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1. 发明申请

US20140263975A1 LIGHT DETECTION DEVICE 有权
标题翻译：光检测装置
公开(公告)号：US20140263975A1
公开(公告)日：2014-09-18
申请号：US14352429
申请日：2012-08-02
申请人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
发明人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
IPC分类号： G01J1/42 , H01L27/144
CPC分类号： H01L31/107 , G01J1/42 , G01T1/208 , H01L27/144 , H01L27/1443 , H01L27/14636 , H01L27/14643 , H01L27/14658 , H01L27/14663 , H01L28/20 , H01L31/02005 , H01L31/022408
摘要： A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate, quenching resistors connected in series to the respective avalanche photodiodes and arranged on a first principal surface side of the semiconductor substrate, and a plurality of through-hole electrodes electrically connected to the quenching resistors and formed so as to penetrate the semiconductor substrate from the first principal surface side to a second principal surface side. A mounting substrate includes a plurality of electrodes arranged corresponding to the respective through-hole electrodes on a third principal surface side. The through-hole electrodes and the electrodes are electrically connected through bump electrodes, and a side surface of the semiconductor substrate and a side surface of a glass substrate are flush with each other.
摘要翻译：半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，与各个雪崩光电二极管串联连接并设置在半导体衬底的第一主表面侧上的骤冷电阻器，以及多个通孔电极连接到淬火电阻器并形成为从第一主表面侧穿过半导体衬底到第二主表面侧的电极。安装基板包括在第三主表面侧对应于相应的通孔电极布置的多个电极。通孔电极和电极通过凸块电极电连接，半导体衬底的侧表面和玻璃衬底的侧表面彼此齐平。

2. 发明授权

US09368528B2 Light detection device having a semiconductor light detection element and a mounting substrate with quenching circuits 有权
标题翻译：具有半导体光检测元件的光检测装置和具有淬火电路的安装基板
公开(公告)号：US09368528B2
公开(公告)日：2016-06-14
申请号：US14350647
申请日：2012-08-02
申请人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
发明人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
IPC分类号： H01L27/144 , H01L31/107 , H01L27/146
CPC分类号： H01L27/14643 , H01L27/1446 , H01L27/14618 , H01L27/14636 , H01L27/14658 , H01L31/107
摘要： A light detection device 1 has a semiconductor light detection element having a semiconductor substrate, and a mounting substrate arranged as opposed to the semiconductor light detection element. The semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in the semiconductor substrate, and electrodes electrically connected to the respective avalanche photodiodes and arranged on a second principal surface side of the semiconductor substrate. The mounting substrate includes a plurality of electrodes arranged corresponding to the respective electrodes on a third principal surface side, and quenching resistors electrically connected to the respective electrodes and arranged on the third principal surface side. The electrodes and the electrodes are connected through bump electrodes.
摘要翻译：光检测装置1具有半导体光检测元件，该半导体光检测元件具有半导体衬底和与半导体光检测元件相对布置的安装衬底。半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，以及电连接到各个雪崩光电二极管并且布置在半导体衬底的第二主表面侧上的电极。安装基板包括在第三主面侧对应于各个电极布置的多个电极，并且电连接到各个电极并且布置在第三主表面侧上的淬火电阻。电极和电极通过凸块电极连接。

3. 发明申请

US20140327100A1 LIGHT DETECTION DEVICE 有权
标题翻译：光检测装置
公开(公告)号：US20140327100A1
公开(公告)日：2014-11-06
申请号：US14352398
申请日：2012-08-02
申请人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
发明人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
IPC分类号： H01L27/146
CPC分类号： H01L27/1446 , H01L27/1443 , H01L27/14605 , H01L28/20 , H01L31/02005 , H01L31/02322 , H01L31/107 , H01L2224/11
摘要： A semiconductor light detection element has a plurality of channels, each of which consists of a photodiode array including a plurality of avalanche photodiodes operating in Geiger mode, quenching resistors connected in series to the respective avalanche photodiodes, and signal lines to which the quenching resistors are connected in parallel. A mounting substrate is configured so that a plurality of electrodes corresponding to the respective channels are arranged on a third principal surface side and so that a signal processing unit for processing output signals from the respective channels is arranged on a fourth principal surface side. In a semiconductor substrate, through-hole electrodes electrically connected to the signal lines are formed for the respective channels. The through-hole electrodes and the electrodes are electrically connected through bump electrodes.
摘要翻译：半导体光检测元件具有多个通道，每个通道由包括以盖革模式操作的多个雪崩光电二极管的光电二极管阵列组成，与各雪崩光电二极管串联连接的淬火电阻器，以及淬灭电阻器并联连接安装基板被配置为使得与第三主面对应的多个电极布置在第三主表面上，并且使得用于处理来自各个通道的输出信号的信号处理单元被布置在第四主表面侧。在半导体基板中，形成与各信道电连接的信号线的通孔电极。通孔电极和电极通过凸块电极电连接。

4. 发明授权

US08969990B2 Light detection device 有权
标题翻译：光检测装置
公开(公告)号：US08969990B2
公开(公告)日：2015-03-03
申请号：US14352398
申请日：2012-08-02
申请人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
发明人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
IPC分类号： H01L31/107 , H01L27/146
CPC分类号： H01L27/1446 , H01L27/1443 , H01L27/14605 , H01L28/20 , H01L31/02005 , H01L31/02322 , H01L31/107 , H01L2224/11
摘要： A semiconductor light detection element has a plurality of channels, each of which consists of a photodiode array including a plurality of avalanche photodiodes operating in Geiger mode, quenching resistors connected in series to the respective avalanche photodiodes, and signal lines to which the quenching resistors are connected in parallel. A mounting substrate is configured so that a plurality of electrodes corresponding to the respective channels are arranged on a third principal surface side and so that a signal processing unit for processing output signals from the respective channels is arranged on a fourth principal surface side. In a semiconductor substrate, through-hole electrodes electrically connected to the signal lines are formed for the respective channels. The through-hole electrodes and the electrodes are electrically connected through bump electrodes.
摘要翻译：半导体光检测元件具有多个通道，每个通道由包括以盖革模式操作的多个雪崩光电二极管的光电二极管阵列组成，与各雪崩光电二极管串联连接的淬火电阻器，以及淬灭电阻器并联连接安装基板被配置为使得与第三主面对应的多个电极布置在第三主表面上，并且使得用于处理来自各个通道的输出信号的信号处理单元被布置在第四主表面侧。在半导体基板中，形成与各信道电连接的信号线的通孔电极。通孔电极和电极通过凸块电极电连接。

5. 发明申请

US20140291486A1 LIGHT DETECTION DEVICE 有权
标题翻译：光检测装置
公开(公告)号：US20140291486A1
公开(公告)日：2014-10-02
申请号：US14350647
申请日：2012-08-02
申请人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
发明人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
IPC分类号： H01L27/144
CPC分类号： H01L27/14643 , H01L27/1446 , H01L27/14618 , H01L27/14636 , H01L27/14658 , H01L31/107
摘要： A light detection device 1 has a semiconductor light detection element having a semiconductor substrate, and a mounting substrate arranged as opposed to the semiconductor light detection element. The semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in the semiconductor substrate, and electrodes electrically connected to the respective avalanche photodiodes and arranged on a second principal surface side of the semiconductor substrate. The mounting substrate includes a plurality of electrodes arranged corresponding to the respective electrodes on a third principal surface side, and quenching resistors electrically connected to the respective electrodes and arranged on the third principal surface side. The electrodes and the electrodes are connected through bump electrodes.
摘要翻译：光检测装置1具有半导体光检测元件，该半导体光检测元件具有半导体衬底和与半导体光检测元件相对布置的安装衬底。半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，以及电连接到各个雪崩光电二极管并且布置在半导体衬底的第二主表面侧上的电极。安装基板包括在第三主面侧对应于各个电极布置的多个电极，并且电连接到各个电极并且布置在第三主表面侧上的淬火电阻。电极和电极通过凸块电极连接。

6. 发明授权

US09435686B2 Light detection device having a semiconductor light detection element, a mounting substrate, a glass substrate and a plurality of through-hole electrodes electrically connected to quenching resistors 有权
标题翻译：具有半导体光检测元件，安装基板，玻璃基板以及电连接到淬火电阻器的多个通孔电极的光检测装置
公开(公告)号：US09435686B2
公开(公告)日：2016-09-06
申请号：US14352429
申请日：2012-08-02
申请人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
发明人： Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
IPC分类号： G01J1/42 , H01L27/144 , H01L31/107 , H01L27/146 , G01T1/208 , H01L31/0224
CPC分类号： H01L31/107 , G01J1/42 , G01T1/208 , H01L27/144 , H01L27/1443 , H01L27/14636 , H01L27/14643 , H01L27/14658 , H01L27/14663 , H01L28/20 , H01L31/02005 , H01L31/022408
摘要： A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate, quenching resistors connected in series to the respective avalanche photodiodes and arranged on a first principal surface side of the semiconductor substrate, and a plurality of through-hole electrodes electrically connected to the quenching resistors and formed so as to penetrate the semiconductor substrate from the first principal surface side to a second principal surface side. A mounting substrate includes a plurality of electrodes arranged corresponding to the respective through-hole electrodes on a third principal surface side. The through-hole electrodes and the electrodes are electrically connected through bump electrodes, and a side surface of the semiconductor substrate and a side surface of a glass substrate are flush with each other.
摘要翻译：半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，与各个雪崩光电二极管串联连接并设置在半导体衬底的第一主表面侧上的骤冷电阻器，以及多个通孔电极连接到淬火电阻器并形成为从第一主表面侧穿过半导体衬底到第二主表面侧的电极。安装基板包括在第三主表面侧对应于相应的通孔电极布置的多个电极。通孔电极和电极通过凸块电极电连接，半导体衬底的侧表面和玻璃衬底的侧表面彼此齐平。

7. 发明申请

US20140104687A1 PRODUCTION METHOD FOR OPTICAL COMPONENT AND OPTICAL COMPONENT 有权
标题翻译：光学元件和光学元件的生产方法
公开(公告)号：US20140104687A1
公开(公告)日：2014-04-17
申请号：US14117089
申请日：2012-04-04
申请人： Yoshihisa Warashina , Tomofumi Suzuki , Kohei Kasamori
发明人： Yoshihisa Warashina , Tomofumi Suzuki , Kohei Kasamori
IPC分类号： G02B1/11
CPC分类号： G02B1/115 , G01B9/02051 , G01B9/02056 , G01J3/4535 , G02B26/06 , G02B26/0841
摘要： A method for manufacturing a light transmissive optical component, includes a first etching process of forming a depressed portion by applying etching to a silicon region of a plate-shaped member, a thermal oxidation process of forming a silicon oxide film by thermally oxidizing an inner side surface of the depressed portion, and a nitride film formation process of forming a silicon nitride film that covers the silicon oxide film. Accordingly, it is possible to realize a manufacturing method for an optical component which is capable of uniformly forming a silicon oxide film on a semi-transmissive reflecting surface which is largely inclined (or nearly vertical) with respect to a substrate surface, and an optical component produced by this method.
摘要翻译：一种透光性光学部件的制造方法，包括通过对板状部件的硅区域进行蚀刻来形成凹部的第一蚀刻工序，通过热氧化内侧形成氧化硅膜的热氧化工序凹部的表面，以及形成覆盖氧化硅膜的氮化硅膜的氮化膜形成工序。因此，可以实现能够在相对于基板表面大倾斜（或接近垂直）的半透射反射面上均匀地形成氧化硅膜的光学部件的制造方法，通过该方法生产的成分。

8. 发明授权

US08411269B2 Spectroscopic module 有权
公开(公告)号：US08411269B2
公开(公告)日：2013-04-02
申请号：US13545445
申请日：2012-07-10
申请人： Katsumi Shibayama , Helmut Teichmann , Tomofumi Suzuki , Dietmar Hiller , Ulrich Starker
发明人： Katsumi Shibayama , Helmut Teichmann , Tomofumi Suzuki , Dietmar Hiller , Ulrich Starker
IPC分类号： G01J3/28
CPC分类号： G01J3/02 , G01J3/0202 , G01J3/0243 , G01J3/0259 , G01J3/0262 , G01J3/0291 , G01J3/04 , G01J3/2803
摘要： In the spectroscopy module 1, a light detecting element 4 is provided with a light passing opening 4b through which light made incident into a body portion 2 passes. Therefore, it is possible to prevent deviation of the relative positional relationship between the light passing opening 4b and a light detection portion 4a of the light detecting element 4. Further, an optical element 7, which guides light made incident into the body portion 2, is arranged at the light passing opening 4b. Therefore, light, which is to be made incident into the body portion 2, is not partially blocked at a light incident edge portion of the light passing opening 4b, but light, which is to be made incident into the body portion 2, can be guided securely. Therefore, according to the spectroscopy module 1, it is possible to improve the reliability.

9. 发明授权

US08068223B2 Spectroscopic module 有权
标题翻译：光谱模块
公开(公告)号：US08068223B2
公开(公告)日：2011-11-29
申请号：US12377350
申请日：2008-06-05
申请人： Tomofumi Suzuki , Katsumi Shibayama , Takashi Iida , Takafumi Yokino , Masashi Ito , Helmut Teichmann , Dietmar Hiller , Ulrich Starker
发明人： Tomofumi Suzuki , Katsumi Shibayama , Takashi Iida , Takafumi Yokino , Masashi Ito , Helmut Teichmann , Dietmar Hiller , Ulrich Starker
IPC分类号： G01J3/28
CPC分类号： G01J3/14 , G01J3/02 , G01J3/0256
摘要： The spectroscopy module 1 is provided with a body portion 2 for transmitting light L1, L2, a spectroscopic portion 3 for dispersing light L1 made incident from the front plane 2a of the body portion 2 into the body portion 2 to reflect the light on the front plane 2a, a light detecting element 4 having a light detecting portion 41 for detecting the light L2 dispersed and reflected by the spectroscopic portion 3 and electrically connected to a wiring 9 formed on the front plane 2a of the body portion 2 by face-down bonding, and an underfill material 12 filled in the body portion 2 side of the light detecting element 4 to transmit the light L1, L2. The light detecting element 4 is provided with a light-passing hole 42 through which the light L1 advancing into the spectroscopic portion 3 passes, and a light incident opening 42a of the light-passing hole 42 is partially covered by a light transmitting plate 16.
摘要翻译：光谱分析模块1设置有用于透射光L1，L2的主体部分2，用于将从主体部分2的前面平面2a入射的光L1分散到主体部分2中以将光反射到前面的光谱部分3 平面2a，光检测元件4，具有光检测部分41，用于检测由分光部分3分散和反射的光L2，并通过面朝下的接合电连接到形成在主体部分2的前平面2a上的布线9; 以及填充在光检测元件4的主体部分2侧的底部填充材料12以透射光L1，L2。光检测元件4设置有通向分光部3的光L1通过的通光孔42，透光孔42的光入射开口42a被透光板16部分地覆盖。

10. 发明授权

US08031336B2 Spectroscope 有权
标题翻译：光谱仪
公开(公告)号：US08031336B2
公开(公告)日：2011-10-04
申请号：US12377309
申请日：2008-06-05
申请人： Katsumi Shibayama , Tomofumi Suzuki , Masashi Ito
发明人： Katsumi Shibayama , Tomofumi Suzuki , Masashi Ito
IPC分类号： G01J3/02 , G01J3/18
CPC分类号： G01J3/02 , G01J3/0208 , G01J3/0218 , G01J3/0259 , G01J3/0291
摘要： The spectrometer 1 is provided with a package 2 in which a light guiding portion 7 is provided, a spectroscopic module 3 accommodated inside the package 2, and a support member 29 arranged on an inner wall plane of the package 2 to support the spectroscopic module 3. The spectroscopic module 3 is provided with a body portion 11 for transmitting light made incident from the light guiding portion 7 and a spectroscopic portion 13 for dispersing light passed through the body portion 11 on a predetermined plane of the body portion 11, and the spectroscopic portion 13 is supported by the support member 29 on the predetermined plane in a state of being spaced away from the inner wall plane.
摘要翻译：光谱仪1设置有其中设置有导光部7的封装2，容纳在封装2内部的分光模块3和布置在封装2的内壁面上以支撑光谱模块3的支撑构件29 分光模块3设置有用于透射从导光部7入射的光的主体部11和用于将通过主体部11的光分散在主体部11的预定平面上的分光部13，部分13在与内壁平面间隔开的状态下由支撑构件29支撑在预定平面上。

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