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1. 发明授权

US06958183B2 Key top plate and a method for manufacturing the same 失效
标题翻译：关键顶板及其制造方法
公开(公告)号：US06958183B2
公开(公告)日：2005-10-25
申请号：US10073283
申请日：2002-02-13
申请人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
发明人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
IPC分类号： H01H13/70 , B32B27/08 , H01H13/14 , B32B27/14 , H01H1/00
CPC分类号： B32B27/08 , B32B27/36 , B32B27/365 , B32B37/15 , B32B2307/412 , B32B2307/414 , H01H13/14 , H01H2219/028 , H01H2219/032 , H01H2229/047 , Y10T428/23 , Y10T428/233 , Y10T428/239 , Y10T428/24339 , Y10T428/24562 , Y10T428/24661 , Y10T428/24802
摘要： A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached to a top surface and a bottom surface of a key top 30 made of mold-resin, respectively, so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23. The second film plate 40 is arranged on the bottom surface of the key top 30. All of the first film plate 20, the key top 30, and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40, respectively.
摘要翻译：分别由模具树脂制成的键顶30的上表面和底面分别安装由柔性树脂膜制成的第一薄膜板20和第二薄膜板40，以覆盖键顶30 。第一胶片板20被向上按压以形成凹部23，键顶30被模制在该凹部23内。第二膜片40配置在键顶30的底面上。所有第一薄膜板20，键顶30和第二薄膜40都是透明的。装饰层21和41分别形成在第一膜板20和第二膜板40上。

2. 发明申请

US20050145471A1 Key top plate 失效
标题翻译：键顶板
公开(公告)号：US20050145471A1
公开(公告)日：2005-07-07
申请号：US11071451
申请日：2005-03-04
申请人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
发明人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
IPC分类号： H01H13/70 , B32B27/08 , H01H13/14 , H01H1/10
CPC分类号： B32B27/08 , B32B27/36 , B32B27/365 , B32B37/15 , B32B2307/412 , B32B2307/414 , H01H13/14 , H01H2219/028 , H01H2219/032 , H01H2229/047 , Y10T428/23 , Y10T428/233 , Y10T428/239 , Y10T428/24339 , Y10T428/24562 , Y10T428/24661 , Y10T428/24802
摘要： A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached to a top surface and a bottom surface of a key top 30 made of mold-resin, respectively, so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23. The second film plate 40 is arranged on the bottom surface of the key top 30. All of the first film plate 20, the key top 30, and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40, respectively.
摘要翻译：分别由模具树脂制成的键顶30的上表面和底面分别安装由柔性树脂膜制成的第一薄膜板20和第二薄膜板40，以覆盖键顶30 。第一胶片板20被向上按压以形成凹部23，键顶30被模制在该凹部23内。第二膜片40配置在键顶30的底面上。所有第一薄膜板20，键顶30和第二薄膜40都是透明的。装饰层21和41分别形成在第一膜板20和第二膜板40上。

3. 发明授权

US07101603B2 Key top plate 失效
标题翻译：键顶板
公开(公告)号：US07101603B2
公开(公告)日：2006-09-05
申请号：US11071451
申请日：2005-03-04
申请人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
发明人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
IPC分类号： B32B1/04 , B32B3/02 , B32B3/10 , H01H1/10 , H01H13/14
CPC分类号： B32B27/08 , B32B27/36 , B32B27/365 , B32B37/15 , B32B2307/412 , B32B2307/414 , H01H13/14 , H01H2219/028 , H01H2219/032 , H01H2229/047 , Y10T428/23 , Y10T428/233 , Y10T428/239 , Y10T428/24339 , Y10T428/24562 , Y10T428/24661 , Y10T428/24802
摘要： A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached to a top surface and a bottom surface of a key top 30 made of mold-resin, respectively, so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23. The second film plate 40 is arranged on the bottom surface of the key top 30. All of the first film plate 20, the key top 30, and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40, respectively.
摘要翻译：分别由模具树脂制成的键顶30的上表面和底面分别安装由柔性树脂膜制成的第一薄膜板20和第二薄膜板40，以覆盖键顶30 。第一胶片板20被向上按压以形成凹部23，键顶30被模制在该凹部23内。第二膜片40配置在键顶30的底面上。所有第一薄膜板20，键顶30和第二薄膜40都是透明的。装饰层21和41分别形成在第一膜板20和第二膜板40上。

4. 发明申请

US20120309881A1 RUBBER COMPOSITION AND USES THEREOF 有权
标题翻译：橡胶组合物及其用途
公开(公告)号：US20120309881A1
公开(公告)日：2012-12-06
申请号：US13512629
申请日：2010-11-16
申请人： Kazuyuki Tsukimori , Junryo Nariai , Tsutomu Inuyama , Shinji Mizuno
发明人： Kazuyuki Tsukimori , Junryo Nariai , Tsutomu Inuyama , Shinji Mizuno
IPC分类号： C08L27/18 , C08L9/02 , C08K5/06
CPC分类号： C08L27/18 , C08K5/14 , C08L15/005 , C08L71/00 , C08L71/02 , C08L2205/03 , C09K3/1009
摘要： A rubber composition has sufficient resistance to degradation and swelling caused by a liquid such as a water-soluble coolant and also is capable of having sufficient resistance to ozone. The rubber composition contains a fluororubber not having a vinylidene fluoride structure, a nitrile rubber, a fluorine-based oil and a peroxide vulcanizing agent.
摘要翻译：橡胶组合物具有足够的耐水溶性冷却剂等液体的降解和溶胀性，并且还能够具有足够的耐臭氧性。橡胶组合物含有不具有偏二氟乙烯结构的氟橡胶，丁腈橡胶，氟系油和过氧化物硫化剂。

5. 发明授权

US07365561B2 Test probe and tester, method for manufacturing the test probe 有权
标题翻译：测试探针和测试仪，制造测试探针的方法
公开(公告)号：US07365561B2
公开(公告)日：2008-04-29
申请号：US11184763
申请日：2005-07-19
申请人： Haruki Ito , Shinji Mizuno , Koji Yamaguchi
发明人： Haruki Ito , Shinji Mizuno , Koji Yamaguchi
IPC分类号： G01R31/00
CPC分类号： G09G3/006 , G01R1/06761 , G01R1/07314 , G09G3/3622 , Y10T29/49204
摘要： A test probe having a conductive part electrically connected to terminals of a test-object device, including: a silicon substrate; a protrusion made of resin provided on the silicon substrate; a first conductive part which is provided on the protrusion and comes in contact with the terminals; and a second conductive part which is provided in a region other than a region having the protrusion on the silicon substrate and is electrically connected to the first conductive part.
摘要翻译：一种测试探针，其具有与测试对象器件的端子电连接的导电部分，包括：硅衬底; 设置在硅基板上的由树脂制成的突起; 第一导电部，设置在突起上并与端子接触; 以及第二导电部，其设置在除了在所述硅基板上具有所述突起的区域以外的区域中，并且与所述第一导电部电连接。

6. 发明授权

US5111363A Mount for electronic parts 失效
标题翻译：电子配件安装
公开(公告)号：US5111363A
公开(公告)日：1992-05-05
申请号：US365116
申请日：1989-06-12
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
IPC分类号： H05K1/09 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/28
CPC分类号： H05K3/284 , H05K1/189 , H05K1/09 , H05K1/118 , H05K2201/0129 , H05K2201/10689 , H05K2201/10924 , H05K2201/10946 , H05K2201/10977 , H05K2201/2009 , H05K2203/1316 , H05K2203/1327 , H05K3/0058 , H05K3/281
摘要： A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.

7. 发明授权

US4746275A Multi-piston swash plate type compressor with internal lubricating arrangement 失效
标题翻译：具有内部润滑装置的多活塞斜盘式压缩机
公开(公告)号：US4746275A
公开(公告)日：1988-05-24
申请号：US944936
申请日：1986-12-22
申请人： Hidekazu Iwamori , Makoto Ohno , Hideo Mori , Shinji Mizuno
发明人： Hidekazu Iwamori , Makoto Ohno , Hideo Mori , Shinji Mizuno
IPC分类号： F04B27/08 , F04B25/04 , F04B27/10 , F04B1/16 , F04B
CPC分类号： F04B27/109
摘要： A multi-piston swash plate type compressor with an internal lubricating arrangement for an air conditioning system used in a vehicle such as an automobile comprises a cylinder block body having a swash plate chamber formed therein for receiving a swash plate, and cylinder bores formed therein for receiving pistons. The compressor has a suction chamber which is fed with a refrigerant including a lubrication oil from an evaporator of the air conditioning system, and a discharge chamber which feeds the compressed refrigerant to a condenser of the air conditioning system. The suction and discharge chambers are communicated with each of the cylinder bores through valves. Passages are formed in the cylinder block body for feeding the refrigerant from the swash plate member to the suction chamber in such a manner that the refrigerant flow is guided to positively lubricate movable parts included in the cylinder block body as a component element of the compressor.
摘要翻译：具有用于诸如汽车的车辆中使用的用于空调系统的内部润滑装置的多活塞斜盘式压缩机包括：缸体，其具有形成在其中的旋转斜盘室，用于容纳斜盘;以及形成在其中的气缸孔，接收活塞。压缩机具有吸入室，该吸入室供给包含来自空调系统的蒸发器的润滑油的制冷剂，以及将压缩的制冷剂供给到空调系统的冷凝器的排出室。抽吸和排出室通过阀与每个气缸孔连通。在气缸体中形成通道，用于将制冷剂从旋转斜盘部件供给到吸入室，使得制冷剂流被引导以积极地润滑包括在气缸体中的可动部件作为压缩机的部件。

8. 发明授权

US07944060B2 Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device 有权
标题翻译：器件封装结构，器件封装方法，液滴喷射头，连接器和半导体器件
公开(公告)号：US07944060B2
公开(公告)日：2011-05-17
申请号：US12543571
申请日：2009-08-19
申请人： Shinji Mizuno , Yoshihide Nishiyama , Eiichi Sato
发明人： Shinji Mizuno , Yoshihide Nishiyama , Eiichi Sato
IPC分类号： H01L23/52 , H01L29/40 , B41J2/05
CPC分类号： B41J2/14233 , B41J2002/14241 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/18 , H01L2224/16145 , H01L2924/09701
摘要： A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.
摘要翻译：一种器件封装结构，包括：具有导电连接部分和电平差部分的基体; 布置在基体上的装置，具有通过基体上的电平差部分与导电连接部电连接的连接端子; 以及电连接所述连接端子和所述导电连接部分的连接器，其具有与所述电平差部分的高度基本相同的高度。

9. 发明申请

US20090277684A1 MOUNTING STRUCTURE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT ONTO CIRCUIT BOARD 失效
标题翻译：将电子元件安装到电路板上的安装结构和方法
公开(公告)号：US20090277684A1
公开(公告)日：2009-11-12
申请号：US12158904
申请日：2006-12-19
申请人： Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
发明人： Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
IPC分类号： H05K5/00 , B29C45/14
CPC分类号： B29C45/14655 , B29C2045/14983 , H01L21/565 , H01L23/3135 , H01L27/14618 , H01L31/0203 , H01L33/483 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K3/326 , H05K2201/09081 , H05K2201/091 , H05K2201/10106 , H05K2201/10636 , H05K2201/10727 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
摘要翻译：电子部件安装结构包括其上形成有端子连接图案的柔性电路板和设置有电极的发光部件。将发光部件放置在柔性电路板上，将合成树脂壳体注射成型以覆盖发光部件和围绕放置在其上的发光部件的柔性电路基板的一部分，由此，柔性电路板的发光部件和端子连接图案彼此抵靠接触地连接。

10. 发明申请

US20050116794A1 Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device 有权
标题翻译：谐振器装置，具有谐振器装置的电子设备和制造谐振器装置的方法
公开(公告)号：US20050116794A1
公开(公告)日：2005-06-02
申请号：US10996380
申请日：2004-11-23
申请人： Shinji Mizuno
发明人： Shinji Mizuno
IPC分类号： H01L21/60 , H03B5/30 , H03H3/02 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/25 , H03H9/54
CPC分类号： H03H9/0547 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/48464 , H01L2224/4903 , H01L2224/49171 , H01L2224/49174 , H01L2224/4942 , H01L2224/49429 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/15787 , H03H9/0533 , H03H9/1014 , H01L2224/45099 , H01L2924/00
摘要： A resonator device includes a resonator supported by a substrate as a base. The resonator is connected to a wire extending from the substrate by wire bonding so as to be suspended in midair and supported over the supporting substrate.
摘要翻译：谐振器装置包括由作为基底的基板支撑的谐振器。谐振器通过引线接合连接到从基板延伸的线，以便悬挂在空中并被支撑在支撑基板上。

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