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1. 发明授权

US5111363A Mount for electronic parts 失效
标题翻译：电子配件安装
公开(公告)号：US5111363A
公开(公告)日：1992-05-05
申请号：US365116
申请日：1989-06-12
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
IPC分类号： H05K1/09 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/28
CPC分类号： H05K3/284 , H05K1/189 , H05K1/09 , H05K1/118 , H05K2201/0129 , H05K2201/10689 , H05K2201/10924 , H05K2201/10946 , H05K2201/10977 , H05K2201/2009 , H05K2203/1316 , H05K2203/1327 , H05K3/0058 , H05K3/281
摘要： A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.

2. 发明授权

US4935718A Molded resin casing of electronic part incorporating flexible board 失效
标题翻译：带柔性板的电子部件的模制树脂外壳
公开(公告)号：US4935718A
公开(公告)日：1990-06-19
申请号：US234952
申请日：1988-08-22
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.

3. 发明授权

US5071611A Method of making molded resin casing of electronic part with flat cable 失效
标题翻译：具有扁平电缆的电子部件的模制树脂铸造方法
公开(公告)号：US5071611A
公开(公告)日：1991-12-10
申请号：US447441
申请日：1989-12-07
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.

4. 发明授权

US4978491A Molded resin casing of electronic part incorporating flexible board 失效
公开(公告)号：US4978491A
公开(公告)日：1990-12-18
申请号：US244165
申请日：1988-09-13
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.

5. 发明授权

US4928082A Molded resin casing of electronic part with flexible flat cable 失效
标题翻译：带柔性扁平电缆的电子部件模制树脂外壳
公开(公告)号：US4928082A
公开(公告)日：1990-05-22
申请号：US234946
申请日：1988-08-22
申请人： Nobuyuki Yagi , Jiro Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiro Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.

6. 发明授权

US5280146A Push-button switch, keytop, and method of manufacturing the keytop 失效
公开(公告)号：US5280146A
公开(公告)日：1994-01-18
申请号：US784000
申请日：1991-10-29
申请人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
发明人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
IPC分类号： B29C45/14 , H01H11/00 , H01H13/705 , H01H3/12
CPC分类号： H01H13/705 , B29C45/1418 , H01H11/00 , B29L2031/466 , H01H2217/028 , H01H2219/05 , H01H2223/002 , H01H2229/047 , H01H2229/048 , H01H2233/004
摘要： The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.

7. 发明授权

US5362934A Push-button switch, keytop, and method of manufacturing the keytop 失效
公开(公告)号：US5362934A
公开(公告)日：1994-11-08
申请号：US46843
申请日：1993-04-14
申请人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
发明人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
IPC分类号： B29C45/14 , H01H11/00 , H01H13/705 , H01H13/14
CPC分类号： H01H13/705 , B29C45/1418 , H01H11/00 , B29L2031/466 , H01H2217/028 , H01H2219/05 , H01H2223/002 , H01H2229/047 , H01H2229/048 , H01H2233/004
摘要： The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.

8. 发明授权

US5362932A Push-button switch, keytop, and method of manufacturing the keytop 失效
标题翻译：按钮开关，键盘和制造键盘的方法
公开(公告)号：US5362932A
公开(公告)日：1994-11-08
申请号：US135428
申请日：1993-10-12
申请人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
发明人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
IPC分类号： B29C45/14 , H01H11/00 , H01H13/705 , H01H3/12
CPC分类号： H01H13/705 , B29C45/1418 , H01H11/00 , B29L2031/466 , H01H2217/028 , H01H2219/05 , H01H2223/002 , H01H2229/047 , H01H2229/048 , H01H2233/004
摘要： The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.
摘要翻译：按钮开关的键顶包括位于树脂膜顶部的键顶部分和位于树脂膜下侧的保持部分。通过树脂模制工艺将键顶部分和保持部分形成为整体，其中树脂通过设置在树脂膜中的孔，使得树脂膜夹在键顶部分和保持部分之间。在另一个实施例中，保持部分是环形的并且通过树脂模制工艺与键顶部分形成为整体，其中树脂以对应于环的图案通过设置在树脂膜中的多个孔形状的圆周。树脂膜在键顶部分和环形保持部分之间以不透水的状态夹持。

9. 发明授权

US06388211B1 Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate 失效
标题翻译：在具有开口的基板上成型模制树脂的方法，具有模制树脂的开关基板，在开关基板上形成开关图案的方法以及开关基板
公开(公告)号：US06388211B1
公开(公告)日：2002-05-14
申请号：US09471376
申请日：1999-12-23
申请人： Osamu Nomura , Nobuyuki Yagi , Kozo Morita
发明人： Osamu Nomura , Nobuyuki Yagi , Kozo Morita
IPC分类号： H01H158
CPC分类号： H01H1/40 , B29C45/14344 , B29C45/14639 , H01H1/403 , H01H11/0056 , H01H2019/006 , H05K3/0014 , H05K3/202 , H05K3/22 , Y10T29/49105
摘要： A substrate (10), a first mold (200) and a second mold (250) are prepared, and a plurality of switch patterns (14), (18) are provided by providing openings (pattern-removal portions) (A) in such a manner that a pattern (11), which has been formed on the surface of the substrate (10), is divided into a plurality of patterns to form A switch substrate. Next, the switch substrate (1) is clamped between the first mold (200) and the second mold (250). At such time, the side of the switch substrate (1) provided with the switch patterns (14), (18) is brought into surface contact with an abutting surface (201) of the first mold (200) and, at the same time, a cavity (253) provided in the second mold (250) opposes the other side of the switch substrate. Next, a molten molding resin is charged into the cavity (253) provided in the second mold (250) to thereby fill the cavity (253) and the openings (A) of the substrate with the molding resin. After the molding resin hardens, the first mold (200) and the second mold (250) are separated and the switch substrate (1), which will have the molding resin case 40 attached thereto, is extracted.
摘要翻译：制备基板（10），第一模具（200）和第二模具（250），并且通过提供多个开关图案（图案去除部分）（A）已经形成在基板（10）的表面上的图案（11）被分成多个图案以形成A开关基板的方式。接下来，将开关基板（1）夹在第一模具（200）和第二模具（250）之间。此时，具有开关图案（14），（18）的开关基板（1）的一侧与第一模具（200）的抵接面（201）表面接触，并且同时设置在第二模具（250）中的空腔（253）与开关基板的另一侧相对。接下来，将熔融成型树脂装入设置在第二模具（250）中的空腔（253）中，从而用模塑树脂填充基板的空腔（253）和开口（A）。在模制树脂硬化之后，分离第一模具（200）和第二模具（250），并且将具有附着于其上的模制树脂壳体40的开关基板（1）被提取。

10. 发明授权

US6023033A Keytop plate and method for producing the same 失效
标题翻译：键盘及其制造方法
公开(公告)号：US6023033A
公开(公告)日：2000-02-08
申请号：US980816
申请日：1997-12-01
申请人： Nobuyuki Yagi , Jiro Inagaki , Tatsuya Okamura
发明人： Nobuyuki Yagi , Jiro Inagaki , Tatsuya Okamura
IPC分类号： B29C45/14 , B29L31/34 , H01H11/00 , H01H13/06 , H01H13/14 , H01H13/702 , H01H13/705 , H01H13/70 , H01H3/12
CPC分类号： H01H13/705 , H01H2219/028 , H01H2219/03 , H01H2219/036 , H01H2221/002 , H01H2221/05 , H01H2223/002 , H01H2229/02 , H01H2229/046 , H01H2229/047 , Y10T29/49105
摘要： A keytop plate comprises keytops (21) formed by integrally molding a molding resin part (25) with a synthetic resin film (23), and a molded elastomer sheet (molded elastomer member) (11) attached to the keytops (21). The molded elastomer sheet (11), other than in the areas to which the keytops (21) are attached, has no through-holes, whereby a water-proof property is provided. The keytops (21) are easily depressed even when the molded elastomer sheet (11) is securely held at its peripheral portion. A hard tactile feeling may be obtained when the keytops (21) are depressed, since the keytops (21) are formed from the synthetic resin film (23) and the molding resin part (25).
摘要翻译：键顶板包括通过将模塑树脂部件（25）与合成树脂薄膜（23）整体模制而形成的键顶（21）和附接到键顶（21）的模制弹性体片（模制弹性体构件）（11）。成型弹性体片（11）除了安装有键顶（21）的区域之外，没有通孔，由此提供防水性。即使当模制的弹性体片（11）被牢固地保持在其周边部分时，键顶（21）也容易被压下。由于键合体（21）由合成树脂薄膜（23）和模塑树脂部件（25）形成，所以当键顶（21）被压下时，可以获得坚硬的触感。

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