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1. 发明授权

US5074683A Fiber optic faceplates and method of mounting same 失效
标题翻译：光纤面板及其安装方法
公开(公告)号：US5074683A
公开(公告)日：1991-12-24
申请号：US610625
申请日：1990-11-08
申请人： Terry Tarn , Edward Carnall, Jr. , David N. Bull
发明人： Terry Tarn , Edward Carnall, Jr. , David N. Bull
IPC分类号： G02B6/08
CPC分类号： G02B6/08
摘要： Method and apparatus are disclosed for mounting a second optical component on a first optical component using a spacer layer for forming a controlled gap between the two components. In a preferred embodiment, a CCD sensor is formed having a non-active area and an active area for detecting lightwaves. A spacer layer of an epoxy or similar material is formed on at least a portion of the non-active area of the sensor. A fiber optic faceplate is mounted on the spacer layer to form the controlled gap between the active area of the CCD sensor and the faceplate. The fiber optic faceplate has a predetermined index of refraction for passing lightwaves towards the active area of the sensor. A coupling compound, having an index of refraction which substantially matches that of the faceplate, is used to fill the controlled gap between the faceplate and the active area of the sensor.
摘要翻译：公开了用于使用间隔层在第一光学部件上安装第二光学部件以形成两个部件之间的受控间隙的方法和装置。在优选实施例中，形成具有非有效区域和用于检测光波的有效区域的CCD传感器。在传感器的非有源区域的至少一部分上形成环氧树脂或类似材料的间隔层。光纤面板安装在间隔层上，以形成CCD传感器的有效区域与面板之间的受控间隙。光纤面板具有用于将光波传递到传感器的有源区域的预定折射率。使用具有与面板的折射率基本匹配的折射率的耦合化合物来填充面板和传感器的有效区域之间的受控间隙。

2. 发明授权

US5149935A Method and apparatus for forming amalgam preform 失效
标题翻译：用于形成AMALGAM预混物的方法和装置
公开(公告)号：US5149935A
公开(公告)日：1992-09-22
申请号：US594806
申请日：1990-10-09
申请人： Edward J. Ozimek , Edward Carnall, Jr. , David N. Bull
发明人： Edward J. Ozimek , Edward Carnall, Jr. , David N. Bull
IPC分类号： B21D37/01 , B23K35/02 , B23K35/26 , B23K35/40 , C23C26/02
CPC分类号： B23K35/0222 , B23K35/26 , C23C26/02
摘要： A method and apparatus for forming a solid preform body of an amalgam from a thin layer of the amalgam comprises a base plate on which the amalgam in liquid form is spread into a thin layer. The amalgam comprises a mixture of a liquid metal and a powdered metal. A first temperature is applied to the amalgam layer through the base plate. The first temperature may be lower than the melting temperature of the liquid metal in the amalgam to form a frozen solid layer of the amalgam, or may be above the melting temperature of the liquid metal to maintain the amalgam layer in liquid form. A second temperature is applied to a portion of the amalgam layer which is to form the preform body. If the first temperature is below the melting temperature of the liquid metal, the second temperature is above the melting temperature of the liquid metal to form a molten zone in the amalgam layer along the edge of the preform body so as to permit the body to be separated from the remaining portion of the amalgam layer. If the first temperature is above the melting temperature of the liquid metal, the second temperature is below the melting temperature so as to form a frozen solid portion in the amalgam layer which can be removed from the amalgam layer.
摘要翻译：用于从汞齐的薄层形成汞齐的固体预成型体的方法和装置包括底板，液体形式的汞齐在该基板上分散成薄层。汞齐包括液态金属和粉末金属的混合物。第一温度通过基板施加到汞合金层。第一个温度可能低于汞齐中的液态金属的熔融温度，以形成汞齐的冷冻固体层，或者可能高于液态金属的熔融温度，以将汞齐层保持为液态。将第二温度施加到将形成预成型体主体的汞齐层的一部分。如果第一温度低于液态金属的熔融温度，则第二温度高于液态金属的熔融温度，以沿着预成型体的边缘在汞齐层中形成熔融区，从而允许机体为与汞齐层的剩余部分分离。如果第一温度高于液态金属的熔融温度，则第二温度低于熔融温度，从而在汞齐层中形成可从汞齐层除去的冷冻固体部分。

3. 发明授权

US5192835A Bonding of solid state device to terminal board 失效
标题翻译：将固态装置连接到终端板
公开(公告)号：US5192835A
公开(公告)日：1993-03-09
申请号：US594786
申请日：1990-10-09
申请人： David N. Bull , Edward J. Ozimek , Terry Tarn
发明人： David N. Bull , Edward J. Ozimek , Terry Tarn
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/81 , H01L23/48 , H01L2224/81801 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： The present invention relates to a solid state assembly having a solid state device bonded to a terminal board of an insulating material having a plurality of metal terminal pads thereon and arranged in a pattern. A metal bump is on each of the terminal pads of the terminal plate with an amalgam layer covering at least a top of each bump. The solid state device has a plurality of metal terminal pads thereon. The solid state device is mounted on the terminal board with each of its terminal pads being seated on the amalgam of each bump on the terminal board. The assembly is formed by placing some amalgam on each of the bumps on the terminal plate. The solid state device is then mounted on the terminal plate and the amalgam is hardened, such as by heating at a low temperature, to bond the amalgam to the bumps and the solid state device terminal plates. Once the device is bonded to the terminal board, the temperature the assembly is subject to can be higher than the temperature used for the bonding operation without causing any harm to the bond.
摘要翻译：本发明涉及一种具有固态器件的固态组件，该固态器件与绝缘材料的端子板接合并具有多个金属端子焊盘并且以图案布置。金属凸块位于端子板的每个端子焊盘上，其中汞齐层覆盖每个凸块的至少顶部。固态器件在其上具有多个金属端子焊盘。固态器件安装在端子板上，其每个端子焊盘位于端子板上每个凸点的汞齐上。通过在端子板上的每个凸块上放置一些汞齐来形成组件。然后将固态装置安装在端子板上，并且汞齐被硬化，例如通过在低温下加热，将汞齐接合到凸块和固态装置端子板。一旦设备结合到端子板上，组件所承受的温度可能高于焊接操作所用的温度，而不会对焊接造成任何损害。

4. 发明授权

US5029418A Sawing method for substrate cutting operations 失效
标题翻译：锯切方法用于基板切割操作
公开(公告)号：US5029418A
公开(公告)日：1991-07-09
申请号：US488178
申请日：1990-03-05
申请人： David N. Bull
发明人： David N. Bull
IPC分类号： B25B11/00 , B28D5/00
CPC分类号： B25B11/005 , B28D5/0094
摘要： A technique for sawing substrates on a chuck wherein the substrate is secured to a layer of a first sawing tape, and is placed on the major surface of a chuck with a second tape therebetween. The second tape comprises both a first major surface with a low surface tension effect that is in contact with the major surface of the chuck, and a multitude of perforations or pinholes therein. Vacuum is applied to both the channels in the major surface of the chuck and the pinholes in the second tape, to securely hole the substrate to the chuck during the sawing of the substrate. When the sawing is completed, the vacuum is removed and either atmospheric pressure or pressurized air is applied to the channels of the chuck, and the combination of the substrate, first sawing tape and second tape are easily removable because of the low surface tension effect of the first major surface of the second tape with the major surface of the chuck.
摘要翻译：一种用于在卡盘上锯切基板的技术，其中将基板固定到第一锯齿带的层上，并且将其放置在卡盘的主表面上，其间具有第二带。第二带包括具有与卡盘的主表面接触的低表面张力效应的第一主表面和其中的多个穿孔或针孔。在卡盘的主表面的通道和第二带中的针孔上施加真空，在基板的锯切过程中将基板牢固地固定到卡盘上。当锯切完成时，去除真空并且大气压力或加压空气被施加到卡盘的通道，并且由于低的表面张力效应，基板，第一锯切带和第二带的组合容易地移除具有卡盘主表面的第二带的第一主表面。

5. 发明授权

US4941255A Method for precision multichip assembly 失效
标题翻译：精密多芯片组装方法
公开(公告)号：US4941255A
公开(公告)日：1990-07-17
申请号：US437145
申请日：1989-11-15
申请人： David N. Bull
发明人： David N. Bull
IPC分类号： H01L21/68 , H01L21/98 , H01L23/544 , H05K13/04
CPC分类号： H01L21/6835 , H01L23/544 , H01L25/50 , H05K13/046 , H01L2221/68354 , H01L2221/68368 , H01L2223/54473 , H01L2224/16 , H01L2924/01014 , H01L2924/12041 , Y10T29/49131 , Y10T29/49144 , Y10T29/49769 , Y10T29/53178
摘要： A plurality of semiconductor chips are first attached to a transparent mask by placing indica marks on the mask and then viewing the chips through the mask and aligning them to the indica marks. The chips, which are held on a vacuum pedestal, are then brought into contact with the mask and a temporary adhesive layer holds the chips to the mask. The vacuum is then released. The mask with the chips attached thereto is then aligned to a printed circuit (wiring) board having indica marks thereon by viewing through the mask and moving the chips and printed circuit board together until they contact each other. A permanent adhesive layer holds the chips to the printed circuit board. The temporary adhesive layer is then dissolved and removed from the chips.
摘要翻译：多个半导体芯片首先通过在掩模上放置烙印而附着到透明掩模，然后通过掩模观察芯片并将它们对准烙印。然后将保持在真空底座上的碎屑与掩模接触，并且临时粘合剂层将芯片保持在掩模上。然后释放真空。然后将附着有芯片的掩模与通过掩模进行观察而在其上具有指示标记的印刷电路板（布线）板对准，并将芯片和印刷电路板一起移动直到它们彼此接触。永久性粘合剂层将芯片保持在印刷电路板上。然后将临时粘合剂层从芯片中溶解并除去。

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