专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090269549A1 Anisotropic conductive sheet, production method thereof, connection method and inspection method 失效
标题翻译：各向异性导电片，其制造方法，连接方法及检查方法
公开(公告)号：US20090269549A1
公开(公告)日：2009-10-29
申请号：US11918362
申请日：2006-05-01
申请人： Taro Fujita , Yasuhiro Okuda , Tsuyoshi Haga
发明人： Taro Fujita , Yasuhiro Okuda , Tsuyoshi Haga
IPC分类号： B32B3/26 , B32B3/24 , B23B35/00 , H01R43/00 , G01M19/00
CPC分类号： H01R12/7076 , G01R1/0466 , H01R12/714 , H01R13/035 , Y10T29/49117 , Y10T408/03 , Y10T428/24273 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/249953 , Y10T428/249987 , Y10T428/249988 , Y10T428/249989
摘要： The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film (1) that is made of synthetic resin and that has electrically insulating property. The porous film (1) is provided with a plurality of holes (3) that are formed in the direction of thickness so that pin electrodes (2) can be through-hole-mounted. The inner walls of the holes (3) are coated with metals (4). The inserted pin electrodes (2) become electrically continuous, through the metals (4), with the surface opposite to the surface from which the pin electrodes (2) are inserted. It is desirable that a porous film have, at the side from which the electrodes are through-hole-mounted, a nonporous film that is made of synthetic resin and that has electrically insulating property and the nonporous film be provided with a plurality of holes that are formed in the direction of thickness so that the pin electrodes can be through-hole-mounted.
摘要翻译：本发明提供一种适于与通孔安装型针脚连接的各向异性导电片。片材在厚度方向上具有导电性。片材包括使用由合成树脂制成且具有电绝缘性的多孔膜（1）形成的基膜。多孔膜（1）具有沿厚度方向形成的多个孔（3），使得针电极（2）能够通孔安装。孔（3）的内壁涂有金属（4）。插入的针电极（2）通过金属（4）电连接，其表面与插针电极（2）的表面相反。希望多孔膜在电极通孔安装的一侧具有由合成树脂制成的无孔膜，并且具有电绝缘性，并且无孔膜设置有多个孔，沿厚度方向形成，使得针电极可以通孔安装。

2. 发明授权

US07887899B2 Anisotropic conductive sheet, production method thereof, connection method and inspection method 失效
标题翻译：各向异性导电片，其制造方法，连接方法及检查方法
公开(公告)号：US07887899B2
公开(公告)日：2011-02-15
申请号：US11918362
申请日：2006-05-01
申请人： Taro Fujita , Yasuhiro Okuda , Tsuyoshi Haga
发明人： Taro Fujita , Yasuhiro Okuda , Tsuyoshi Haga
IPC分类号： B32B3/26 , B32B3/24 , B23B35/00 , H01R43/00 , G01M19/00
CPC分类号： H01R12/7076 , G01R1/0466 , H01R12/714 , H01R13/035 , Y10T29/49117 , Y10T408/03 , Y10T428/24273 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/249953 , Y10T428/249987 , Y10T428/249988 , Y10T428/249989
摘要： The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film (1) that is made of synthetic resin and that has electrically insulating property. The porous film (1) is provided with a plurality of holes (3) that are formed in the direction of thickness so that pin electrodes (2) can be through-hole-mounted. The inner walls of the holes (3) are coated with metals (4). The inserted pin electrodes (2) become electrically continuous, through the metals (4), with the surface opposite to the surface from which the pin electrodes (2) are inserted. It is desirable that a porous film have, at the side from which the electrodes are through-hole-mounted, a nonporous film that is made of synthetic resin and that has electrically insulating property and the nonporous film be provided with a plurality of holes that are formed in the direction of thickness so that the pin electrodes can be through-hole-mounted.
摘要翻译：本发明提供一种适于与通孔安装型针脚连接的各向异性导电片。片材在厚度方向上具有导电性。片材包括使用由合成树脂制成且具有电绝缘性的多孔膜（1）形成的基膜。多孔膜（1）具有沿厚度方向形成的多个孔（3），使得针电极（2）能够通孔安装。孔（3）的内壁涂有金属（4）。插入的针电极（2）通过金属（4）电连接，其表面与插针电极（2）的表面相反。希望多孔膜在电极通孔安装的一侧具有由合成树脂制成的无孔膜，并且具有电绝缘性，并且无孔膜设置有多个孔，沿厚度方向形成，使得针电极可以通孔安装。

3. 发明申请

US20060141159A1 Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface 失效
标题翻译：钻孔多孔树脂基材，以及具有导电钻孔内壁表面的多孔树脂基材的制造方法
公开(公告)号：US20060141159A1
公开(公告)日：2006-06-29
申请号：US10559580
申请日：2004-06-04
申请人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
发明人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
IPC分类号： B05D1/40
CPC分类号： B29C44/5618 , B29C67/202 , H05K3/0011 , H05K3/0055 , H05K3/422 , H05K3/426 , H05K2201/0116 , H05K2201/015 , H05K2203/0565 , H05K2203/0769 , H05K2203/1147 , Y10T29/49167
摘要： A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
摘要翻译：一种穿孔多孔树脂基底的制造方法，包括：用液体或溶液浸渍多孔树脂基底的多孔结构的步骤1; 从液体或溶液浸渍形成固体物质的步骤2; 形成从多孔结构体内具有固体物质的多孔树脂基材的第一表面延伸到多孔树脂基材中的第二表面的多个穿孔的步骤3; 和步骤4，熔化或溶解固体物质以将其从多孔结构的内部除去，并且具有导电性的孔的内壁表面的多孔树脂基材的制造方法包括仅选择性地施加催化剂的步骤到穿孔的内壁表面，以将导电金属施加到内壁表面。

4. 发明授权

US08147911B2 Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive. 失效
标题翻译：穿孔多孔树脂基材和多孔树脂基底的生产过程，其内壁表面的穿孔导电。
公开(公告)号：US08147911B2
公开(公告)日：2012-04-03
申请号：US10559580
申请日：2004-06-04
申请人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
发明人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
IPC分类号： B05D1/32 , B05D3/00 , B05D5/00 , H01K3/10
CPC分类号： B29C44/5618 , B29C67/202 , H05K3/0011 , H05K3/0055 , H05K3/422 , H05K3/426 , H05K2201/0116 , H05K2201/015 , H05K2203/0565 , H05K2203/0769 , H05K2203/1147 , Y10T29/49167
摘要： A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
摘要翻译：一种穿孔多孔树脂基底的制造方法，包括：用液体或溶液浸渍多孔树脂基底的多孔结构的步骤1; 从液体或溶液浸渍形成固体物质的步骤2; 形成从多孔结构体内具有固体物质的多孔树脂基材的第一表面延伸到多孔树脂基材中的第二表面的多个穿孔的步骤3; 和步骤4，熔化或溶解固体物质以将其从多孔结构的内部除去，并且具有导电性的孔的内壁表面的多孔树脂基材的制造方法包括仅选择性地施加催化剂的步骤到穿孔的内壁表面以将导电金属施加到内壁表面。

5. 发明申请

US20060251871A1 Anisotropic electrically conductive film and method of producing the same 失效
公开(公告)号：US20060251871A1
公开(公告)日：2006-11-09
申请号：US10551459
申请日：2004-03-12
申请人： Yasuhito Masuda , Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga
发明人： Yasuhito Masuda , Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga
IPC分类号： B32B3/00
CPC分类号： H01L23/4828 , G01R1/0408 , G01R31/2863 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R43/007 , H05K3/4069 , Y10T428/24917 , H01L2924/00
摘要： The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.

6. 发明授权

US07563487B2 Anisotropic electrically conductive film and method of producing the same 失效
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US07563487B2
公开(公告)日：2009-07-21
申请号：US10551459
申请日：2004-03-12
申请人： Yasuhito Masuda , Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga
发明人： Yasuhito Masuda , Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga
IPC分类号： B05D1/00 , B05D1/18
CPC分类号： H01L23/4828 , G01R1/0408 , G01R31/2863 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R43/007 , H05K3/4069 , Y10T428/24917 , H01L2924/00
摘要： The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.
摘要翻译：本发明涉及一种各向异性导电膜及其制造方法，其中使用由合成树脂制成的电绝缘多孔膜作为基膜，并且其中形成能够在膜厚度方向上具有导电性的导电部分形成独立地在基膜的多个位置处，以将穿透从第一表面到第二表面的方式将导电金属粘附到多孔结构的树脂部分上。

7. 发明授权

US07344382B2 Fine terminal, its manufacturing method, and contact sheet 失效
标题翻译：精细终端，其制造方法和接触片
公开(公告)号：US07344382B2
公开(公告)日：2008-03-18
申请号：US10553748
申请日：2004-12-09
申请人： Tsuyoshi Haga
发明人： Tsuyoshi Haga
IPC分类号： H01R12/00
CPC分类号： H01M2/204 , H01M2/30
摘要： A micro terminal for inspection or installation with high connection reliability is provided at lower cost. A micro terminal according to the present invention has electrical conduction between the micro terminal and an electrode of an electronic device or an inspection device and includes a columnar contactor in contact with the electrode. The contactor has a spring structure which is elastically deformed when pressed against the electrode. The contactor includes a protrusion protruding outwardly at its end in contact with the electrode and the shape of the protrusion has a part of a sphere or a part of a paraboloid of revolution.
摘要翻译：以较低的成本提供了具有高连接可靠性的检查或安装微型终端。根据本发明的微型端子在微型端子与电子器件或检查装置的电极之间具有导电性，并且包括与电极接触的柱状接触器。接触器具有弹簧结构，当按压电极时弹性变形。接触器包括在其与电极接触的端部向外突出的突起，并且突起的形状具有球体的一部分或旋转抛物面的一部分。

8. 发明授权

US07151385B2 Contact probe, method of manufacturing the contact probe, and device and method for inspection 有权
标题翻译：接触式探头，接触式探针的制造方法，检测装置及方法
公开(公告)号：US07151385B2
公开(公告)日：2006-12-19
申请号：US10470399
申请日：2002-01-22
申请人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
发明人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
IPC分类号： G01R31/02 , H01K3/10
CPC分类号： G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.
摘要翻译：制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙（522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤仅从图案框架中取出金属层（526）。

9. 发明申请

US20060276044A1 Method for manufacturing metal microstructure 失效
标题翻译：制造金属微观结构的方法
公开(公告)号：US20060276044A1
公开(公告)日：2006-12-07
申请号：US11503303
申请日：2006-08-14
申请人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
发明人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
IPC分类号： G03C5/00 , H01L21/302
CPC分类号： B81C99/0085 , B81C2201/032 , C25D1/003 , H01L21/4821 , H05K3/202 , H05K3/205
摘要： A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.
摘要翻译：一种通过使用树脂模具（13）制造金属微结构（1）的方法。为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上，化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的曝光的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。

10. 发明申请

US20060255815A1 Contact probe and method of manufacturing the same and test apparatus and test method 审中-公开
标题翻译：接触式探头及其制造方法及试验装置及试验方法
公开(公告)号：US20060255815A1
公开(公告)日：2006-11-16
申请号：US11472621
申请日：2006-06-21
申请人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
发明人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.
摘要翻译：制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙（522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤仅从图案框架中取出金属层（526）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式