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    • 3. 发明申请
    • PAD CONDITIONER AUTO DISK CHANGE
    • PAD控制器自动盘更改
    • US20100099342A1
    • 2010-04-22
    • US12255442
    • 2008-10-21
    • Hung Chih ChenSteven M. ZunigaDonald J.K. Olgado
    • Hung Chih ChenSteven M. ZunigaDonald J.K. Olgado
    • B24D9/08
    • B24B53/017
    • A method and apparatus for replacing a polishing pad conditioning disk is a chemical mechanical polishing system is provided. The apparatus comprises a disk load/unload station for unloading used conditioning disks from a pad conditioning assembly and loading unused conditioning disks onto the pad conditioning assembly, on or more disk storage stations for storing both used and unused conditioning disks, and a central robot having a range of motion sufficient for transferring both used an unused conditioning disks between the disk load/unload station and the one or more disk storage stations. Embodiments described herein reduce the length of system interruption by eliminating the need to safety lock out the system for the replacement of polishing pad conditioning disks.
    • 一种用于更换抛光垫调节盘的方法和装置是提供化学机械抛光系统。 该装置包括用于从衬垫调节组件卸载使用的调节盘并将未使用的调节盘装载到衬垫调节组件上的多个盘装载/卸载站,用于存储使用和未使用的调节盘的两个或多个盘存储站,以及一个中央机器人, 足够的运动范围,用于在盘装载/卸载站和一个或多个盘存储站之间使用未使用的调节盘。 本文所描述的实施例通过消除安全锁定系统来更换抛光垫调节盘来减少系统中断的长度。
    • 5. 发明申请
    • PLATEN EXHAUST FOR CHEMICAL MECHANICAL POLISHING SYSTEM
    • 化学机械抛光系统的排气
    • US20090264049A1
    • 2009-10-22
    • US12105924
    • 2008-04-18
    • Hung Chih ChenAllen L. D'AmbraDonald J.K. Olgado
    • Hung Chih ChenAllen L. D'AmbraDonald J.K. Olgado
    • B24B1/00B24B55/12B08B5/04B08B15/02
    • B24B37/04B08B15/04B24B55/12
    • The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.
    • 本发明一般涉及基片转印系统。 特别地,本发明涉及有效地除去在抛光过程中产生的化学烟雾,蒸气和其它副产物的装置和方法。 本发明的一个实施例提供了一种用于抛光衬底的装置,包括具有抛光表面的压板,所述抛光表面被配置为通过在相对于衬底移动的同时使衬底接触而抛光衬底;抛光头,其被配置为支撑衬底并将衬底定位为 在抛光期间与抛光表面接触,配置成在研磨表面上分配抛光溶液的溶液喷嘴以及被配置为去除在抛光期间产生的烟雾,蒸气和其它副产物的排气组件。