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1. 发明专利

JP2006229077A Ceramic electronic part 有权
标题翻译：陶瓷电子部件
公开(公告)号：JP2006229077A
公开(公告)日：2006-08-31
申请号：JP2005042940
申请日：2005-02-18
申请人： Tdk Corp , Tdk株式会社
发明人： YOSHII AKITOSHI , ABIKO TAISUKE , TAKEDA ATSUSHI , OTSUKI SHIRO , ONODERA SHINYA , KIMURA YOSHINORI , KIKUCHI HIROMI
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/2325
摘要： PROBLEM TO BE SOLVED: To provide a ceramic electronic part capable of reducing a cost while being capable of inhibiting the increase of an electric resistance as preventing the generation of a crack due to a thermal shock.
SOLUTION: A laminated capacitor C1 has a ceramic sintered body 10, internal electrodes 20 formed in the ceramic sintered body 10 and external electrodes 30. The external electrode 30 has a first electrode layer 40, a second electrode layer 42, a conductive resin layer 44, a third electrode layer 46, and a fourth electrode layer 48. The internal electrode 20 and the first electrode layer 40 mainly comprises a base metal. The second electrode layer 42 mainly comprises a precious metal. The conductive resin electrode layer 44 contains the precious metal. The third electrode layer 46 mainly comprises Ni. The fourth electrode layer 48 mainly comprises Sn or an Sn alloy.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够降低成本的陶瓷电子部件，同时能够抑制由于热冲击而产生裂缝的电阻的增加。解决方案：层压电容器C1具有陶瓷烧结体10，形成在陶瓷烧结体10中的内部电极20和外部电极30.外部电极30具有第一电极层40，第二电极层42，导电性树脂层44，第三电极层46和第四电极层48.内部电极20和第一电极层40主要包括贱金属。第二电极层42主要由贵金属构成。导电树脂电极层44含有贵金属。第三电极层46主要包括Ni。第四电极层48主要包括Sn或Sn合金。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005108966A Mounting method of electronic component 审中-公开
标题翻译：电子元件的安装方法
公开(公告)号：JP2005108966A
公开(公告)日：2005-04-21
申请号：JP2003337386
申请日：2003-09-29
申请人： Tdk Corp , Tdk株式会社
发明人： YOSHII AKITOSHI , YOKOYAMA HIDEKI , TAKEDA ATSUSHI , KIMURA YOSHINORI , KAZAMA MIYUKI , OKABE MASAYUKI
IPC分类号： H01G2/06 , H05K1/18 , H05K3/32
CPC分类号： H01G2/065 , H05K3/321 , H05K2201/09036 , H05K2201/10568 , H05K2201/10636 , H05K2203/0545 , Y02P70/611
摘要： PROBLEM TO BE SOLVED: To obtain a mounting method of electronic component which will not generate short-circuit or ion migration, even if the conductive bonding agent is crushed between the electronic component and a circuit board. SOLUTION: The size D of mutual gap between a pair of terminal electrodes 11 and 12 is set to 500 μm or smaller. A pair of lands 21, 22 respectively connected to a pair of terminal electrodes 11, 12 are provided to a circuit board 20, and a size of gap between a pair of lands 21, 22 is set to D1. In the manner with the size D2 of the gap between a pair of conductive bonding agents 13, 14 being widened by 100 μm or larger than the size D1 of the gap between a pair of lands 21, 22, the conductive bonding agents 13, 14 are printed to a pair of lands 21, 22. At the mounting of a laminated capacitor 1 to the circuit board 20, the terminal electrode 11 and the land 21 are bonded, using the conductive bonding agent 13, and the terminal electrode 12 and the land 22 are bonded, using the conductive bonding agent 14. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使在电子部件和电路基板之间粉碎导电性接合剂，也可以获得不会产生短路或离子迁移的电子部件的安装方法。解决方案：一对端子电极11和12之间的相互间隙的尺寸D设定为500μm以下。分别连接到一对端子电极11,12的一对平台21,22设置在电路板20上，一对平台21,22之间的间隙尺寸设定为D1。导电粘合剂13,14之间的间隙的尺寸D2以一对导电粘接剂13,14的间隔宽度大于或等于一面的间隙的尺寸D1扩大了100μm以上，被印刷到一对焊盘21,22上。在层压电容器1安装到电路板20上时，使用导电粘合剂13和端子电极12和端子电极12接合端子电极11和焊盘21。使用导电粘合剂14粘合土地22。版权所有（C）2005，JPO＆NCIPI

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