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    • 1. 发明授权
    • Optical semiconductor device with InP
    • 带InP的光学半导体器件
    • US5912475A
    • 1999-06-15
    • US767924
    • 1996-12-17
    • Takushi ItagakiDaisuke SuzukiTatsuya Kimura
    • Takushi ItagakiDaisuke SuzukiTatsuya Kimura
    • G02F1/025H01S5/00H01S5/0625H01L33/00
    • H01S5/06258
    • An optical semiconductor device includes an n-type InP substrate having top and bottom surfaces; a stripe-shaped mesa structure including an n-type cladding layer, a multi quantum well layer, and a p-type first upper cladding layer disposed on the top surface of the substrate; a first layer of a semi-insulating material, an n-type InP hole blocking layer having a carrier concentration equal to or less than 4.times.10.sup.18 cm.sup.-3 and more than 1.times.10.sup.18 cm.sup.-3, and a second layer of the semi-insulating material disposed burying the mesa structure; a second p-type cladding layer and a p-type contact layer disposed on the mesa structure and on the second layer of the semi-insulating material, and p side electrodes spaced from each other in a stripe direction of the mesa structure, disposed on the p-type contact layer; and an n side electrode disposed on the bottom surface of the substrate. Therefore, an optical semiconductor device is available which has superior element isolation characteristics and broad modulation bandwidth, and enables the individual elements to operate with the utmost performance.
    • 光学半导体器件包括具有顶表面和底表面的n型InP衬底; 包括n型包覆层,多量子阱层和设置在衬底的顶表面上的p型第一上包层的条状台面结构; 半绝缘材料的第一层,载流子浓度等于或小于4×10 18 cm -3且大于1×10 18 cm -3的n型InP空穴阻挡层和设置在所述半绝缘材料上的第二层 埋葬台面结构; 设置在半绝缘材料的台面结构和第二层上的第二p型覆层和p型接触层,以及在台面结构的条带方向上彼此隔开的p侧电极,设置在 p型接触层; 以及设置在基板的底面上的n侧电极。 因此,可获得具有优异的元件隔离特性和宽调制带宽的光学半导体器件,并且能够使各个元件以最大的性能进行操作。
    • 3. 发明授权
    • Semiconductor laser
    • 半导体激光器
    • US5805629A
    • 1998-09-08
    • US747050
    • 1996-11-12
    • Masayoshi TakemiTatsuya KimuraDaisuke SuzukiTetsuo ShibaKimitaka Shibata
    • Masayoshi TakemiTatsuya KimuraDaisuke SuzukiTetsuo ShibaKimitaka Shibata
    • H01L21/20H01S5/00H01S5/20H01S5/22H01S5/227H01S5/323H01S3/19
    • H01S5/227H01S5/2081H01S5/2201H01S5/2206H01S5/2275H01S5/32391
    • A semiconductor device includes a p type InP substrate with a (001) surface; a mesa structure formed by dry etching, extending along a direction, including semiconductor layers, having (110) side surfaces, and a height H.sub.m ; and mesa burying layers including a p type InP burying layer on the (110) side surfaces and the (001) surface, the p type InP burying layer having a thickness D.sub.p, and an n type InP burying layer on the p type InP burying layer. An angle between a (111)B surface and (001) surface is .theta..sub.111, the growth rates on the (110) side surfaces and on the (001) surface are respectively R.sub.g (110) and R.sub.g (001), an angle .theta. is tan .theta.=R.sub.g (110)/R.sub.g (001) and the critical thickness D.sub.n of the n type InP burying layer on the (001) surface when the n type InP burying layer is not grown on the (111)B surface is ##EQU1## The n type InP burying layer has a thickness D.ltoreq.D.sub.n. The leakage current path width is narrowed and contact of the n type InP burying layer and an uppermost layer of the semiconductor layers is avoided. Consequently, a semiconductor device having reduced leakage current and superior device characteristics is obtained.
    • 半导体器件包括具有(001)表面的p型InP衬底; 通过干蚀刻形成的台面结构,沿着<110>方向延伸,包括具有(1 + E,ov 1 + EE 0)侧表面的半导体层和高度Hm; (1 + E,ovs 1 + EE 0)侧表面和(001)表面的p型InP掩埋层和具有厚度Dp的p型InP掩埋层和n型InP掩埋层的台面掩埋层 在p型InP埋层中。 (111)B表面和(001)表面之间的角度为θ111,(1 + E,ovs 1 + EE 0)侧表面和(001)表面上的生长速率分别为Rg(1 + E ,ovs 1 + EE 0)和Rg(001),角度θ为tanθ= Rg(1 + E,ovs 1 + EE 0)/ Rg(001)和n型InP掩埋层的临界厚度Dn 在(111)B表面上未生长n型InP掩埋层时,(001)表面是n型InP掩埋层,其厚度D
    • 5. 发明授权
    • Key information generation device and key information generation method
    • 关键信息生成装置及关键信息生成方法
    • US09391772B2
    • 2016-07-12
    • US14115251
    • 2011-06-02
    • Daisuke Suzuki
    • Daisuke Suzuki
    • H04L9/10H04L9/08H04L9/32G06F12/14G11B20/00G06F21/50G06F21/70
    • H04L9/0866G06F12/14G06F21/50G06F21/70G06F2221/21G11B20/00086H04L9/3278
    • In initial generation (for example, shipping from the factory), a security device generates an identifier w specific to the security device, with the PUF technology, generates key information k (k=HF(k)) from the identifier w, generates encrypted confidential information x by encrypting (x=Enc(mk, k)) confidential information mk with the key information k, and stores the encrypted confidential information x and an authentication code h (h=HF′(k)) of the key information k, in a nonvolatile memory. In operation, the security device generates the identifier w with the PUF technology, generates the key information k from the identifier w, and decrypts the encrypted confidential information x with the key information k. At a timing where the identifier w is generated in the operation, the security device checks whether the current operating environment has largely changed from the initial generation (S311). If a change in operating environment is detected (S311→S312), the security device conducts a reset-up process (S312 to S315) of an authentication code h which is confidential information, and the encrypted confidential information x.
    • 在初始阶段(例如,出厂时),安全设备生成特定于安全设备的标识符w,利用PUF技术,从标识符w生成密钥信息k(k = HF(k)),生成加密 机密信息x通过用密钥信息k加密(x = Enc(mk,k))机密信息mk,并且将加密的机密信息x和密钥信息k的认证码h(h = HF'(k))存储 ,在非易失性存储器中。 在操作中,安全设备利用PUF技术生成标识符w,从标识符w生成密钥信息k,并用密钥信息k对加密的机密信息进行解密。 在操作中生成标识符w的定时,安全装置检查当前的操作环境是否从初始生成发生了很大的变化(S311)。 如果检测到操作环境发生变化(S311→S312),则安全装置进行作为机密信息的认证码h的复位处理(S312〜S315)和加密的机密信息x。