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1. 发明授权

US4467027A Process of developing posi-type lithographic printing plate with inorganic alkali solution 失效
标题翻译：用无机碱溶液开发posi型平版印刷版的工艺
公开(公告)号：US4467027A
公开(公告)日：1984-08-21
申请号：US380119
申请日：1982-05-20
申请人： Takeshi Yamamoto , Kiyoshi Goto , Yoshio Kurita , Noriyasu Kita , Naoshi Kunieda
发明人： Takeshi Yamamoto , Kiyoshi Goto , Yoshio Kurita , Noriyasu Kita , Naoshi Kunieda
IPC分类号： G03F7/30 , G03C1/72 , G03C5/18 , G03F7/016 , G03F7/022 , G03F7/32 , G03F7/08
CPC分类号： G03F7/322
摘要： A developer composition of an alkaline aqueous solution containing a reducing inorganic salt, typically an alkali metal salt of sulfurous acid such as sodium sulfite, is found to be applicable for development of a lithographic printing plate material containing a photosensitive o-quinonediazide compound and an organic polymer, with reduced deterioration in developing capacity caused by the air and enhanced stability with lapse of time. In particular, a developer composition composed of an alkaline aqueous solution of pH 11 or higher containing a water-soluble sulfurous acid salt is effective for developing both of a lithographic printing plate material having a nega-type photosensitive layer containing a photosensitive diazo compound and an organic polymer, and a lithographic printing plate material having a posi-type photosensitive layer containing an o-quinonediazide compound and an organic polymer.
摘要翻译：发现含有还原性无机盐（通常是亚硫酸的碱金属盐如亚硫酸钠）的碱性水溶液的显影剂组合物可用于显影含有光敏邻醌二叠氮化合物和有机物的平版印刷版材料聚合物，由空气引起的显影容量的劣化降低，并且随着时间的推移增加了稳定性。特别地，由含有水溶性亚硫酸盐的pH11以上的碱性水溶液构成的显影剂组合物对于显影含有感光性重氮化合物的负型感光层的平版印刷版材料和有机聚合物和具有含有邻醌二叠氮化合物和有机聚合物的posi型感光层的平版印刷版材料。

2. 发明授权

US4176361A Ink composition for ink jet printing 失效
标题翻译：用于喷墨印刷的油墨组合物
公开(公告)号：US4176361A
公开(公告)日：1979-11-27
申请号：US685629
申请日：1976-05-12
申请人： Hiroh Kawada , Kiyoshi Goto , Yoshio Kurita
发明人： Hiroh Kawada , Kiyoshi Goto , Yoshio Kurita
IPC分类号： B41J2/01 , C09D11/00 , G01D9/00 , G01D15/20
CPC分类号： C09D11/30
摘要： Disclosed is an aqueous ink composition useful for ink jet printing, which comprises 2-12 wt % of a water soluble dye, 35-80 wt % of a polyhydric alcohol having 2-6 carbon atoms.
摘要翻译：公开了一种用于喷墨印刷的水性油墨组合物，其包含2-12重量％的水溶性染料，35-80重量％的具有2-6个碳原子的多元醇。

3. 发明授权

US4945398A Overcurrent preventive diode 失效
标题翻译：过流保护二极管
公开(公告)号：US4945398A
公开(公告)日：1990-07-31
申请号：US421761
申请日：1989-10-16
申请人： Yoshio Kurita , Katsuhiro Takami , Kenji Tanaka , Yuji Kosumi
发明人： Yoshio Kurita , Katsuhiro Takami , Kenji Tanaka , Yuji Kosumi
IPC分类号： H01L23/48 , H01H85/02 , H01H85/041 , H01L23/58 , H01L23/62
CPC分类号： H01H85/0411 , H01L23/62 , H01H2085/0034 , H01H85/0241 , H01L2224/48091 , H01L2224/4826 , H01L2924/181
摘要： An overcurrent preventive diode comprises a diode chip sandwiched between respective bonding ends of first and second leads. The bonding end of the first lead is directly bonded to the diode chip into electrical conduction while being also kept in heat conduction with the chip. The bonding end of the second lead is held in heat conduction with the diode chip via a thin electrical insulating layer. The bonding end of the second lead and the insulating layer are shaped to expose an electrical connecting portion of the chip, thereby enabling the second lead bonding end to be electrically connected to the chip through a fusing wire which is designed to be melt-cut upon passage of a predetermined overcurrent.

4. 发明授权

US4229514A Photosensitive composition 失效
标题翻译：感光组合物
公开(公告)号：US4229514A
公开(公告)日：1980-10-21
申请号：US974431
申请日：1978-12-29
申请人： Yoshio Kurita , Akio Iwaki
发明人： Yoshio Kurita , Akio Iwaki
IPC分类号： G03F7/012 , G03C1/52 , G03C1/68
CPC分类号： G03F7/012
摘要： A composition containing a photosensitive polymer which becomes insoluble by a light exposure and particularly to a highly photosensitive composition which comprises a photosensitive polymer having in the structure as photosensitive groups both an a,B-unsaturated ketone group having a cyano group at the a-position and an azide group.
摘要翻译：一种含有光敏聚合物的组合物，特别涉及一种高光敏性组合物，该组合物包含具有在a位具有氰基的α，β-不饱和酮基的感光性结构的感光性聚合物，和叠氮基。

5. 发明授权

US4989845A Pellet accommodating and aligning jig 失效
标题翻译：颗粒容纳和对准夹具
公开(公告)号：US4989845A
公开(公告)日：1991-02-05
申请号：US447826
申请日：1989-12-08
申请人： Yoshio Kurita
发明人： Yoshio Kurita
IPC分类号： H01L21/673 , H01L21/68
CPC分类号： H01L21/67333 , H01L21/68 , H01L2221/68313 , Y10T29/49998
摘要： A pellet accommodating and aligning jig includes an upper portion having an upper surface in which a plurality of pellet accommodating recesses are formed, and a lower portion having a lower surface. A first through-bore extends between the bottom of each of the pellet accommodating recesses and the lower surface. The end of the first through-bore adjacent the bottom of the recesses constitutes a vacuum exhaust inlet and the end adjacent the lower surface constitutes a vacuum exhaust outlet. Pellets placed in the pellet accommodating recesses are attracted toward the bottoms of the recesses when air is evacuated from the vacuum exhaust inlets of the first through-bores towards the vacuum exhaust outlets. The pellet accommodating and aligning jig further includes a micromesh member formed with a plurality of independent second through-bores each having a diameter smaller than that of each first through-bore, and disposed at the bottom of each of the pellet accommodating recesses.

6. 发明授权

US4251619A Process for forming photo-polymeric image 失效
标题翻译：形成光聚合物图像的方法
公开(公告)号：US4251619A
公开(公告)日：1981-02-17
申请号：US105540
申请日：1979-12-20
申请人： Yoshio Kurita
发明人： Yoshio Kurita
IPC分类号： G03F7/26 , G03F7/004 , G03F7/023 , G03F7/027 , G03F7/033 , G03F7/038 , G03F7/105 , G03F7/20 , H05K3/00 , G03C5/04 , G03C1/68
CPC分类号： G03F7/0381 , G03F7/023 , G03F7/105 , G03F7/027 , G03F7/033 , Y10S522/91
摘要： This invention relates to a process for forming photo-polymerized images in light sensitive layers containing an activated component, a light sensitive resin and a colorable or decolorable component. Upon exposure to activating radiation the colored component is decolored or the decolorable component is colored and the energy involved is transferred to the light sensitive resin for polymerization.
摘要翻译：本发明涉及在含有活化成分，光敏树脂和可着色或不可剥离成分的光敏层中形成光聚合图像的方法。暴露于活化辐射后，着色组分脱色或不可脱色组分着色，所涉及的能量转移到光敏树脂进行聚合。

7. 发明授权

US4201083A Velocity detecting apparatus 失效
标题翻译：速度检测装置
公开(公告)号：US4201083A
公开(公告)日：1980-05-06
申请号：US912954
申请日：1978-06-06
申请人： Yoshio Kurita , Yukitake Shibata
发明人： Yoshio Kurita , Yukitake Shibata
IPC分类号： G01F1/712 , G01F1/708 , G01P3/80 , G01P5/18 , G01P5/22 , G01F1/70
CPC分类号： G01P5/18 , G01F1/7082
摘要： Noise signals from a relatively moving object, such as those caused by eddies in a fluid or by protrusions and recesses or gradation on the surface of paper or an iron plate, are sensed at two or more points spaced in the direction of the motion. A difference signal is then obtained from the resulting two noise signals. The relative velocity of the object is detected from the difference signal by utilizing the autocorrelation function or the frequency spectrum of the difference signal.
摘要翻译：来自相对运动的物体的噪声信号，例如由流体中的涡流引起的噪声信号，或者纸张表面或铁板上的突起和凹陷或灰度等，在运动方向间隔开的两个或多个点处被感测。然后从所得到的两个噪声信号中获得差分信号。通过利用差分信号的自相关函数或频谱从差分信号检测物体的相对速度。

8. 发明授权

US5221641A Process for making light emitting diodes 失效
标题翻译：制造发光二极管的工艺
公开(公告)号：US5221641A
公开(公告)日：1993-06-22
申请号：US888509
申请日：1992-05-27
申请人： Yoshio Kurita , Yuji Sakamoto , Atsushi Imai
发明人： Yoshio Kurita , Yuji Sakamoto , Atsushi Imai
IPC分类号： H01L33/52 , H01L33/62
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01078 , H01L2924/12041 , H01L33/52
摘要： A process is provided for making light emitting diodes by using wire segments each plated with a glossy metal. The process comprises the steps of bending each wire segment generally into a U-shape to have a pair of legs connected together by an integral connecting web, deforming the free end of one leg by transverse compression to provide a cup end, mounting a semiconductor chip in the cup end, connecting the semiconductor chip to the free end of the other leg through a wire, forming a transparent or semitransparent resin package to enclose the respective free ends of the paired legs, and cutting the connecting web off the wire segment.

9. 发明授权

US5208481A Lead-frame for manufacturing semiconductor devices 失效
标题翻译：用于制造半导体器件的引线框架
公开(公告)号：US5208481A
公开(公告)日：1993-05-04
申请号：US728350
申请日：1991-07-11
申请人： Yoshio Kurita , Akira Akamatsu
发明人： Yoshio Kurita , Akira Akamatsu
IPC分类号： H01L21/48 , H01L23/495
CPC分类号： H01L21/4842 , H01L23/49562 , H01L2924/0002
摘要： A leadframe facilitates the bonding of leads to semiconductor chips. The leadframe has two longitudinal bands transversely spaced from each other, and connected by bar-like segments initially non-perpendicular to the bands, and spaced longitudinally along the leadframe. The leadframe also includes leads projecting from both of the bands, the leads projecting from one band being interleaved with those projecting from the other band. When one moves the longitudinal bands relative to each other longitudinally, the leads projecting from the first band come into alignment with the leads projecting from the second band. Thus, if one has first bonded semiconductor chips to the ends of the leads projecting from the first band, then movement of the bands longitudinally makes it easy to connect the second leads to each of the semiconductor chips.
摘要翻译：引线框有助于引线与半导体芯片的接合。引线框架具有彼此横向间隔开的两个纵向带，并且通过最初非垂直于带的条状部分连接并且沿引线框架纵向间隔开。引线框还包括从两个带突出的引线，从一个带突出的引线与从另一个带突出的引线交错。当纵向相对于彼此相对移动时，从第一带突出的引线与从第二带突出的引线对准。因此，如果将第一接合的半导体芯片连接到从第一带突出的引线的端部，则纵向的带的移动使得容易将第二引线连接到每个半导体芯片。

10. 发明授权

US5068206A Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor 失效
标题翻译：制造半导体器件的方法及其衍射装置及其衍射装置
公开(公告)号：US5068206A
公开(公告)日：1991-11-26
申请号：US625536
申请日：1990-12-11
申请人： Yoshio Kurita , Akira Akamatsu
发明人： Yoshio Kurita , Akira Akamatsu
IPC分类号： H01L21/48 , H01L23/495
CPC分类号： H01L21/4842 , H01L23/49562 , H01L24/01 , H01L2924/181 , Y10T29/41 , Y10T29/49121 , Y10T29/53178
摘要： The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cuase the pair of leads to move toward each other, so that a semicondductor chip is sandwiched between the pair of leads for bonding.

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