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    • 1. 发明授权
    • Minimization of mask undercut on deep silicon etch
    • 在深硅蚀刻上最小化掩模底切
    • US08262920B2
    • 2012-09-11
    • US11820334
    • 2007-06-18
    • Tamarak PandhumsopornPatrick ChungJackie SetoS. M. Reza Sadjadi
    • Tamarak PandhumsopornPatrick ChungJackie SetoS. M. Reza Sadjadi
    • C03C15/00
    • H01L21/3086H01L21/31138
    • A method for forming features in a silicon layer is provided. A mask is formed with a plurality of mask openings over the silicon layer. A polymer layer is deposited over the mask by flowing a hydrogen free deposition gas comprising C4F8, forming a plasma from the deposition gas, depositing a polymer from the plasma for at least 20 seconds, and stopping the depositing the polymer after the at least 20 seconds. The deposited polymer layer is opened by flowing an opening gas, forming a plasma from the opening gas which selectively removes the deposited polymer on bottoms of the plurality of mask openings with respect to deposited polymer on sides of the plurality of mask openings, and stopping the opening when at least some of the plurality of mask features are opened. The silicon layer is etched through the mask and deposited polymer layer.
    • 提供了一种在硅层中形成特征的方法。 在硅层上形成有多个掩模开口的掩模。 通过使包含C4F8的无氢沉积气体从沉积气体形成等离子体,从等离子体沉积聚合物至少20秒,并在至少20秒后停止沉积聚合物,沉积聚合物层 。 沉积的聚合物层通过流动开口气体而打开,从开口气体形成等离子体,其在多个掩模开口的侧面上相对于沉积的聚合物选择性地去除多个掩模开口的底部上沉积的聚合物,并且停止 当多个掩模特征中的至少一些被打开时打开。 通过掩模蚀刻硅层并沉积聚合物层。
    • 2. 发明申请
    • MINIMIZATION OF MASK UNDERCUT ON DEEP ETCH
    • 深层蚀刻掩蔽最小化
    • US20120298301A1
    • 2012-11-29
    • US13572061
    • 2012-08-10
    • Tamarak PandhumsopornPatrick ChungJackie SetoS. M. Reza Sadjadi
    • Tamarak PandhumsopornPatrick ChungJackie SetoS. M. Reza Sadjadi
    • C23F1/08
    • H01L21/3086H01L21/31138
    • A method for forming features in a silicon layer is provided. A mask is formed with a plurality of mask openings over the silicon layer. A polymer layer is deposited over the mask by flowing a hydrogen free deposition gas comprising C4F8, forming a plasma from the deposition gas, depositing a polymer from the plasma for at least 20 seconds, and stopping the depositing the polymer after the at least 20 seconds. The deposited polymer layer is opened by flowing an opening gas, forming a plasma from the opening gas which selectively removes the deposited polymer on bottoms of the plurality of mask openings with respect to deposited polymer on sides of the plurality of mask openings, and stopping the opening when at least some of the plurality of mask features are opened. The silicon layer is etched through the mask and deposited polymer layer.
    • 提供了一种在硅层中形成特征的方法。 在硅层上形成有多个掩模开口的掩模。 通过使包含C4F8的无氢沉积气体从沉积气体形成等离子体,从等离子体沉积聚合物至少20秒,并在至少20秒后停止沉积聚合物,沉积聚合物层 。 沉积的聚合物层通过流动开口气体而打开,从开口气体形成等离子体,其在多个掩模开口的侧面上相对于沉积的聚合物选择性地去除多个掩模开口的底部上沉积的聚合物,并且停止 当多个掩模特征中的至少一些被打开时打开。 通过掩模蚀刻硅层并沉积聚合物层。
    • 3. 发明申请
    • Minimization of mask undercut on deep silicon etch
    • 在深硅蚀刻上最小化掩模底切
    • US20080308526A1
    • 2008-12-18
    • US11820334
    • 2007-06-18
    • Tamarak PandhumsopornPatrick ChungJackie SetoS.M. Reza Sadjadi
    • Tamarak PandhumsopornPatrick ChungJackie SetoS.M. Reza Sadjadi
    • H01L21/3065B44C1/22
    • H01L21/3086H01L21/31138
    • A method for forming features in a silicon layer is provided. A mask is formed with a plurality of mask openings over the silicon layer. A polymer layer is deposited over the mask by flowing a hydrogen free deposition gas comprising C4F8, forming a plasma from the deposition gas, depositing a polymer from the plasma for at least 20 seconds, and stopping the depositing the polymer after the at least 20 seconds. The deposited polymer layer is opened by flowing an opening gas, forming a plasma from the opening gas which selectively removes the deposited polymer on bottoms of the plurality of mask openings with respect to deposited polymer on sides of the plurality of mask openings, and stopping the opening when at least some of the plurality of mask features are opened. The silicon layer is etched through the mask and deposited polymer layer.
    • 提供了一种在硅层中形成特征的方法。 在硅层上形成有多个掩模开口的掩模。 通过使包含C4F8的无氢沉积气体从沉积气体形成等离子体,从等离子体沉积聚合物至少20秒,并在至少20秒后停止沉积聚合物,沉积聚合物层 。 沉积的聚合物层通过流动开口气体而打开,从开口气体形成等离子体,其在多个掩模开口的侧面上相对于沉积的聚合物选择性地去除多个掩模开口的底部上沉积的聚合物,并且停止 当多个掩模特征中的至少一些被打开时打开。 通过掩模蚀刻硅层并沉积聚合物层。
    • 4. 发明申请
    • DYNAMIC COMPONENT-TRACKING SYSTEM AND METHODS THEREFOR
    • 动态组件跟踪系统及其方法
    • US20080082579A1
    • 2008-04-03
    • US11537517
    • 2006-09-29
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • G06F17/00
    • G05B19/418Y02P90/02Y02P90/205Y02P90/86Y10S707/99943Y10S707/99945
    • A computer-implemented method for facilitating plasma processing tool component management across plurality of tools is provided. The method includes receiving first component data for first plurality of components, including identification and usage history, at first database associated with first tool. The method also includes receiving second component data for second plurality of components at second database associated with second tool, which is different from first tool. The method further includes synchronizing first and second component data with third database. The synchronizing includes synchronizing between third database and at least one of first and second database rules that govern usage of at least one component of first and second plurality of components. The third database is coupled to exchange data with plurality of tools. The method yet also includes obtaining information, using rules and usage history data about given component prior to performing one of replacement, analysis, and maintenance.
    • 提供了一种用于促进跨多个工具的等离子体处理工具部件管理的计算机实现的方法。 该方法包括在与第一工具相关联的第一数据库处接收包括标识和使用历史的第一多个组件的第一组件数据。 该方法还包括在与第二工具相关联的第二数据库处接收与第一工具不同的第二多个组件的第二组件数据。 该方法还包括将第一和第二组件数据与第三数据库同步。 同步包括在第三数据库与管理第一和第二多个组件的至少一个组件的使用的第一和第二数据库规则中的至少一个之间进行同步。 第三数据库被耦合以与多个工具交换数据。 该方法还包括在执行替换,分析和维护之前获得信息,使用关于给定组件的规则和使用历史数据。
    • 5. 发明授权
    • Component-tracking system and methods therefor
    • 组件跟踪系统及其方法
    • US08010483B2
    • 2011-08-30
    • US12869016
    • 2010-08-26
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • G06F17/00
    • G05B19/418Y02P90/02Y02P90/205Y02P90/86Y10S707/99943Y10S707/99945
    • A system for facilitating plasma processing tool component management across plurality of tools is provided. The system includes means for receiving first component data for first plurality of components, including identification and usage history for a first plurality of components, at first database associated with first tool. The system also includes means for receiving second component data for second plurality of components at second database associated with second tool, which is different from first tool. The system further includes means for synchronizing first and second component data with third database. The synchronizing includes synchronizing between third database and at least one of first and second database rules that govern usage of at least one component of first and second plurality of components. The third database is coupled to exchange data with plurality of tools. The system yet also includes means for obtaining information, using rules and usage history data about given component prior to performing one of replacement, analysis, and maintenance.
    • 提供了一种用于促进跨多个工具的等离子体处理工具部件管理的系统。 该系统包括用于在与第一工具相关联的第一数据库处接收用于第一多个组件的第一组件数据的装置,包括用于第一多个组件的标识和使用历史。 该系统还包括用于在与第二工具相关联的第二数据库处接收与第一工具不同的第二数据组件的第二组件数据的装置。 该系统还包括用于将第一和第二组件数据与第三数据库同步的装置。 同步包括在第三数据库与管理第一和第二多个组件的至少一个组件的使用的第一和第二数据库规则中的至少一个之间进行同步。 第三数据库被耦合以与多个工具交换数据。 该系统还包括在执行替换,分析和维护之前获得信息,使用关于给定组件的规则和使用历史数据的装置。
    • 8. 发明申请
    • COMPONENT-TRACKING SYSTEM AND METHODS THEREFOR
    • 组件跟踪系统及其方法
    • US20100325084A1
    • 2010-12-23
    • US12869016
    • 2010-08-26
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • G06F17/00G06F17/30
    • G05B19/418Y02P90/02Y02P90/205Y02P90/86Y10S707/99943Y10S707/99945
    • A system for facilitating plasma processing tool component management across plurality of tools is provided. The system includes means for receiving first component data for first plurality of components, including identification and usage history for a first plurality of components, at first database associated with first tool. The system also includes means for receiving second component data for second plurality of components at second database associated with second tool, which is different from first tool. The system further includes means for synchronizing first and second component data with third database. The synchronizing includes synchronizing between third database and at least one of first and second database rules that govern usage of at least one component of first and second plurality of components. The third database is coupled to exchange data with plurality of tools. The system yet also includes means for obtaining information, using rules and usage history data about given component prior to performing one of replacement, analysis, and maintenance.
    • 提供了一种用于促进跨多个工具的等离子体处理工具部件管理的系统。 该系统包括用于在与第一工具相关联的第一数据库处接收用于第一多个组件的第一组件数据的装置,包括用于第一多个组件的标识和使用历史。 该系统还包括用于在与第二工具相关联的第二数据库处接收与第一工具不同的第二数据组件的第二组件数据的装置。 该系统还包括用于将第一和第二组件数据与第三数据库同步的装置。 同步包括在第三数据库与管理第一和第二多个组件的至少一个组件的使用的第一和第二数据库规则中的至少一个之间进行同步。 第三数据库被耦合以与多个工具交换数据。 该系统还包括在执行替换,分析和维护之前获得信息,使用关于给定组件的规则和使用历史数据的装置。
    • 9. 发明授权
    • Dynamic component-tracking system and methods therefor
    • 动态组件跟踪系统及其方法
    • US07814046B2
    • 2010-10-12
    • US11537517
    • 2006-09-29
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • Chung-Ho HuangHae-Pyng JeaTung HsuJackie Seto
    • G06F17/00
    • G05B19/418Y02P90/02Y02P90/205Y02P90/86Y10S707/99943Y10S707/99945
    • A computer-implemented method for facilitating plasma processing tool component management across plurality of tools is provided. The method includes receiving first component data for first plurality of components, including identification and usage history, at first database associated with first tool. The method also includes receiving second component data for second plurality of components at second database associated with second tool, which is different from first tool. The method further includes synchronizing first and second component data with third database. The synchronizing includes synchronizing between third database and at least one of first and second database rules that govern usage of at least one component of first and second plurality of components. The third database is coupled to exchange data with plurality of tools. The method yet also includes obtaining information, using rules and usage history data about given component prior to performing one of replacement, analysis, and maintenance.
    • 提供了一种用于促进跨多个工具的等离子体处理工具部件管理的计算机实现的方法。 该方法包括在与第一工具相关联的第一数据库处接收包括标识和使用历史的第一多个组件的第一组件数据。 该方法还包括在与第二工具相关联的第二数据库处接收与第一工具不同的第二多个组件的第二组件数据。 该方法还包括将第一和第二组件数据与第三数据库同步。 同步包括在第三数据库与管理第一和第二多个组件的至少一个组件的使用的第一和第二数据库规则中的至少一个之间进行同步。 第三数据库被耦合以与多个工具交换数据。 该方法还包括在执行替换,分析和维护之前获得信息,使用关于给定组件的规则和使用历史数据。