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1. 发明授权

US06203862B1 Processing systems with dual ion sources 失效
标题翻译：具有双离子源的加工系统
公开(公告)号：US06203862B1
公开(公告)日：2001-03-20
申请号：US09076971
申请日：1998-08-07
申请人： Terry Bluck , James H. Rogers , Sean P. McGinnis
发明人： Terry Bluck , James H. Rogers , Sean P. McGinnis
IPC分类号： H05H100
CPC分类号： C23C16/513 , C23C16/26 , H01J37/3178 , H01J2237/08 , H01J2237/0822 , H01J2237/3142
摘要： A substrate processing system includes a processing chamber, a substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, first and second ion sources located in the chamber, and a power source for energizing the first and second ion sources. Each ion source ionizes the process gas to produce ions for processing a substrate disposed on the substrate holder. The first and second ion sources include first and second anodes, respectively. The power source energizes the first and second anodes in a time multiplexed manner, such that only one of the first and second ion sources is energized at any time and interactions between ion sources are eliminated.
摘要翻译：基板处理系统包括处理室，位于室中的基板保持器，用于向室提供处理气体的气体源，位于室中的第一和第二离子源，以及用于激励第一和第二离子的电源来源。每个离子源使工艺气体离子化以产生用于处理设置在衬底保持器上的衬底的离子。第一和第二离子源分别包括第一和第二阳极。电源以时间复用的方式激励第一和第二阳极，使得第一和第二离子源中的仅一个在任何时间被激励，并且消除了离子源之间的相互作用。

2. 发明授权

US06228429B1 Methods and apparatus for processing insulating substrates 有权
标题翻译：用于处理绝缘基板的方法和装置
公开(公告)号：US06228429B1
公开(公告)日：2001-05-08
申请号：US09495545
申请日：2000-02-01
申请人： Terry Bluck , James H. Rogers , Jun Xie , Eric C. Lawson
发明人： Terry Bluck , James H. Rogers , Jun Xie , Eric C. Lawson
IPC分类号： B05D140
CPC分类号： C23C14/345 , B05D3/145 , C23C14/50 , C23C14/568 , G11B5/8404
摘要： A disk gripper for gripping an insulating disk, such as a glass disk, at its edge during processing includes a contact device for contacting the edge of the insulating disk and a mechanism for moving the contact device between a contact position, in contact with the edge of the disk, and a retracted position. In a first processing station, a conductive coating is applied to a disk held by the gripper, with the contact device in the retracted position. In a second processing station, ions are generated in a plasma adjacent to the surface of the disk held by the gripper. The contact device is in the contact position in contact with the conductive coating, and a bias voltage is applied to the contact device in the second processing station. The ions are accelerated from the plasma toward the disk by the bias voltage applied to the conductive coating.
摘要翻译：用于在加工过程中在其边缘处夹持诸如玻璃盘的绝缘盘的盘夹持器包括用于接触绝缘盘的边缘的接触装置和用于使接触装置在与边缘接触的接触位置之间移动的机构的缩回位置。在第一处理站中，将导电涂层施加到由夹持器保持的盘上，其中接触装置处于缩回位置。在第二处理站中，在由夹持器保持的盘的表面附近的等离子体中产生离子。接触装置处于与导电涂层接触的接触位置，并且偏压被施加到第二处理站中的接触装置。通过施加到导电涂层的偏置电压将离子从等离子体加速到盘。

3. 发明授权

US06368678B1 Plasma processing system and method 有权
标题翻译：等离子体处理系统及方法
公开(公告)号：US06368678B1
公开(公告)日：2002-04-09
申请号：US09495548
申请日：2000-02-01
申请人： Terry Bluck , James H. Rogers
发明人： Terry Bluck , James H. Rogers
IPC分类号： H05H124
CPC分类号： H01J37/32009 , C23C16/26 , C23C16/50 , C23C16/513 , H01J37/3178 , H01J37/3233 , H01J2237/08 , H01J2237/0822 , H01J2237/3142
摘要： A substrate processing system includes a processing chamber, an electrically floating substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, at least one ion source located in the chamber, and a power source for energizing the ion source by positively biasing the anode and negatively biasing the cathode in a train of pulses of selectably variable duty cycle and magnitude to maintain a selected time averaged current, the bias in each instance being relative to the chamber. The ion source ionizes the process gas producing ions for processing a substrate disposed on the floating substrate holder in the chamber. The floating substrate is biased in accord with the net charge thereon as controlled by the energetic electron flux. One embodiment includes two such ion sources. In this case, the power source energizes the first and second anodes and the cathodes in a time multiplexed manner, such that only one of the first or second ion sources is energized at any time and interactions between ion sources are eliminated.
摘要翻译：基板处理系统包括处理室，定位在室中的电浮置基板保持器，用于向室提供处理气体的气体源，位于室中的至少一个离子源，以及用于激励离子源的电源通过积极偏置阳极并且以可选择的可变占空比和幅度的脉冲序列负偏置阴极以保持所选择的时间平均电流，每种情况下的偏压相对于室。离子源离子化产生离子的工艺气体，以处理设置在腔室中的浮动衬底保持器上的衬底。浮动衬底在其上由与能量电子通量控制的净电荷相一致地被偏置。一个实施例包括两个这样的离子源。在这种情况下，电源以时间复用的方式激励第一和第二阳极和阴极，使得在任何时间仅使第一或第二离子源中的仅一个被激励，并且消除离子源之间的相互作用。

4. 发明授权

US6101972A Plasma processing system and method 有权
标题翻译：等离子体处理系统及方法
公开(公告)号：US6101972A
公开(公告)日：2000-08-15
申请号：US235943
申请日：1999-01-22
申请人： Terry Bluck , James H. Rogers , Jun Xie
发明人： Terry Bluck , James H. Rogers , Jun Xie
IPC分类号： H05H1/46 , B01J19/08 , B05C21/00 , C23C16/26 , C23C16/27 , C23C16/44 , C23C16/50 , C23C16/513 , G11B5/84 , H01J37/317 , H05H1/00
CPC分类号： H01J37/3178 , C23C16/26 , C23C16/513 , H01J2237/08 , H01J2237/0822 , H01J2237/3142
摘要： A substrate processing system includes a processing chamber, a substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, at least one ion source located in the chamber, and a power source for energizing the ion source by positively biasing the anode and negatively biasing the cathode, the bias in each instance being relative to the chamber. The ion source ionizes the process gas producing ions for processing a substrate disposed on a substrate holder in the chamber. One embodiment includes two such ion sources. In this case, the power source energizes the first and second anodes and the cathodes in a time multiplexed manner, such that only one of the first or second ion sources is energized at any time and interactions between ion sources are eliminated.
摘要翻译：基板处理系统包括处理室，位于所述室中的基板保持器，用于向所述室提供处理气体的气体源，位于所述室中的至少一个离子源，以及用于通过正向激励所述离子源的电源偏置阳极并负偏压阴极，每种情况下的偏压相对于室。离子源电离产生离子的工艺气体，以处理设置在腔室中的衬底保持器上的衬底。一个实施例包括两个这样的离子源。在这种情况下，电源以时间复用的方式激励第一和第二阳极和阴极，使得在任何时间仅使第一或第二离子源中的仅一个被激励，并且消除离子源之间的相互作用。

5. 发明授权

US09524896B2 Apparatus and methods for transporting and processing substrates 有权
标题翻译：用于运输和处理基板的装置和方法
公开(公告)号：US09524896B2
公开(公告)日：2016-12-20
申请号：US12368241
申请日：2009-02-09
申请人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
发明人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
IPC分类号： H01L21/677 , C23C14/56 , C23C16/54 , H01L21/67
CPC分类号： H01L21/67745 , C23C14/568 , C23C16/54 , C23C16/545 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67709
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers.
摘要翻译：描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。线性传送室包括线性轨道和机器人手臂，该线性轨道和机器人臂骑在线性轨道上，以沿着处理室的侧面线性地传送衬底，用于通过负载锁定将衬底馈送到受控气氛中，然后沿着运送室作为到达处理室的方式。

6. 发明授权

US08419341B2 Linear vacuum robot with Z motion and articulated arm 有权
标题翻译：具有Z形运动和铰接臂的线性真空机器人
公开(公告)号：US08419341B2
公开(公告)日：2013-04-16
申请号：US12875414
申请日：2010-09-03
申请人： Gee Sun Hoey , Terry Bluck , Hoang Huy Vu , Jimin Ryu
发明人： Gee Sun Hoey , Terry Bluck , Hoang Huy Vu , Jimin Ryu
IPC分类号： B65G1/133 , C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01L21/677 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67742 , H01L21/67745 , Y10T74/20317 , Y10T74/20323
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers. A four-axis robot arm is disclosed, capable of linear translation, rotation and articulation, and z-motion.
摘要翻译：描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。线性传送室包括线性轨道和机器人手臂，该线性轨道和机器人臂骑在线性轨道上，以沿着处理室的侧面线性地传送衬底，用于通过负载锁定将衬底馈送到受控气氛中，然后沿着运送室作为到达处理室的方式。公开了能够进行线性平移，旋转和关节运动以及z运动的四轴机器人臂。

7. 发明申请

US20120291955A1 LARGE AREA ICP SOURCE FOR PLASMA APPLICATION 审中-公开
标题翻译：用于等离子体应用的大面积ICP源
公开(公告)号：US20120291955A1
公开(公告)日：2012-11-22
申请号：US13473541
申请日：2012-05-16
申请人： Young Kyu Cho , Terry Bluck , Karthik Janakiraman
发明人： Young Kyu Cho , Terry Bluck , Karthik Janakiraman
IPC分类号： H01L21/3065
CPC分类号： H01J37/321 , H01J37/3211 , H01J37/32119 , H01J37/32522
摘要： An arrangement for coupling RF energy for inductively coupled plasma chamber. The RF coil or radiator is embedded within a groove made in the ceiling of the chamber and an insulating filler covers the coil within the groove. The ceiling may be made of two plates: an upper plate made of conductive material and a bottom plate made of dielectric material. The two plates are in physical contact. A magnetic shield may be provided over the coil to control the spread of the magnetic field from the coil. Fluid channels may be made in the conductive plate to provide thermal control. Also, fluid conduits may be provided to allow injecting gas into the pace between the metal and dielectric plates.
摘要翻译：用于耦合感应耦合等离子体室的RF能量的装置。 RF线圈或散热器嵌入在室的天花板内形成的凹槽中，绝缘填料覆盖槽内的线圈。天花板可以由两块板制成：由导电材料制成的上板和由电介质材料制成的底板。两块板材物理接触。可以在线圈上提供磁屏蔽来控制来自线圈的磁场的扩展。可以在导电板中制造流体通道以提供热控制。而且，可以提供流体管道以允许将气体注入金属和电介质板之间的步调。

8. 发明授权

US08303764B2 Apparatus and methods for transporting and processing substrates 有权
公开(公告)号：US08303764B2
公开(公告)日：2012-11-06
申请号：US13042407
申请日：2011-03-07
申请人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
发明人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
IPC分类号： C23F1/00 , H01L21/306 , H01L21/677 , C23C16/00 , C23C14/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67196 , H01L21/67201 , H01L21/67745
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.

9. 发明授权

US08206551B2 Processing thin wafers 有权
标题翻译：加工薄晶圆
公开(公告)号：US08206551B2
公开(公告)日：2012-06-26
申请号：US12485808
申请日：2009-06-16
申请人： Terry Bluck , Stuart Scollay , Edric Tong
发明人： Terry Bluck , Stuart Scollay , Edric Tong
IPC分类号： C23C16/00 , C23F1/00
CPC分类号： H01L21/67751 , H01L21/67161 , H01L21/67173 , H01L21/6719 , H01L21/67201 , H01L21/67745 , H01L21/6831 , Y10S414/135 , Y10S414/136 , Y10S414/139 , Y10S414/141
摘要： There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.
摘要翻译：描述了在处理过程中容易破碎的薄化晶片的晶片处理系统。该系统在处理过程中防止破损，并在加工过程中提供温度控制。

10. 发明申请

US20090324369A1 SYSTEM AND METHOD FOR SUBSTRATE TRANSPORT 有权
标题翻译：基板运输系统及方法
公开(公告)号：US20090324369A1
公开(公告)日：2009-12-31
申请号：US12495740
申请日：2009-06-30
申请人： Stuart SCOLLAY , Terry Bluck , Xiang Chen
发明人： Stuart SCOLLAY , Terry Bluck , Xiang Chen
IPC分类号： H01L21/677
CPC分类号： H01L21/67173 , H01L21/67313 , H01L21/67775 , H01L21/67781 , Y10S414/14
摘要： Introduction of substrates into vacuum environment is accomplish by gradually reducing the number of substrates being transferred simultaneously as the clean and evacuated environment is progressed. Cassettes are maintained in clean atmospheric environment and do not enter the vacuum environment. Several vacuum locks are linearly staggered so as to introduce progressively higher level of vacuum environment. The number of substrates transported through this arrangement is a portion of the number of substrates present in each cassette. The staggered vacuum locks lead to a series of processing chambers, wherein a yet smaller number of substrates, e.g., one or two, are transported.
摘要翻译：将衬底引入真空环境中，通过在清洁和抽空的环境进行时，逐渐减少同时转移的衬底数量来实现。纸盒保持在清洁的大气环境中，不要进入真空环境。几个真空锁线性交错，以便逐渐引入更高水平的真空环境。通过该布置传送的基板的数量是每个盒中存在的基板数量的一部分。交错的真空锁导致一系列的处理室，其中传输了更少数量的基板，例如一个或两个。

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