会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • PLASMA DISPLAY PANEL
    • 等离子显示面板
    • US20110089827A1
    • 2011-04-21
    • US12991867
    • 2009-05-15
    • Hiroto YanagawaHiroyuki YamakitaKiyoshi HishimotodaniKeisuke Okada
    • Hiroto YanagawaHiroyuki YamakitaKiyoshi HishimotodaniKeisuke Okada
    • H01J17/49H01J9/24
    • H01J11/12H01J9/02H01J11/24H01J11/32H01J2211/245H01J2211/323
    • The present invention provides a PDP especially having a high definition or super high definition cell structure and realizing excellent image display performance by obtaining light-emitting efficiency as favorable as or more favorable than conventional PDPs while suppressing discharge voltage rise.Therefore, strip-shaped display electrodes 4 and 5 of a PDP 1 are respectively composed of a combination of a transparent electrode 41 and a bus electrode 42 and a combination of a transparent electrode 51 and a bus electrode 52. An electrode gap d between electrodes 41 and 51 falls in a range of 5 μm to 60 μm. A ratio of a total surface area of the electrodes 41 and 51 to a total surface area of discharge cells falls in a range of 0.6 to 0.92. Thus, a discharge start length is larger than the electrode gap d. A product of a total pressure P of a discharge gas and the electrode gap d falls in a range of 13.33 Pa·cm to 133.3 Pa·cm. The discharge gas consists of xenon of 100%. The total pressure P of the discharge gas falls in a range of 2.0 kPa to 53.3 kPa. Thus, a start point of discharge is longer than electrode gap d.
    • 本发明提供了一种特别是具有高清晰度或超高分辨率单元结构的PDP,并且通过在抑制放电电压上升的同时获得优于常规PDP的发光效率而实现优异的图像显示性能。 因此,PDP1的带状显示电极4和5分别由透明电极41和总线电极42的组合以及透明电极51和总线电极52的组合构成。电极间的电极间隙d 41和51落在5μm至60μm的范围内。 电极41和51的总表面积与放电单元的总表面积的比率落在0.6至0.92的范围内。 因此,放电开始长度大于电极间隙d。 放电气体的总压力P与电极间隙d的乘积在13.33Pa·cm〜133.3Pa·cm的范围内。 放电气体由100%的氙组成。 排出气体的总压力P在2.0kPa〜53.3kPa的范围内。 因此,放电的起始点比电极间隙d长。
    • 5. 发明授权
    • Method for producing multilayer printed wiring boards
    • 多层印刷电路板的制造方法
    • US5263243A
    • 1993-11-23
    • US10557
    • 1993-01-28
    • Junichi TanedaKeisuke OkadaTakumi HirotoKouichi Hirosawa
    • Junichi TanedaKeisuke OkadaTakumi HirotoKouichi Hirosawa
    • H05K1/11H05K3/00H05K3/40H05K3/46H05K3/36
    • H05K3/0035H05K3/4652H05K1/116H05K2201/0187H05K2201/0355H05K2201/09481H05K2203/0554H05K2203/063H05K3/4069Y10S428/901Y10T29/49126Y10T29/49165
    • In a method for producing a multilayer printed wiring board, first and second copper foils for surface layer are disposed on both sides of an inner wiring substrate so that each of first and second prepreg sheets provided with through-holes is sandwiched between each of the copper foils for surface layer and each face of the substrate, the through-holes being formed therethrough at desired positions corresponding to positions where the connecting pads on each face of the substrate are formed, and the resulting structure is integrally bonded by applying heat and pressure thereto. During the heat- and pressure-processing step, the through-holes within the prepreg sheets are filled with a resin fused from the prepreg sheets. After selectively removing the copper foil for surface layer within an area which matches each of the connecting pads, the resin is selectively removed by the irradiation of laser beams to form via holes and allow the connecting pads to be exposed. Next, a conductive paste is embedded in the via holes. According to the above-mentioned method, it is possible to suppress occurrence of defective in boring of the via hole for electrically connecting circuit patterns of the surface layer to circuit patterns of the inner layer and also to shorten the production term and reduce the production cost.
    • 在多层印刷布线板的制造方法中,在内部布线基板的两侧配置表面层的第一和第二铜箔,使得设置有贯通孔的第一和第二预浸料片各自夹在铜 用于表层和衬底的每个面的箔,通孔在与形成衬底的每个面上的连接焊盘的位置相对应的期望位置形成,并且所得到的结构通过向其施加热和压力而一体地结合 。 在加热和加压步骤期间,预浸料片内的通孔用预浸渍片材熔融的树脂填充。 在与每个连接焊盘匹配的区域中选择性地去除表面层的铜箔之后,通过激光束的照射选择性地去除树脂以形成通孔并允许连接焊盘露出。 接下来,将导电膏嵌入到通孔中。 根据上述方法,可以抑制用于将表面层的电路图案电连接到内层的电路图案的通孔的缺陷发生,并且缩短生产期限并降低生产成本 。
    • 8. 发明授权
    • Engine-driven power generating system with over-current protection and
stator teeth with grooves on a top surface
    • 具有过电流保护功能的发动机驱动发电系统和顶面凹槽的定子齿
    • US5257174A
    • 1993-10-26
    • US661900
    • 1991-02-27
    • Kazuyuki OgiwaraKeisuke OkadaHiroshi Kobiyama
    • Kazuyuki OgiwaraKeisuke OkadaHiroshi Kobiyama
    • H02H7/12H02H7/122H02K1/16H02M5/458H02M7/48
    • H02H7/122H02K1/16H02M5/458H02M7/53871H02K2201/06
    • An engine-driven power generating system having a bridge circuit section in which low-frequency switching elements are driven alternately by low-frequency drive signals, and high-frequency switching elements driven by high-frequency drive signals during the ON period of the low-frequency switching elements are connected in a bridge network, and an inverter circuit section having a drive signal supply circuit for supplying low-frequency and high-frequency drive signals are each supplied to the low-frequency and high-frequency switching elements that form a pair; the a-c voltage generated by an engine-driven a-c generator is converted into d-c voltage that is in turn converted into a predetermined level of low-frequency a-c voltage; characterized in that an overcurrent detecting circuit for detecting an overcurrent flowing in the bridge circuit section at a level higher than a predetermined level, a drive-signal control circuit that outputs to a drive-signal supply circuit, when the overcurrent detecting circuit detects an overcurrent during a half-cycle of the low-frequency signal in which the low-frequency switching element is turned on, a signal which turns off at least any one of the low-frequency and high-frequency switching elements to be turned on during the half-cycle after the detection of the overcurrent, and a low-pass filter for obtaining a sine-wave waveform on an output end are provided.
    • 一种具有桥式电路部分的发动机驱动的发电系统,其中低频开关元件由低频驱动信号交替驱动;以及高频开关元件,由高频驱动信号驱动, 频率开关元件连接在桥式网络中,并且具有用于提供低频和高频驱动信号的驱动信号供给电路的逆变器电路部分分别提供给形成一对的低频和高频开关元件 ; 由发动机驱动的a-c发电机产生的a-c电压被转换成d-c电压,其又转换成预定水平的低频a-c电压; 其特征在于:过电流检测电路,用于检测在高于预定电平的电桥电路部分中流过的过电流;驱动信号控制电路,当过电流检测电路检测到过电流时,向驱动信号供给电路输出 在低频开关元件导通的低频信号的半周期期间,在半频开关元件中的至少任一个低频开关元件和高频开关元件接通的信号被截止 在检测到过电流之后进行循环,并且提供用于在输出端获得正弦波波形的低通滤波器。
    • 9. 发明授权
    • Process for preparing multi-layer printed wiring board
    • 制备多层印刷线路板的工艺
    • US5220723A
    • 1993-06-22
    • US787128
    • 1991-11-04
    • Keisuke Okada
    • Keisuke Okada
    • H05K3/00H05K3/46
    • H05K3/4623H05K3/0094H05K2201/0195H05K2201/0355H05K2201/09536H05K2201/0959H05K2203/0278H05K2203/1152Y10T29/49126
    • Disclosed is a process for preparing a multi-layer printed wiring board including the step of forming a through hole and an external layer circuit on a laminated board of double-sided or multi-layer construction. Then the laminated board is coated over the whole front and back surfaces with a paste-like heat-resistant resin, simultaneously filling the through hole with a resin. A copper foil is disposed on the whole front and back surfaces of the laminated board. Next, the arrangement is heated and pressure-molded in a vacuum. The copper foil is then removed to form an intermediate laminated board. Then, multilayer molding of at least two sets of intermediate laminated boards with a prepreg interposed therebetween is preformed via a step of heat and pressure-molding. In using the penetrated through hole as the divided via hole, there is no longer a restriction of the thickness of the respective divided via holes on the same lattice point. Thus, it has become possible to use the via holes in a higher multilayer board, dramatically improving wiring capacity over the prior art divided via holes.
    • 公开了一种制备多层印刷线路板的方法,包括在双面或多层结构的层压板上形成通孔和外层电路的步骤。 然后,用糊状耐热树脂在整个前表面和后表面上涂覆层压板,同时用树脂填充通孔。 在层压板的整个前后表面上设置铜箔。 接下来,将该装置在真空中加热和压模。 然后去除铜箔以形成中间层压板。 然后,通过热和加压成型的步骤,进行至少两组中间层压板的多层成型,其间插入有预浸料。 在使用穿透通孔作为分割通孔时,在同一格子点上不再限制各分割通孔的厚度。 因此,可以在较高的多层板中使用通孔,与现有技术的分开的通孔相比,显着提高布线容量。