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1. 发明授权

US5270491A Hermetically sealed microelectronic package 失效
标题翻译：密封微电子封装
公开(公告)号：US5270491A
公开(公告)日：1993-12-14
申请号：US594789
申请日：1990-10-09
申请人： Edward Carnall, Jr. , Edward J. Ozimek
发明人： Edward Carnall, Jr. , Edward J. Ozimek
IPC分类号： H01L23/10 , H01L23/02
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701
摘要： A hermetically sealed package for a microelectronic device, such as a solid-state image sensor, includes a ceramic housing defining a cavity in a major surface thereof and metal terminals extending through side edges thereof to the cavity. A microelectronic device is in the cavity and electrically connected to the terminals. A cover plate extends over the cavity and over a portion of the major surface around the cavity. An amalgam of a mixture of a liquid metal and a powdered metal is between the cover plate and the housing surface. The amalgam bonds the cover plate to the housing and forms a hermetical seal therebetween.
摘要翻译：用于微电子器件（例如固态图像传感器）的密封封装包括限定其主表面中的空腔的陶瓷壳体和延伸穿过其空腔的侧边缘的金属端子。微电子器件在腔中并电连接到端子。盖板在空腔上方延伸并且围绕空腔在主表面的一部分上方延伸。液体金属和粉末金属的混合物的汞齐在盖板和壳体表面之间。汞齐将盖板连接到壳体并在其间形成密封。

2. 发明授权

US5189010A Process for preparing superconductive thick films 失效
标题翻译：制备超导厚膜的工艺
公开(公告)号：US5189010A
公开(公告)日：1993-02-23
申请号：US712390
申请日：1991-06-10
申请人： Laurie A. Strom , Edward Carnall,Jr. , Steven A. Ferranti , Jose M. Mir
发明人： Laurie A. Strom , Edward Carnall,Jr. , Steven A. Ferranti , Jose M. Mir
IPC分类号： H01L39/24
CPC分类号： H01L39/2451 , Y10S505/737 , Y10S505/739 , Y10S505/741 , Y10S505/778 , Y10S505/78 , Y10S505/782
摘要： A process of forming on a substrate a coating of a precursor of a crystalline rear earth alkaline earth copper oxide or heavy pnictide mixed alkaline earth copper oxide electrical conductor and converting the precursor to the crystalline electrical conductor. The coating precursor is provided by (a) preparing a solution comprised of a volatilizable solvent and, as a solute, metal-ligand compounds of each of the metals forming the crystalline electrical conductor, the proportions of the solute metals corresponding to those present in the precursor coating and the ligands being inorganic ligands chosen to be volatilizable on heating, (b) spraying the aqueous solution to form discrete liquid particles each containing the metals as metal-ligand compounds in proportions corresponding to those present in the precursor coating, (c) evaporating at least a portion of the volatilizable solvent from the liquid particles to form solid particles each containing the metals as metal-ligand compounds in proportions corresponding to those present in the precursor coating. The solid particles can be formulated as a screen printing composition to facilitate coating on the substrate.
摘要翻译：在基底上形成结晶后碱土碱土铜氧化物或重磷酸盐混合碱土金属氧化铜电导体的前体的涂层并将前体转化为结晶电导体的工艺。涂层前体是通过（a）制备由可挥发溶剂构成的溶液，并且作为溶质，形成形成结晶电导体的每种金属的金属 - 配体化合物，溶解金属的比例对应于存在于（b）喷雾水溶液以形成离子液体颗粒，每个液体颗粒含有金属作为金属配体化合物，其比例与前体涂层中存在的比例相对应，（c）前体涂层，配体是无机配体，其选择在加热时可挥发，（c）从液体颗粒中蒸发出至少一部分可挥发溶剂，形成各自含有金属作为金属 - 配体化合物的固体颗粒，其比例与前体涂层中存在的比例相对应。固体颗粒可以配制成丝网印刷组合物以便于在基材上涂布。

3. 发明授权

US5087607A Process for preparing superconductive thick films 失效
标题翻译：制备超导厚膜的工艺
公开(公告)号：US5087607A
公开(公告)日：1992-02-11
申请号：US556520
申请日：1990-07-20
申请人： Laurie A. Strom , Edward Carnall, Jr. , Steven A. Ferranti , Jose M. Mir
发明人： Laurie A. Strom , Edward Carnall, Jr. , Steven A. Ferranti , Jose M. Mir
IPC分类号： H01L39/24
CPC分类号： H01L39/2451 , Y10S505/737 , Y10S505/741
摘要： A process of forming on a substrate a coating of a precursor of a crystalline rare earth alkaline earth copper oxide or heavy pnictide mixed alkaline earth copper oxide electrical conductor and converting the precursor to the crystalline electrical conductor. The coating precursor is provided by (a) preparing a solution comprised of a volatilizable solvent and, as a solute, metal-ligand compounds of each of the metals forming the crystalline electrical conductor, the proportions of the solute metals corresponding to those present in the precursor coating and the ligands being inorganic ligands chosen to be volatilizable on heating, (b) spraying the aqueous solution to form discrete liquid particles each containing the metals as metal-ligand compounds in proportions corresponding to those present in the precursor coating, (c) evaporating at least a portion of the volatilizable solvent fronm the liquid particles to form solid particles each containing the metals as metal-ligand compounds in proportions corresponding to those present in the precursor coating. The solid particles can be formulated as a screen printing composition to facilitate coating on the substrate.
摘要翻译：在基板上形成结晶稀土类碱土铜氧化物或重金属混合碱土金属氧化铜电导体的前体的涂层并将前体转化为结晶电导体的工艺。涂层前体是通过（a）制备由可挥发溶剂组成的溶液，并且作为溶质，形成形成结晶导电体的每种金属的金属配体化合物，溶解金属的比例对应于存在于（b）喷雾水溶液以形成离子液体颗粒，每个液体颗粒含有金属作为金属配体化合物，其比例与前体涂层中存在的比例相对应，（c）前体涂层，配体是无机配体，其选择在加热时可挥发，（c）蒸发至少一部分可挥发溶剂的液体颗粒，以形成固体颗粒，每个固体颗粒含有金属作为金属配体化合物，其比例与前体涂层中存在的比例相对应。固体颗粒可以配制成丝网印刷组合物以便于在基材上涂布。

4. 发明授权

US5149935A Method and apparatus for forming amalgam preform 失效
标题翻译：用于形成AMALGAM预混物的方法和装置
公开(公告)号：US5149935A
公开(公告)日：1992-09-22
申请号：US594806
申请日：1990-10-09
申请人： Edward J. Ozimek , Edward Carnall, Jr. , David N. Bull
发明人： Edward J. Ozimek , Edward Carnall, Jr. , David N. Bull
IPC分类号： B21D37/01 , B23K35/02 , B23K35/26 , B23K35/40 , C23C26/02
CPC分类号： B23K35/0222 , B23K35/26 , C23C26/02
摘要： A method and apparatus for forming a solid preform body of an amalgam from a thin layer of the amalgam comprises a base plate on which the amalgam in liquid form is spread into a thin layer. The amalgam comprises a mixture of a liquid metal and a powdered metal. A first temperature is applied to the amalgam layer through the base plate. The first temperature may be lower than the melting temperature of the liquid metal in the amalgam to form a frozen solid layer of the amalgam, or may be above the melting temperature of the liquid metal to maintain the amalgam layer in liquid form. A second temperature is applied to a portion of the amalgam layer which is to form the preform body. If the first temperature is below the melting temperature of the liquid metal, the second temperature is above the melting temperature of the liquid metal to form a molten zone in the amalgam layer along the edge of the preform body so as to permit the body to be separated from the remaining portion of the amalgam layer. If the first temperature is above the melting temperature of the liquid metal, the second temperature is below the melting temperature so as to form a frozen solid portion in the amalgam layer which can be removed from the amalgam layer.
摘要翻译：用于从汞齐的薄层形成汞齐的固体预成型体的方法和装置包括底板，液体形式的汞齐在该基板上分散成薄层。汞齐包括液态金属和粉末金属的混合物。第一温度通过基板施加到汞合金层。第一个温度可能低于汞齐中的液态金属的熔融温度，以形成汞齐的冷冻固体层，或者可能高于液态金属的熔融温度，以将汞齐层保持为液态。将第二温度施加到将形成预成型体主体的汞齐层的一部分。如果第一温度低于液态金属的熔融温度，则第二温度高于液态金属的熔融温度，以沿着预成型体的边缘在汞齐层中形成熔融区，从而允许机体为与汞齐层的剩余部分分离。如果第一温度高于液态金属的熔融温度，则第二温度低于熔融温度，从而在汞齐层中形成可从汞齐层除去的冷冻固体部分。

5. 发明授权

US5043139A Amalgam preform, method of forming the preform and method of bonding therewith 失效
标题翻译：汞齐预型件，形成预成型件的方法及其结合方法
公开(公告)号：US5043139A
公开(公告)日：1991-08-27
申请号：US594793
申请日：1990-10-09
申请人： Edward Carnall, Jr. , Edward J. Ozimek
发明人： Edward Carnall, Jr. , Edward J. Ozimek
IPC分类号： B23K35/02 , H01L21/50 , H01L23/10
CPC分类号： H01L21/50 , B23K35/0222 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701
摘要： The present invention relates to a preform of a solid body of an amalgam. The amalgam is a mixture of a metal which is liquid at room temperature and at least one powdered metal. The preform is formed by mixing together the ingredients of the amalgam and pouring the amalgam into a caity in a mold. The mold and amalgam is then cooled to a temperature below the melting temperature of the liquid metal in the amalgam. The preform is then removed from the mold. The preform can be stored at the low temperature until it is desired to use it to bond two bodies together. The preform can be used to bond two bodies together, such as the cover plate and housing of a microelectronic device package, by placing the preform between the two bodies. The bodies are mechanically scrubbed and clamped together with the preform therebetween and heated to a temperature at which the preform melts and the amalgam reacts to bond to the two bodies. Since the liquid metal in the amalgam has a melting temperature slightly above normal room temperature, the bonding can be achieved at relatively low temperatures.
摘要翻译：本发明涉及一种汞齐固体的预制件。汞齐是在室温下为液体的金属和至少一种粉末金属的混合物。通过将汞齐的成分混合在一起并将汞齐倒入模具中形成预制件。然后将模具和汞齐冷却至低于汞合金中液态金属的熔融温度的温度。然后将模具从模具中取出。预制件可以在低温下储存，直到需要使用它将两个主体粘合在一起。预成型件可以通过将预成型件放置在两个主体之间来将两个主体结合在一起，例如微电子器件封装的盖板和外壳。将机体与其间的预制件进行机械擦洗和夹紧在一起，并加热到预成型体熔化的温度，并且汞齐反应结合到两个主体。由于汞齐中的液态金属具有略高于正常室温的熔融温度，所以可以在相对较低的温度下实现粘合。

6. 发明授权

US4189406A Method for hot-pressing photoconductors 失效
标题翻译：热压感光体的方法
公开(公告)号：US4189406A
公开(公告)日：1980-02-19
申请号：US439653
申请日：1974-02-04
申请人： Armin K. Weiss , Edward Carnall, Jr.
发明人： Armin K. Weiss , Edward Carnall, Jr.
IPC分类号： G03G5/082 , G03G5/04
CPC分类号： G03G5/082
摘要： Highly densified, polycrystalline photoconductors can be produced by hot-pressing various materials, such as powdered lead monoxide. The powdered material is subjected to a temperature and pressure for a length of time sufficient to form a photoconductive element having a density of at least 85% and up to and including the theoretical density of the material. Such formed photoconductive element or material can be utilized in electro-photographic applications and, with the exception of such material in its single crystal form, will exhibit increased absorption of activating radiation, increased signal-to-noise ratios, and improved spatial frequency response in comparison with presently known photoconductive elements or materials.
摘要翻译：通过热压多种材料，例如粉状一氧化铅，可以生产高度致密化的多晶感光体。将粉末状材料经受足够长的时间的温度和压力，以形成密度为至少85％且高达并包括材料的理论密度的光电导元件。这种形成的光电导元件或材料可用于电照相应用中，并且除了其单晶形式的这种材料之外，将表现出增加的激活辐射的吸收，增加的信噪比和改善的空间频率响应与目前已知的光电导元件或材料进行比较。

7. 发明授权

US5065245A Modular image sensor array 失效
标题翻译：模块化图像传感器阵列
公开(公告)号：US5065245A
公开(公告)日：1991-11-12
申请号：US516991
申请日：1990-04-30
申请人： Edward Carnall, Jr. , Robert L. Nielsen , Edward J. Ozimek
发明人： Edward Carnall, Jr. , Robert L. Nielsen , Edward J. Ozimek
IPC分类号： H01L27/14 , H01L27/146 , H04N1/028 , H04N1/03
CPC分类号： H04N1/1934 , H01L27/146 , H04N1/03 , H04N2201/02456 , H04N2201/02464
摘要： A modular image sensor array is disclosed which includes a plurality of tiles each of which has an image sensor mounted thereon. The tiles are mounted on a base plate such that the image sensors form a predetermined pattern. In order to precisely locate the tiles relative to each other and to provide for the replacement of defective tiles, the tiles are assembled in an interlocking pattern on the base plate. The top surface of the tiles is formed by ceramic plates, and electrical conductors for the image sensors are formed on one of the ceramic plates. A transparent cover is mounted over all of the image sensors in the array.
摘要翻译：公开了一种模块化图像传感器阵列，其包括多个瓦片，每个瓦片具有安装在其上的图像传感器。瓦片安装在基板上，使得图像传感器形成预定图案。为了相对于彼此精确地定位瓦片并且提供更换有缺陷的瓦片，瓦片以基板上的互锁图案组装。瓷砖的上表面由陶瓷板形成，并且用于图像传感器的电导体形成在陶瓷板之一上。透明盖安装在阵列中的所有图像传感器上。

8. 发明授权

US4908346A Crystalline rare earth alkaline earth copper oxide thick film circuit element with superconducting onset transition temperature in excess of 77% 失效
标题翻译：超导起始转变温度超过77％的结晶稀土碱土铜氧化物厚膜电路元件
公开(公告)号：US4908346A
公开(公告)日：1990-03-13
申请号：US68391
申请日：1987-07-01
申请人： Lauri A. Strom , Edward Carnall, Jr. , Steven A. Ferranti , Jose M. Mir
发明人： Lauri A. Strom , Edward Carnall, Jr. , Steven A. Ferranti , Jose M. Mir
IPC分类号： C01G1/00 , C01G3/00 , H01B12/06 , H01B13/00 , H01L39/24
CPC分类号： H01L39/2429 , H01L39/2425 , H01L39/2454 , H01L39/2458 , H01L39/2474 , Y10S428/901 , Y10S428/93 , Y10T428/24917 , Y10T428/263
摘要： Thick film circuit elements are disclosed comprised of an insulative substrate selected from the group consisting of strontium titanate, magnesia, alumina, and aluminum nitride, and providing a conductive path between at least two locations on the substrate, a crystalline rare earth alkaline earth copper oxide layer exhibiting a superconducting onset transition temperature in excess of 77.degree. C. comprised on an R.sub.1 A.sub.2 C.sub.3 crystalline phase.

9. 发明授权

US5074683A Fiber optic faceplates and method of mounting same 失效
标题翻译：光纤面板及其安装方法
公开(公告)号：US5074683A
公开(公告)日：1991-12-24
申请号：US610625
申请日：1990-11-08
申请人： Terry Tarn , Edward Carnall, Jr. , David N. Bull
发明人： Terry Tarn , Edward Carnall, Jr. , David N. Bull
IPC分类号： G02B6/08
CPC分类号： G02B6/08
摘要： Method and apparatus are disclosed for mounting a second optical component on a first optical component using a spacer layer for forming a controlled gap between the two components. In a preferred embodiment, a CCD sensor is formed having a non-active area and an active area for detecting lightwaves. A spacer layer of an epoxy or similar material is formed on at least a portion of the non-active area of the sensor. A fiber optic faceplate is mounted on the spacer layer to form the controlled gap between the active area of the CCD sensor and the faceplate. The fiber optic faceplate has a predetermined index of refraction for passing lightwaves towards the active area of the sensor. A coupling compound, having an index of refraction which substantially matches that of the faceplate, is used to fill the controlled gap between the faceplate and the active area of the sensor.
摘要翻译：公开了用于使用间隔层在第一光学部件上安装第二光学部件以形成两个部件之间的受控间隙的方法和装置。在优选实施例中，形成具有非有效区域和用于检测光波的有效区域的CCD传感器。在传感器的非有源区域的至少一部分上形成环氧树脂或类似材料的间隔层。光纤面板安装在间隔层上，以形成CCD传感器的有效区域与面板之间的受控间隙。光纤面板具有用于将光波传递到传感器的有源区域的预定折射率。使用具有与面板的折射率基本匹配的折射率的耦合化合物来填充面板和传感器的有效区域之间的受控间隙。

10. 发明授权

US4895291A Method of making a hermetic seal in a solid-state device 失效
标题翻译：在固态装置中进行气密密封的方法
公开(公告)号：US4895291A
公开(公告)日：1990-01-23
申请号：US347091
申请日：1989-05-04
申请人： Edward J. Ozimek , Edward Carnall, Jr.
发明人： Edward J. Ozimek , Edward Carnall, Jr.
IPC分类号： B23K1/19 , B23K35/00 , H01L21/50 , H01L23/10
CPC分类号： B23K1/19 , B23K35/001 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079
摘要： A method of making a hermetic seal for a solid-state device is disclosed. The device includes a ceramic housing having a cavity for an element such as an image sensor. A cover formed of a transparent material is sealed to the housing to close the cavity. A metallization support is formed on the cover and on the housing. In order to form a hermetic seal at a relative low temperature, a layer of indium is coated on the metallization support of either the cover or the housing, and a layer of tin is coated on the support of the other of the two parts. The cover is then placed on the housing, and the parts are placed in a furnace where a temperature under the melting temperature of the composite alloy of tin and indium is maintained for a period long enough to diffuse the tin and indium together. The temperature is then raised to a temperature sufficient to melt the alloy, and the device is then slowly cooled to ambient temperature.
摘要翻译：公开了一种制造用于固态器件的气密密封的方法。该装置包括具有用于诸如图像传感器的元件的空腔的陶瓷壳体。由透明材料形成的盖子密封到壳体以封闭空腔。在盖和壳体上形成金属化支撑。为了在相对较低的温度下形成气密密封，将铟层涂覆在盖或壳体的金属化载体上，并且一层锡涂覆在两个部分中另一个的支撑体上。然后将盖子放置在壳体上，并且将部件放置在炉中，其中锡和铟的复合合金的熔融温度下的温度保持足够长的时间以将锡和铟扩散到一起。然后将温度升至足以熔化合金的温度，然后将该装置缓慢冷却至环境温度。

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