuhito Funada , Hitoki Kanagawa
发明人： Yasuhito Funada , Hitoki Kanagawa
IPC分类号： C23C18/31 , B05D5/12 , C23C18/32 , C25D7/00 , G11B5/48 , G11B5/60 , G11B21/21 , H05K1/05 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/44
CPC分类号： H05K3/244 , G11B5/486 , H05K1/056 , H05K3/062 , H05K3/108 , H05K2203/072
摘要： In order to provide a new production method of a suspension board with circuit capable of preventing deterioration of the outward appearance and defects in products caused by a metal supporting layer, and further capable of forming an electroless nickel plating layer having an even thickness in a reliable manner, an insulating base layer is first formed on a supporting board, and a chromium thin film and a copper thin film are formed next sequentially on the surface of the supporting board exposed from the insulating base layer and on the entire surface of the insulating base layer. Subsequently, a plating resist is formed in a reversal pattern with respect to the wired circuit pattern on the surface of the copper thin film, and a conductor layer is formed on the surface of the copper thin film exposed from the plating resist by electrolytic plating. The plating resist is removed after an electroless nickel plating layer is formed on the conductor layer. Subsequently, the copper thin film and the chromium thin film are removed sequentially, and an insulating cover layer is formed next.
摘要翻译：为了提供具有能够防止由金属支撑层引起的外观劣化和产品缺陷的电路的新型制造方法，并且还能够以可靠的方式形成具有均匀厚度的无电镀镍层首先在支撑板上形成绝缘基底层，并且在从绝缘基底层暴露的支撑板的表面上以及在绝缘基底的整个表面上依次形成铬薄膜和铜薄膜层。随后，相对于铜薄膜表面上的布线电路图形，以反转图案形成电镀抗蚀剂，并且通过电解电镀在从镀覆抗蚀剂暴露的铜薄膜的表面上形成导体层。在导体层上形成化学镀镍层之后，去除电镀抗蚀剂。随后，依次除去铜薄膜和铬薄膜，接着形成绝缘覆盖层。

9. 发明授权

US07307853B2 Wired circuit board assembly 有权
标题翻译：有线电路板组装
公开(公告)号：US07307853B2
公开(公告)日：2007-12-11
申请号：US11342215
申请日：2006-01-30
申请人： Yasuhito Funada , Yoshihiko Takeuchi , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasuhito Funada , Yoshihiko Takeuchi , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K3/0097 , H05K1/0393 , H05K1/056 , H05K3/0052 , H05K3/064 , H05K2201/0969 , H05K2203/0169 , H05K2203/0323
摘要： There is provided a wired circuit board assembly that prevents breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet, a plurality of wired circuit boards include a base insulating layer, a conductor pattern, and a cover insulating layer which are formed on a support board are supported by a support frame in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit boards has a flexing portion formed by removing the support board to obtain a flexing property. In addition, second connecting portions are provided in spanning relation between the flexing portion and the vertical frame parts of the support frame.
摘要翻译：提供了一种布线电路板组件，其防止由支撑框架支撑的有线电路板的弯曲部分的断裂。在有线电路板支撑片中，多个布线电路板包括形成在支撑板上的基底绝缘层，导体图案和覆盖绝缘层，由支撑框架支撑，使得它们被布置并以相互间隔的关系对准。每个布线电路板具有通过去除支撑板而形成的挠曲部分以获得弯曲性能。此外，第二连接部分以支撑框架的弯曲部分和垂直框架部分之间的跨度设置。

10. 发明申请

US20060199402A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20060199402A1
公开(公告)日：2006-09-07
申请号：US11365845
申请日：2006-03-02
申请人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
发明人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
IPC分类号： H01R12/00
CPC分类号： H05K1/056 , H05K2201/0317 , H05K2201/0338 , H05K2203/0723
摘要： A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.
摘要翻译：一种布线电路板，其能够以简单的层状结构提供降低的传输损耗和改善金属悬挂板和金属箔之间的粘附强度，从而确保改善的长期可靠性。布线电路板1包括金属悬挂板2，通过溅射或电解电镀形成在金属悬挂板2上的薄金属膜3，通过电解电镀形成在金属薄膜3上的金属箔4，绝缘基底层形成在金属箔4和金属悬挂板2上的导电图案6和形成在绝缘基底层5上的布线电路图案的导电图案6。布线电路板1可以包括形成在绝缘基底层5上以覆盖导电图案6的绝缘覆盖层7。

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