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1. 发明授权

US07238093B1 Polishing cloth for chemical mechanical polishing, and chemical mechanical polishing apparatus using said cloth 有权
标题翻译：用于化学机械抛光的抛光布，以及使用所述布的化学机械抛光装置
公开(公告)号：US07238093B1
公开(公告)日：2007-07-03
申请号：US09449907
申请日：1999-12-02
申请人： Tatsuya Sakamoto , Muneyuki Matsumoto
发明人： Tatsuya Sakamoto , Muneyuki Matsumoto
IPC分类号： B24B29/00
CPC分类号： B24B37/26
摘要： A chemical mechanical polishing cloth for chemically mechanically polishing a workpiece. This chemical mechanical polishing cloth includes, on the opposite-to-workpiece face thereof: polishing projections having polishing faces arranged to come in contact with a workpiece for polishing the same; polishing agent passages for introducing a polishing agent; and at least one-stage step portions formed between the polishing faces of the polishing projections and the bottoms of the polishing agent passages.
摘要翻译：用于化学机械抛光工件的化学机械抛光布。该化学机械抛光布在其相对工件表面上包括：抛光凸起，其具有布置成与工件接触的抛光面，用于抛光; 用于引入抛光剂的抛光剂通道; 以及形成在研磨突起的研磨面和研磨剂通路的底部之间的至少一级台阶部。

2. 发明授权

US08072068B2 Semiconductor device and a method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08072068B2
公开(公告)日：2011-12-06
申请号：US12469636
申请日：2009-05-20
申请人： Tatsuya Sakamoto
发明人： Tatsuya Sakamoto
IPC分类号： H01L23/498 , H01L21/28
CPC分类号： H01L23/3114 , H01L23/525 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/12 , H01L24/13 , H01L2224/0231 , H01L2224/03 , H01L2224/0401 , H01L2224/05024 , H01L2224/05556 , H01L2224/05557 , H01L2224/05559 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13006 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/00011 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/00 , H01L2224/05552 , H01L2224/81805
摘要： A semiconductor device according to the present invention includes: a semiconductor chip; a sealing resin layer formed on the semiconductor chip; and a post electrode formed in a through-hole penetrating through the sealing resin layer in a thickness direction, and having a hemispheric top surface.
摘要翻译：根据本发明的半导体器件包括：半导体芯片; 形成在所述半导体芯片上的密封树脂层; 以及在厚度方向贯通密封树脂层的通孔中形成的具有半球顶表面的柱状电极。

3. 发明申请

US20100327954A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100327954A1
公开(公告)日：2010-12-30
申请号：US12820476
申请日：2010-06-22
申请人： Tatsuya Sakamoto , Kanji Oishi , Gen Koshita
发明人： Tatsuya Sakamoto , Kanji Oishi , Gen Koshita
IPC分类号： G05F1/00
CPC分类号： G11C29/12 , G11C29/12005
摘要： A semiconductor device includes internal voltage generating circuits, a switching circuit, load circuits, a control circuit. Each of the plurality of load circuits is supplied with voltage through the switching circuit from any one of the plurality of internal voltage generating circuits. The control circuit defines connecting combinations by the switch circuit. The control circuit supplies a control signal to the switch circuit, based on the control signal corresponding to the definitions of the connecting combinations. The control circuit allows switching the connecting combinations when the semiconductor device tests in a test mode. The control circuit prohibits switching the connecting combinations in a non-test mode. The switch circuit connects between each of m of the internal voltage generating circuits and each of n of the load circuits through a connecting combination which is selected, based on the control signal, from mn of the connecting combinations.
摘要翻译：半导体器件包括内部电压产生电路，开关电路，负载电路，控制电路。多个负载电路中的每一个通过来自多个内部电压产生电路中的任一个的开关电路被提供电压。控制电路通过开关电路定义连接组合。控制电路基于对应于连接组合的定义的控制信号向开关电路提供控制信号。当半导体器件在测试模式下测试时，控制电路允许切换连接组合。控制电路禁止在非测试模式下切换连接组合。开关电路通过基于控制信号从连接组合的mn选择的连接组合连接内部电压产生电路的m个和负载电路中的每一个。

4. 发明申请

US20080128904A1 Semiconductor device and method of manufacturing semiconductor device 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20080128904A1
公开(公告)日：2008-06-05
申请号：US11946428
申请日：2007-11-28
申请人： Tatsuya Sakamoto
发明人： Tatsuya Sakamoto
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/3192 , H01L21/563 , H01L23/3114 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/05647 , H01L2224/13099 , H01L2224/16 , H01L2224/73203 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/10157 , H01L2924/181 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device according to the present invention includes a semiconductor chip having an interlayer film provided with an electrode for external connection in a prescribed position, rewiring conducting to the electrode and provided on the interlayer film, an insulating layer covering the rewiring, a pad conducting to the rewiring through an opening formed in the insulating layer and a solder terminal provided on the pad. A photosensitive resin film is provided on the insulating layer. The photosensitive resin film covers the peripheral edge of the interlayer film.
摘要翻译：根据本发明的半导体器件包括：半导体芯片，其具有在规定位置设置有用于外部连接的电极的中间膜，对电极重新布线并设置在层间膜上;覆盖重新布线的绝缘层;衬垫导电通过形成在绝缘层中的开口重新布线，以及设置在焊盘上的焊接端子。在绝缘层上设置感光性树脂膜。感光性树脂膜覆盖层间膜的周缘。

5. 发明授权

US6138566A Method and apparatus for developing printing plates in press 失效
标题翻译：在印刷机中印刷印版的方法和装置
公开(公告)号：US6138566A
公开(公告)日：2000-10-31
申请号：US156690
申请日：1998-09-18
申请人： Tatsuya Sakamoto
发明人： Tatsuya Sakamoto
IPC分类号： B41F7/02 , B41C1/10
CPC分类号： B41C1/1075
摘要： A printing apparatus for making a plate by recording and developing images thereon, and thereafter printing the images by feeding inks to the plate. The printing apparatus includes a cylinder for supporting the plate mounted peripherally thereof, a cylinder rotating mechanism for rotating the cylinder, an image recorder for recording the images on the plate mounted on the cylinder, and a developing device for developing the plate mounted on the cylinder. The developing device includes a developing roller reciprocable between an applying position for contacting the plate to apply a developer to the plate mounted peripherally of the cylinder, and a retracted position spaced from the applying position, and a squeeze roller reciprocable between a squeezing position for contacting the plate to squeeze the developer applied by the developing roller off the plate mounted peripherally of the cylinder, and a retracted position spaced from the squeezing position. With this printing apparatus, the image recorder records the images on the plate rotating as mounted on the cylinder, and then the developing roller is placed in contact with the plate rotating as mounted on the cylinder to apply the developer thereto. Subsequently, the squeeze roller is placed in contact with the plate rotating as mounted on the cylinder to remove the developer therefrom.
摘要翻译：一种用于通过在其上记录和显影图像来制造板的打印装置，然后通过将油墨供给到板来打印图像。印刷装置包括用于支撑其外围安装的板的圆柱体，用于旋转圆筒的圆筒旋转机构，用于将图像记录在安装在圆筒上的板上的图像记录器，以及用于使安装在圆筒上的板显影的显影装置。该显影装置包括一个显影辊，该显影辊可以在一个用于接触印版的施加位置之间往复运动，该施加位置将显影剂施加到安装在圆柱体周围的板上，以及与施加位置间隔开的缩回位置，以及可在挤压位置之间往复运动的挤压辊，将由显影辊施加的显影剂挤压在安装在圆筒周边的板上的板以及与挤压位置间隔开的缩回位置。利用该打印装置，图像记录器将图像记录在安装在圆筒上的旋转板上，然后将显影辊放置成与安装在圆筒上旋转的板接触以将显影剂施加到其上。随后，将挤压辊放置成与安装在圆筒上旋转的板接触，以从中除去显影剂。

6. 发明授权

US5134390A Method and apparatus for rotatable display 失效
标题翻译：可旋转显示的方法和装置
公开(公告)号：US5134390A
公开(公告)日：1992-07-28
申请号：US381306
申请日：1989-07-18
申请人： Kazutomo Kishimoto , Masahiro Okumura , Tamon Masimo , Tatsuya Sakamoto , Youji Kouno
发明人： Kazutomo Kishimoto , Masahiro Okumura , Tamon Masimo , Tatsuya Sakamoto , Youji Kouno
IPC分类号： G06F1/16 , G06F3/048 , G06F3/153 , G06T1/00 , G09G1/00 , G09G5/36 , G09G5/391
CPC分类号： G09G1/00 , G06F1/1601 , G09G5/391 , G06F2200/1611 , Y10S248/917
摘要： In a filing system having a storage device for storing image information and a display with a rectangular screen for visually displaying the stored image information, the screen is arranged to be positioned at an upright position or at a lateral position, with a motor. The switch between two positions of the screen is effected upon instruction input from a keyboard, or in accordance with the information representative of the screen position which is stored beforehand in the storage device for each of the image information. The screen is also provided with a tilting mechanism which is released while the screen rotates. There is compensate circuit compensating for a positional displacement of a displayed image caused by a difference of earth magnetism between two positions of the screen.

7. 发明授权

US09762108B2 Method for winding edgewise coil and winding device 有权
公开(公告)号：US09762108B2
公开(公告)日：2017-09-12
申请号：US14402170
申请日：2013-04-10
申请人： Tatsuya Sakamoto , Yasuyuki Kawanishi
发明人： Tatsuya Sakamoto , Yasuyuki Kawanishi
IPC分类号： H01F7/06 , H02K15/04 , H01F41/061
CPC分类号： H02K15/045 , H01F41/061 , Y10T29/49071
摘要： Provided is a method for winding an edgewise coil and a winding device capable of saving time and labor when changing a guide. A guide bar is disposed in contact with the side face of the rectangular conductor bent by the bending jig and the rotation center of the guide bar deviates from the rotation center of a bending jig for bending a rectangular conductor. The guide bar rotates in accordance with the action whereby the bending jig bends the rectangular conductor and supports the outside surface of a coil on the side of rotational direction of the bending jig.

8. 发明申请

US20120118343A1 ALUMINUM-MAGNESIUM-SILICON COMPOSITE MATERIAL AND PROCESS FOR PRODUCING SAME, AND THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION MODULE EACH COMPRISING OR INCLUDING THE COMPOSITE MATERIAL 审中-公开
标题翻译：铝镁合金材料及其制造方法，以及热电转换材料，热电转换元件和包含复合材料的热电转换模块
公开(公告)号：US20120118343A1
公开(公告)日：2012-05-17
申请号：US13386873
申请日：2010-07-26
申请人： Tsutomu Iida , Naoki Fikushima , Tatsuya Sakamoto , Yohiko Mito , Hirokuni Nanba , Yutaka Taguchi , Masayasu Akasaka , Mamoru Tachikawa , Takakazu Hino
发明人： Tsutomu Iida , Naoki Fikushima , Tatsuya Sakamoto , Yohiko Mito , Hirokuni Nanba , Yutaka Taguchi , Masayasu Akasaka , Mamoru Tachikawa , Takakazu Hino
IPC分类号： H01L35/14 , H01L35/28 , H01B1/02
CPC分类号： H01L35/34 , B22F3/10 , B22F9/04 , C04B35/58085 , C04B35/6261 , C04B35/645 , C04B2235/401 , C04B2235/402 , C04B2235/428 , C04B2235/5436 , C04B2235/6562 , C04B2235/6565 , C04B2235/6581 , C04B2235/6582 , C04B2235/72 , C04B2235/96 , C22C1/02 , C22C23/00 , C22C24/00 , H01L35/14 , H01L35/22
摘要： Disclosed is an aluminum-magnesium-silicon composite material that contains an alloy comprising Al, Mg, and Si and can be used favorably as a material for a thermoelectric conversion module, and that has excellent thermoelectric conversion properties. The aluminum-magnesium-silicon composite material contains an alloy comprising Al, Mg and Si, and has an electrical conductivity (σ) of 1000-3000 S/cm at 300 K. This aluminum-magnesium-silicon composite material is favorable in the production of a thermoelectric exchange element as a result of having excellent thermoelectric conversion properties.
摘要翻译：公开了一种含有Al，Mg和Si的合金的铝 - 镁 - 硅复合材料，可以有利地用作热电转换模块的材料，并且具有优异的热电转换性能。铝 - 镁 - 硅复合材料含有包含Al，Mg和Si的合金，并且在300K下具有1000-3000S / cm的导电性（＆S）。该铝 - 镁 - 硅复合材料在作为具有优异的热电转换性能的结果，生产热电交换元件。

9. 发明申请

US20120097205A1 MAGNESIUM-SILICON COMPOSITE MATERIAL AND PROCESS FOR PRODUCING SAME, AND THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE EACH COMPRISING OR INCLUDING THE COMPOSITE MATERIAL 审中-公开
标题翻译：镁硅复合材料及其制造方法，以及热电转换材料，热电转换元件和包含复合材料的热电转换模块
公开(公告)号：US20120097205A1
公开(公告)日：2012-04-26
申请号：US13379593
申请日：2010-06-30
申请人： Tsutomu Iida , Yasuhiko Honda , Naoki Fukushima , Tatsuya Sakamoto , Yohiko Mito , Hirokuni Nanba , Yutaka Taguchi
发明人： Tsutomu Iida , Yasuhiko Honda , Naoki Fukushima , Tatsuya Sakamoto , Yohiko Mito , Hirokuni Nanba , Yutaka Taguchi
IPC分类号： H01L35/28 , H01B1/04
CPC分类号： H01L35/22 , C01B33/06 , C01P2002/70 , C01P2004/61 , C04B35/58085 , C04B35/6261 , C04B35/62665 , C04B35/645 , C04B35/6455 , C04B2235/40 , C04B2235/401 , C04B2235/402 , C04B2235/407 , C04B2235/408 , C04B2235/428 , C04B2235/6562 , C04B2235/6565 , C04B2235/6582 , C04B2235/666 , C04B2235/72 , C04B2235/80 , C04B2235/9607 , C22C23/00 , F27D17/004 , H01M4/1395 , H01M4/38 , H01M4/383 , Y02E60/324
摘要： Provided is a magnesium-silicon composite material which contains Mg2Si as an intermetallic compound imposing no burden on the environment, is suitable for use as a material for thermoelectric conversion modules, and has excellent thermoelectric conversion performance. The magnesium-silicon composite material has a dimensionless figure-of-merit parameter at 866K of 0.665 or larger. This magnesium-silicon composite material can have high thermoelectric conversion performance when used in, for example, a thermoelectric conversion module.
摘要翻译：提供一种含有作为金属间化合物的Mg2Si作为环境无负担的镁硅复合材料，适用于热电转换模块的材料，具有优异的热电转换性能。镁硅复合材料在866K下具有0.665或更大的无量纲品质参数。当在例如热电转换模块中使用时，该镁硅复合材料可以具有高的热电转换性能。

10. 发明授权

US08130565B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08130565B2
公开(公告)日：2012-03-06
申请号：US12820476
申请日：2010-06-22
申请人： Tatsuya Sakamoto , Kanji Oishi , Gen Koshita
发明人： Tatsuya Sakamoto , Kanji Oishi , Gen Koshita
IPC分类号： G11C7/00 , G11C17/18 , G11C5/14
CPC分类号： G11C29/12 , G11C29/12005
摘要： A semiconductor device includes internal voltage generating circuits, a switching circuit, load circuits, a control circuit. Each of the plurality of load circuits is supplied with voltage through the switching circuit from any one of the plurality of internal voltage generating circuits. The control circuit defines connecting combinations by the switch circuit. The control circuit supplies a control signal to the switch circuit, based on the control signal corresponding to the definitions of the connecting combinations. The control circuit allows switching the connecting combinations when the semiconductor device tests in a test mode. The control circuit prohibits switching the connecting combinations in a non-test mode. The switch circuit connects between each of m of the internal voltage generating circuits and each of n of the load circuits through a connecting combination which is selected, based on the control signal, from mn of the connecting combinations.
摘要翻译：半导体器件包括内部电压产生电路，开关电路，负载电路，控制电路。多个负载电路中的每一个通过来自多个内部电压产生电路中的任一个的开关电路被提供电压。控制电路通过开关电路定义连接组合。控制电路基于对应于连接组合的定义的控制信号向开关电路提供控制信号。当半导体器件在测试模式下测试时，控制电路允许切换连接组合。控制电路禁止在非测试模式下切换连接组合。开关电路通过基于控制信号从连接组合的mn选择的连接组合连接内部电压产生电路的m个和负载电路中的每一个。

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