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    • 3. 发明授权
    • Direct-contact type image sensor device, an image sensor unit, and
methods for producing the same
    • 直接接触型图像传感器装置,图像传感器单元及其制造方法
    • US5477047A
    • 1995-12-19
    • US141328
    • 1993-10-21
    • Masahiro NakagawaTetsuro NakamuraShinji FujiwaraEiichiro Tanaka
    • Masahiro NakagawaTetsuro NakamuraShinji FujiwaraEiichiro Tanaka
    • H04N1/031H01J40/14
    • H04N1/0316H04N1/0313
    • A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; a transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.
    • 根据本发明的直接接触型图像传感器装置包括:具有上表面和下表面的透光基底; 形成在所述透光基板的上表面上的图案化导体层; 形成在所述透光基板的下表面上的透明导电层; 图像传感器芯片,其面向下安装在透光基板的上表面上,绝缘树脂层插入在图像传感器芯片和透光基板的上表面之间,图像传感器芯片由 倒装芯片接合方法,设置在图案化导体层和透光基板的上表面之间的遮光层; 以及用于中断光束的一部分的遮光部,通过透光基板通过设置在透光基板上方的光源将光束照射在原稿上。 图像传感器芯片和遮光部分用作光束的光学节流阀。
    • 4. 发明授权
    • Direct-contact type image sensor using optical fiber array with light
absorbing cladding
    • 直接接触式图像传感器,采用光吸收包层光纤阵列
    • US5448055A
    • 1995-09-05
    • US161123
    • 1993-12-02
    • Tetsuro NakamuraEiji KawamotoShinji Fujiwara
    • Tetsuro NakamuraEiji KawamotoShinji Fujiwara
    • G02B6/08H04N1/031H01J40/14
    • H04N1/0312G02B6/08H04N1/0311H04N1/0315
    • The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad. The image sensor chip is provided in such a way that the photosensitive element array is disposed along an upper end of the optical fiber array and in a portion of the optical fiber array plate except the transparent member, the transparent member forming a slit for transmitting light.
    • 本发明提供一种直接接触型图像传感器装置,其中具有电极和感光元件阵列的图像传感器芯片通过倒装芯片接合方法安装在光纤阵列板上。 光纤阵列板包括:第一不透明基板,第二不透明基板,通过布置多根光纤形成的光纤阵列;以及与光纤阵列的侧面接触设置的透明部件,所述光纤阵列 并且所述透明构件插入在所述第一和第二不透明基板之间。 多个光纤中的每一个包括中心芯,设置在芯的外表面上的包层以及设置在包层的外表面上的光吸收层。 图像传感器芯片以这样的方式设置,使得光敏元件阵列沿着光纤阵列的上端布置,并且在除了透明构件之外的光纤阵列板的一部分中,透明构件形成用于透射光的狭缝 。
    • 10. 发明授权
    • Linear beam irradiator having a varying cross-sectional size
    • 具有变化的横截面尺寸的直线光束照射器
    • US06351594B1
    • 2002-02-26
    • US09034761
    • 1998-03-04
    • Tetsuro NakamuraEiichiro TanakaTakahiko Murata
    • Tetsuro NakamuraEiichiro TanakaTakahiko Murata
    • F21V800
    • G02B27/0031G02B6/0001Y10S385/901
    • The present invention relates to a linear beam irradiator, more specifically to a linear beam irradiator for using light conductor, comprising a light conductor having light permeability, a light refraction & reflection area 2 provided on one side face in the longitudinal direction of said light conductor, and a light source 8 provided in a way to cover the light refraction & reflection area 2, as well as a light source disposed at one end or both ends of said light conductor. This construction makes it possible to irradiate a linear light beam from the other side face of the light conductor corresponding to said light refraction & reflection area 2. With this construction, it becomes possible to reduce the deviation of illuminance of said linear light beam, sharply improve the transmission efficiency of light and greatly reduce the number of LED chips disposed at the light source. Moreover, this also enables a cost reduction.
    • 线性光束照射装置技术领域本发明涉及一种直线光束照射装置,更具体地涉及一种使用光导体的直线光束照射装置,其特征在于,包括具有透光性的导光体,设在所述导光体的长度方向的一个侧面上的光折射和反射区域2 以及以覆盖光折射和反射区域2的方式设置的光源8以及设置在所述光导体的一端或两端的光源。 这种结构使得可以从对应于所述光折射和反射区域2的光导体的另一侧面照射线性光束。通过这种结构,可以减少所述线性光束的照度偏差 提高光的传输效率,大大减少设在光源处的LED芯片的数量。 此外,这也可以降低成本。