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1. 发明专利

JP2007088180A Laminated capacitor and method of manufacturing same 有权
标题翻译：层压电容器及其制造方法
公开(公告)号：JP2007088180A
公开(公告)日：2007-04-05
申请号：JP2005274585
申请日：2005-09-21
申请人： Tdk Corp , Tdk株式会社
发明人： TOGASHI MASAAKI , ABIKO TAISUKE
IPC分类号： H01G4/30 , H01G4/12
CPC分类号： H01G4/30 , H01G4/232
摘要： PROBLEM TO BE SOLVED: To provide a laminated capacitor capable of realizing the reduction of ESL (equivalent series inductance).
SOLUTION: First electrodes 31 and second electrodes 32 are equipped on the surface of a dielectric substrate 12 with an interval. First outer layer through-hole conductors 61 connect respective first terminal electrodes 31 to a first internal electrode 411. Second outer layer through-hole conductors 62 connect respective second terminal electrodes 32 to a second internal electrode 421. A first inner layer through-hole conductor 51 connects a plurality of first internal electrodes 411-41n, respectively. A second inner layer through-hole conductor 52 connects a plurality of second inner electrodes 421-42n, respectively.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够实现ESL（等效串联电感）的减小的层叠电容器。解决方案：第一电极31和第二电极32以间隔配置在电介质基板12的表面上。第一外层通孔导体61将各第一端子电极31连接到第一内部电极411.第二外层通孔导体62将各自的第二端子电极32连接到第二内部电极421.第一内层通孔导体 51分别连接多个第一内部电极411-41n。第二内层通孔导体52分别连接多个第二内部电极421-42n。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006173270A Chip type electronic component 审中-公开
标题翻译：芯片型电子元件
公开(公告)号：JP2006173270A
公开(公告)日：2006-06-29
申请号：JP2004361793
申请日：2004-12-14
申请人： Tdk Corp , Tdk株式会社
发明人： YOSHII AKITOSHI , ABIKO TAISUKE , OTSUKI SHIRO , AOKI TAKASHI , GOSHIMA AKIRA , HOCHI HIROYOSHI
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/30 , H01G4/232
摘要： PROBLEM TO BE SOLVED: To provide a chip type electronic component being capable of inhibiting the occurrence of a defective mounting while having excellent thermal shock properties.
SOLUTION: A laminated chip capacitor CC has a chip element body 1 with first to sixth side faces 1a to 1f, and a pair of terminal electrodes 11 and 13. One terminal electrode 11 is positioned on the first side face 1a side of the chip element body 1, and contains an electrode 11a formed to the fifth side face 1e. The other terminal electrode 13 is positioned on the second side face 1b side of the chip element body 1, and contains the electrode 13a formed to the fifth side face 1e. A first length L1 along the X-axial direction from the edge of the fifth side face 1e in a central region in the Y-axial direction of the electrodes 11a and 13a for each terminal electrode 11 and 13 is set at a value longer than a second length L2, along the X-axial direction from the edges of the fifth side faces 1e in both end regions in the Y-axial direction of the electrodes 11a and 13a for each terminal electrode 11 and 13.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够抑制安装不良的同时具有优异的热冲击特性的芯片型电子部件。解决方案：层叠片状电容器CC具有带有第一至第六侧面1a至1f的芯片元件体1和一对端子电极11和13.一个端子电极11位于第一侧面1a侧芯片元件主体1，并且包含形成在第五侧面1e上的电极11a。另一个端子电极13位于芯片元件主体1的第二侧面1b侧，并且包含形成在第五侧面1e上的电极13a。在每个端子电极11和13的电极11a和13a的Y轴方向的中心区域中，从第五侧面1e的边缘沿着X轴方向的第一长度L1被设定为比对于每个端子电极11和13，在电极11a和13a的Y轴方向上的两个端部区域中从第五侧面1e的边缘沿X轴方向的第二长度L2。版权所有：（C ）2006年，日本特许厅和NCIPI

3. 发明专利

JP2005044871A Three terminal feed-through capacitor 审中-公开
标题翻译：三端供电电容器
公开(公告)号：JP2005044871A
公开(公告)日：2005-02-17
申请号：JP2003200861
申请日：2003-07-24
申请人： Tdk Corp , Tdk株式会社
发明人： ABIKO TAISUKE , TOGASHI MASAAKI
IPC分类号： H01G4/12 , H01G4/35
摘要： PROBLEM TO BE SOLVED: To obtain three terminal feed-through capacitor which reduced ESL while making manufacture easy.
SOLUTION: In a dielectric material body, an internal electrode 20 is so arranged that it has an clearance to two sides M by side of rectangular short hand, respectively and is prolonged between the upper and the lower sides. In the dielectric material body, an internal electrode 21 is so arranged below the internal electrode 20 separated by a ceramic layer 12A that it has clearance to two sides N by side of the rectangular long hand and is prolonged between the right and the left sides. On both end portions of the internal electrode 21, an drawer portion 21A is prepared, lead out by thin width of face which becomes the width of face dimension L1 of 1/2 - 1/3 of width of face dimension L0 of the internal electrode 21. In the dielectric material body, an internal electrode 22 and an internal electrode 23 and an internal electrode 24 are arranged one by one below the internal electrode 21.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：获得减少ESL同时制造容易的三端馈电电容器。解决方案：在电介质材料体中，内部电极20被布置为分别具有与矩形短手侧的两侧M的间隙，并且在上侧和下侧之间延伸。在电介质材料体中，内部电极21被布置在由陶瓷层12A分隔开的内部电极20的下方，该陶瓷层12A与长方形的长方形的N侧的两侧具有间隙，并且在右侧和左侧之间延伸。在内部电极21的两端部分上形成有抽出部21A，其表面的薄宽度成为内部电极的面积尺寸L0的宽度的1/2〜1/3的面尺寸L1的宽度在电介质材料体中，内部电极22和内部电极23以及内部电极24在内部电极21的下方一个接一个地排列。（C）2005年，JPO＆NCIPI

4. 发明专利

JP2004288847A Electronic component 有权
标题翻译：电子元件
公开(公告)号：JP2004288847A
公开(公告)日：2004-10-14
申请号：JP2003078509
申请日：2003-03-20
申请人： Tdk Corp , Tdk株式会社
发明人： TOGASHI MASAAKI , ABIKO TAISUKE , YOSHII AKITOSHI
IPC分类号： H01G4/228
CPC分类号： H01G2/065 , H01G4/228
摘要： PROBLEM TO BE SOLVED: To provide a laminated ceramic capacitor which suppresses the transmission of vibrations caused by a piezoelectric effect and electric distortion to reduce the generation of noises.
SOLUTION: According to the laminated ceramic capacitor, a pair of metal terminals 21, 22 made of a metal material are made to come in contact with terminal electrodes 11, 12 of a capacitor element 2, which is the body of the laminated capacitor 1 via inside connections 21A, 22A, respectively. An outside connection 21B connected to the inside connection 21A is arranged on the lower part of the inside connection 21A, while an outside connection 22B connected to the inside connection 22A is arranged on the lower part of the inside connection 22A. While the width of the terminal electrodes 11, 12 and that of the outside connections 21B, 22B are almost identical with each other, the width of the inside connections 21A, 22A is made smaller than the above identical width.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种层压陶瓷电容器，其抑制由压电效应和电变形引起的振动的传递，以减少噪声的产生。解决方案：根据层压陶瓷电容器，制成由金属材料制成的一对金属端子21,22与作为层叠体的电容器元件2的端子电极11,12接触电容器1分别经由内部连接件21A，22A。连接到内部连接部21A的外部连接部21B配置在内部连接部21A的下部，而连接在内侧连接部22A上的外部连接部22B配置在内侧连接部22A的下部。尽管端子电极11,12的宽度和外部连接件21B，22B的宽度几乎彼此相同，但是内部连接件21A，22A的宽度被制成小于上述相同的宽度。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004273935A Ceramic capacitor and its manufacturing method 有权
公开(公告)号：JP2004273935A
公开(公告)日：2004-09-30
申请号：JP2003065328
申请日：2003-03-11
申请人： Tdk Corp , Tdk株式会社
发明人： YOSHII AKITOSHI , TAKEDA ATSUSHI , ABIKO TAISUKE
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a ceramic capacitor having a structure in which the transmission of vibrations to a circuit board or the like is inhibited.
SOLUTION: A ceramic capacitor element 10 has a dielectric base body 100, terminal electrodes 12 and 13 and a plurality of internal electrodes 14. The electrodes 12 and 13 are formed at the opposite both-side end sections of the base body 100. Each of the electrodes 14 is buried in the base body 100, and one ends are connected to the electrodes 12 and 13 and the other ends are formed in open ends. The mutually adjacent internal electrodes 14 in the electrodes 14 are opposed through dielectric layers. Each of metallic terminals 22 and 23 is composed of a metallic member, has board mounting parts 225 and 235 and is connected to one of the electrodes 12 and 13. The mounting parts 225 and 235 are positioned on one mounting surface 200, and the mounting surface 200 is crossed with the electrode surfaces 140 of the internal electrodes 14 approximately vertically.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2006229077A Ceramic electronic part 有权
标题翻译：陶瓷电子部件
公开(公告)号：JP2006229077A
公开(公告)日：2006-08-31
申请号：JP2005042940
申请日：2005-02-18
申请人： Tdk Corp , Tdk株式会社
发明人： YOSHII AKITOSHI , ABIKO TAISUKE , TAKEDA ATSUSHI , OTSUKI SHIRO , ONODERA SHINYA , KIMURA YOSHINORI , KIKUCHI HIROMI
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/2325
摘要： PROBLEM TO BE SOLVED: To provide a ceramic electronic part capable of reducing a cost while being capable of inhibiting the increase of an electric resistance as preventing the generation of a crack due to a thermal shock.
SOLUTION: A laminated capacitor C1 has a ceramic sintered body 10, internal electrodes 20 formed in the ceramic sintered body 10 and external electrodes 30. The external electrode 30 has a first electrode layer 40, a second electrode layer 42, a conductive resin layer 44, a third electrode layer 46, and a fourth electrode layer 48. The internal electrode 20 and the first electrode layer 40 mainly comprises a base metal. The second electrode layer 42 mainly comprises a precious metal. The conductive resin electrode layer 44 contains the precious metal. The third electrode layer 46 mainly comprises Ni. The fourth electrode layer 48 mainly comprises Sn or an Sn alloy.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够降低成本的陶瓷电子部件，同时能够抑制由于热冲击而产生裂缝的电阻的增加。解决方案：层压电容器C1具有陶瓷烧结体10，形成在陶瓷烧结体10中的内部电极20和外部电极30.外部电极30具有第一电极层40，第二电极层42，导电性树脂层44，第三电极层46和第四电极层48.内部电极20和第一电极层40主要包括贱金属。第二电极层42主要由贵金属构成。导电树脂电极层44含有贵金属。第三电极层46主要包括Ni。第四电极层48主要包括Sn或Sn合金。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2007261116A Cutting blade for green sheet laminate, cutting apparatus for green sheet laminate, and method for manufacturing electronic component 审中-公开
标题翻译：绿色片材切割刀片，绿色片材切割装置及制造电子元器件的方法
公开(公告)号：JP2007261116A
公开(公告)日：2007-10-11
申请号：JP2006089919
申请日：2006-03-29
申请人： Tdk Corp , Tdk株式会社
发明人： ABIKO TAISUKE , TAKASHIMA TAKESHI , YAGI HIROSHI , KOMURO TOMOHIKO , TATSUMI SUMIYUKI , SHINDO HIROSHI
IPC分类号： B28B11/14 , B26D1/08
摘要： PROBLEM TO BE SOLVED: To provide a cutting blade for a green sheet laminate, a cutting apparatus for the green sheet laminate, and a method for manufacturing an electric component, which assure a strength of the cutting blade, avoid catching by a base material of the green sheet laminate and curling up of the green sheet laminate, and prevent cut pieces from re-adhesion.
SOLUTION: The cutting blade cutting the green sheet laminate by pressing in the thickness direction of the green sheet laminate obtained by laminating a green sheet on the base material has a roughened region and a smooth region on a blade surface of the cutting blade, the smooth region being adjacent to a ridge of a blade edge.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于生片层压板的切割刀片，用于生坯片层压体的切割装置和确保切割刀片的强度的电气部件的制造方法避免了由于生片层叠体的基材和生片层叠体的卷曲，并且防止切割片再粘合。解决方案：通过在基材上层压生片所得到的生片层压板的厚度方向的压制而切割生片层压板的切割刀片具有在切割刀片的刀片表面上的粗糙区域和平滑区域，平滑区域与叶片边缘的脊相邻。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007173490A Mounting method of chip component, and circuit board 有权
标题翻译：芯片组件的安装方法和电路板
公开(公告)号：JP2007173490A
公开(公告)日：2007-07-05
申请号：JP2005368797
申请日：2005-12-21
申请人： Tdk Corp , Tdk株式会社
发明人： KATAOKA SHIGEKI , ABIKO TAISUKE , YOSHII AKITOSHI , GOSHIMA AKIRA , AOKI TAKASHI , SOGABE TOMOHIRO
IPC分类号： H05K3/34
CPC分类号： H01L23/49816 , H01G2/065 , H01L23/49838 , H01L24/81 , H01L2224/1147 , H01L2224/1184 , H01L2224/13019 , H01L2224/16 , H01L2224/16105 , H01L2224/81024 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H05K3/3442 , H05K3/3457 , H05K3/3489 , H05K2201/0373 , H05K2201/10636 , H05K2203/0278 , H05K2203/043 , H05K2203/0485 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a chip component mounting method which is capable of preventing the displacement of a chip component when it is mounted.
SOLUTION: A solder material 33 attached to a land terminal 21 on a circuit board 1 is flattened. Furthermore, a flux 37 is applied onto the flattened solder material 33. Thereafter, the chip component 5 is arranged in such a state in which it is mounted on the solder material 33 through the flux 37. U-shaped grooves 41 and 42 are formed on the surface of the solder material 33 at the same time when the solder material 33 is flattened or before the flux 37 is applied after the solder material 33 has been flattened.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够防止芯片部件安装时的位移的芯片部件安装方法。＆lt; P＆gt;解决方案：连接在电路板1上的接地端子21上的焊料33是扁平的。此外，在平坦化的焊料33上施加焊剂37.此后，芯片部件5以通过焊剂37安装在焊料材料33上的状态配置。形成U字形槽41和42 在焊料33被平坦化之后或在焊料33被平坦化之后施加焊剂37之前的同时，在焊料33的表面上。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006245048A Electronic component, multilayer ceramic capacitor and electronic apparatus 有权
标题翻译：电子元件，多层陶瓷电容器和电子设备
公开(公告)号：JP2006245048A
公开(公告)日：2006-09-14
申请号：JP2005054720
申请日：2005-02-28
申请人： Tdk Corp , Tdk株式会社
发明人： YOSHII AKITOSHI , ABIKO TAISUKE , MIYAIRI MASUZO , KIKUCHI AKIO
IPC分类号： H01G4/30 , H01G4/12 , H01G4/252
摘要： PROBLEM TO BE SOLVED: To provide an electronic component, a multilayer ceramic capacitor and an electronic apparatus in which deterioration in insulation resistance can be suppressed under high temperature high humidity environment.
SOLUTION: A pair of terminal electrodes 11, 13 comprise first electrode layers 11a, 13a, second electrode layers 11b, 13b, and third electrode layers 11c, 13c. The first electrode layers 11a, 13a are formed on the outer surface of a capacitor element 3 by baking conductive paste. The second electrode layers 11b, 13b are formed on the first electrode layers 11a, 13a by Ni plating. The third electrode layers 11c, 13c are formed on the second electrode layers 11b, 13b by Sn plating. Thickness of the first electrode layers 11a, 13a is set at 10 μm or less. Generation rate of pores in the first electrode layers 11a, 13a is set at 10% or less by pore area ratio in the cutting plane.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子部件，多层陶瓷电容器和在高温高湿环境下能够抑制绝缘电阻的劣化的电子设备。解决方案：一对端子电极11,13包括第一电极层11a，13a，第二电极层11b，13b和第三电极层11c，13c。第一电极层11a，13a通过烘烤导电膏形成在电容器元件3的外表面上。通过Ni电镀在第一电极层11a，13a上形成第二电极层11b，13b。通过Sn电镀在第二电极层11b，13b上形成第三电极层11c，13c。第一电极层11a，13a的厚度设定为10μm以下。第一电极层11a，13a中的孔的产生率在切割平面中通过孔面积比设定为10％以下。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006196685A Multilayer capacitor and method of adjusting equivalent series resistance thereof 有权
标题翻译：多层电容器及其调整等效串联电阻的方法
公开(公告)号：JP2006196685A
公开(公告)日：2006-07-27
申请号：JP2005006644
申请日：2005-01-13
申请人： Tdk Corp , Tdk株式会社
发明人： TOGASHI MASAAKI , ABIKO TAISUKE
IPC分类号： H01G4/30 , H01G2/00 , H01G4/12
CPC分类号： H01G4/35 , H01G4/012 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： PROBLEM TO BE SOLVED: To provide a multilayer capacitor capable of controlling an equivalent series resistance with ease and sufficient accuracy, and to provide an adjustment method of the equivalent series resistance of the multilayer capacitor. SOLUTION: A multilayer capacitor C1 is provided with a laminate 1, first and second terminal electrodes 3 and 5. The laminate 1 is constituted by laminating two or more dielectric layers and the first and second internal electrodes 21-24 and 31-34 alternately. The first internal electrode 21-24 are electrically connected mutually via through-hole conductors 51a-57a and internal conductors 45-48. The first internal electrode 21 is connected with a first terminal electrode 3 electrically via a leading out conductor 25. The second internal electrode 31-34 are electrically connected mutually via through-hole conductors 51b-57b and internal conductors 41-44. The second internal electrode 34 are electrically connected with the second terminal electrode 5 via a leading-out conductor 35. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种容易且足够精确地控制等效串联电阻的层叠电容器，并提供层叠电容器的等效串联电阻的调整方法。解决方案：层叠电容器C1具有层压体1，第一和第二端子电极3和5.层压体1通过层叠两个或更多个介电层和第一和第二内部电极21-24和31- 34交替。第一内部电极21-24经由通孔导体51a-57a和内部导体45-48相互电连接。第一内部电极21经由引出导体25与第一端子电极3电连接。第二内部电极31-34通过通孔导体51b-57b和内部导体41-44相互电连接。第二内部电极34经由引出导体35与第二端子电极5电连接。（C）2006年，JPO和NCIPI

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