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    • 4. 发明申请
    • FILM THICKNESS MEASURING DEVICE AND FILM THICKNESS MEASURING METHOD
    • 薄膜厚度测量装置和薄膜厚度测量方法
    • US20110032541A1
    • 2011-02-10
    • US12904494
    • 2010-10-14
    • Takeo YAMADATakeshi YAMAMOTOTakahiro YAMAKURAShinji HAYASHIShingo KAWAI
    • Takeo YAMADATakeshi YAMAMOTOTakahiro YAMAKURAShinji HAYASHIShingo KAWAI
    • G01B11/28
    • G01N21/55G01B11/0625
    • A film thickness measuring device is provided with a light source, a spectroscopic sensor, a processor, and a storage unit, and configured in such a manner that light from the light source vertically enters a plane to be measured provided with a film and the light reflected by the plane to be measured enters the spectroscopic sensor. The storage unit stores theoretical values of reflectivity distributions of respective film thicknesses and theoretical values of color characteristic variables of the respective film thicknesses. The processor finds the thickness of the film of the plane to be measured from the reflectivity distribution measured by the spectroscopic sensor by using the theoretical values of the reflectivity distributions of the respective film thicknesses or the theoretical values of the color characteristic variables of the respective film thicknesses stored in the storage unit.
    • 膜厚测量装置设置有光源,光谱传感器,处理器和存储单元,并且被配置为使得来自光源的光垂直进入设置有被膜的待测平面,并且光 由待测平面反射的光进入光谱传感器。 存储单元存储各个膜厚度的各个膜厚度的反射率分布和各个膜厚度的色彩特性变量的理论值的理论值。 处理器通过使用各个膜厚度的反射率分布的理论值或各个膜的颜色特性变量的理论值,从由光谱传感器测量的反射率分布来求出要测量的平面的膜的厚度 存储在存储单元中的厚度。
    • 5. 发明申请
    • IMAGING APPARATUS AND METHOD OF DRIVING SOLID-STATE IMAGING DEVICE
    • 成像装置和驱动固态成像装置的方法
    • US20090040353A1
    • 2009-02-12
    • US12184787
    • 2008-08-01
    • Takeshi YAMAMOTO
    • Takeshi YAMAMOTO
    • H04N5/335
    • H04N9/045
    • A solid-state imaging device includes plural color detection pixels (R, G, B) and plural luminance detection pixels (W). The color detection pixels (R, G, B) and the luminance detection pixels (W) are mixed and arranged in a two-dimensional array on a surface of a semiconductor substrate. The solid state imaging device is configured to read detection signals of the color detection pixels (R, G, B) and detection signals of the luminance detection pixels (W) independently. In driving of the solid-state imaging device, a first time period from a time when the color detection pixels (R, G, B) start to be exposed to a time when the detection signals are read and a second time period from a time when the luminance detection pixels (W) start to be exposed to a time when the detection signals are read are controlled independently.
    • 固态成像装置包括多个颜色检测像素(R,G,B)和多个亮度检测像素(W)。 颜色检测像素(R,G,B)和亮度检测像素(W)在二维阵列中混合并排列在半导体衬底的表面上。 固态成像装置被配置为独立地读取亮度检测像素(W)的颜色检测像素(R,G,B)和检测信号的检测信号。 在驱动固态成像装置时,从颜色检测像素(R,G,B)开始暴露于检测信号被读取的时间开始的时间的第一时间段和从时间开始的第二时间段 当亮度检测像素(W)开始暴露于读取检测信号的时间时被独立地控制。