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1. 发明授权

US08465011B2 Fixing jig and method of processing work 有权
标题翻译：固定夹具及加工工艺方法
公开(公告)号：US08465011B2
公开(公告)日：2013-06-18
申请号：US12452647
申请日：2008-07-31
申请人： Takeshi Segawa , Kiyofumi Tanaka
发明人： Takeshi Segawa , Kiyofumi Tanaka
IPC分类号： H01L21/683 , B25B11/00
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T29/49998 , Y10T156/1132
摘要： A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work. The jig main body (2) has formed therein a suction hole (8) which opens into an outer surface on the side of the close contact layer (3) but which is not communicated with the partitioned space (6). A through hole (9) in communication with the suction hole (8) is formed in the close contact layer (3). A suction force is applied to the work W by evacuation of the suction hole (8).
摘要翻译：固定夹具由能够可拆卸地保持工件（W）紧密接触的板状夹具主体（2）和紧密接触层（3）构成。夹具主体在其一个表面上具有多个支撑突起（4）以支撑紧密接触层; 并且沿着所述一个表面的外周部分具有与所述支撑突起基本相同的高度的侧壁（5）。紧密接触层粘附到侧壁的端面，从而在紧密接触层和夹具主体之间限定分隔空间（6）。通过在夹具主体中形成的通气孔（7）吸入分隔空间内的空气，使紧密接触层发生变形。因此，在对作业施加力的处理中，确实地支撑和固定工件。夹具主体（2）上形成有向密闭接触层（3）侧的外表面开口但不与分隔空间（6）连通的吸入孔（8）。在紧密接触层（3）中形成有与抽吸孔（8）连通的通孔（9）。通过抽吸吸入孔（8）将吸力施加到工件W。

2. 发明申请

US20090081852A1 HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权
标题翻译：控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法
公开(公告)号：US20090081852A1
公开(公告)日：2009-03-26
申请号：US12282984
申请日：2007-03-09
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L21/304 , B24B41/06
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

3. 发明授权

US07875501B2 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
标题翻译：保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法
公开(公告)号：US07875501B2
公开(公告)日：2011-01-25
申请号：US12282984
申请日：2007-03-09
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

4. 发明授权

US08212345B2 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
标题翻译：保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法
公开(公告)号：US08212345B2
公开(公告)日：2012-07-03
申请号：US12945078
申请日：2010-11-12
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L23/02
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

5. 发明申请

US20110281509A1 HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权
标题翻译：控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法
公开(公告)号：US20110281509A1
公开(公告)日：2011-11-17
申请号：US12945078
申请日：2010-11-12
申请人： KIYOFUMI TANAKA , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： KIYOFUMI TANAKA , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L21/304 , B24B41/06
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

6. 发明授权

US08529314B2 Method of transporting work and apparatus with work handover mechanism 有权
标题翻译：运输工作和设备与工作切换机制的方法
公开(公告)号：US08529314B2
公开(公告)日：2013-09-10
申请号：US12452649
申请日：2008-07-31
申请人： Takeshi Segawa , Kiyofumi Tanaka
发明人： Takeshi Segawa , Kiyofumi Tanaka
IPC分类号： B24B1/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6838
摘要： When both surfaces of a wafer are sequentially subjected to processing, the wafer is made to be surely supported so that a predetermined processing and transporting can be performed. On one surface of the wafer a first fixing jig (3a) is fixed in close contact. After having performed a predetermined processing to the opposite surface of the wafer, a second fixing jig (3b) is fixed in close contact with the opposite surface of the wafer. The first fixing jig (3a) is removed and the wafer is handed over to the second fixing jig (3b). Each of the fixing jigs is made up of a jig main body (31), and a close contact layer (32) which is disposed on one surface thereof. The jig main body has a plurality of supporting projections (33) to support the close contact layer, and a side wall (34). The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (35) enclosed by the side wall, between the close contact layer and the jig main body. A ventilation hole (36) to be communicated with the partitioned space is formed, and the close contact layer is deformed by suction of the air within the partitioned space. At the time of removing, the close contact layer of the first fixing jig is deformed, and both the fixing jigs are relatively moved in a direction away from each other.
摘要翻译：当晶片的两个表面依次进行处理时，晶片被可靠地支撑，从而可以执行预定的处理和传送。在晶片的一个表面上，第一固定夹具（3a）紧密固定。在对晶片的相对表面进行预定处理之后，第二固定夹具（3b）被固定成与晶片的相对表面紧密接触。去除第一固定夹具（3a），将晶片交给第二固定夹具（3b）。每个固定夹具由夹具主体（31）和设置在其一个表面上的紧密接触层（32）构成。夹具主体具有多个用于支撑紧密接触层的支撑突起（33）和侧壁（34）。紧密接触层粘附到侧壁的端面，从而限定在紧密接触层和夹具主体之间由侧壁包围的分隔空间（35）。形成与分隔空间连通的通气孔（36），并且紧密接触层通过分隔空间内的空气抽吸而变形。在去除时，第一固定夹具的紧密接触层变形，并且两个固定夹具相对于彼此远离的方向相对移动。

7. 发明申请

US20100189533A1 METHOD OF TRANSPORTING WORK AND APPARATUS WITH WORK HANDOVER MECHANISM 有权
标题翻译：运输工具的方法和设备与工作切换机制
公开(公告)号：US20100189533A1
公开(公告)日：2010-07-29
申请号：US12452649
申请日：2008-07-31
申请人： Takeshi Segawa , Kiyofumi Tanaka
发明人： Takeshi Segawa , Kiyofumi Tanaka
IPC分类号： H01L21/677 , H01L21/683 , H01L21/673
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6838
摘要： When both surfaces of a wafer are sequentially subjected to processing, the wafer is made to be surely supported so that a predetermined processing and transporting can be performed. On one surface of the wafer a first fixing jig (3a) is fixed in close contact. After having performed a predetermined processing to the opposite surface of the wafer, a second fixing jig (3b) is fixed in close contact with the opposite surface of the wafer. The first fixing jig (3a) is removed and the wafer is handed over to the second fixing jig (3b). Each of the fixing jigs is made up of a jig main body (31), and a close contact layer (32) which is disposed on one surface thereof. The jig main body has a plurality of supporting projections (33) to support the close contact layer, and a side wall (34). The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (35) enclosed by the side wall, between the close contact layer and the jig main body. A ventilation hole (36) to be communicated with the partitioned space is formed, and the close contact layer is deformed by suction of the air within the partitioned space. At the time of removing, the close contact layer of the first fixing jig is deformed, and both the fixing jigs are relatively moved in a direction away from each other.
摘要翻译：当晶片的两个表面依次进行处理时，晶片被可靠地支撑，从而可以执行预定的处理和传送。在晶片的一个表面上，第一固定夹具（3a）紧密固定。在对晶片的相对表面进行预定处理之后，第二固定夹具（3b）被固定成与晶片的相对表面紧密接触。去除第一固定夹具（3a），将晶片交给第二固定夹具（3b）。每个固定夹具由夹具主体（31）和设置在其一个表面上的紧密接触层（32）构成。夹具主体具有多个用于支撑紧密接触层的支撑突起（33）和侧壁（34）。紧密接触层粘附到侧壁的端面，从而限定在紧密接触层和夹具主体之间由侧壁包围的分隔空间（35）。形成与分隔空间连通的通气孔（36），并且紧密接触层通过分隔空间内的空气抽吸而变形。在去除时，第一固定夹具的紧密接触层变形，并且两个固定夹具相对于彼此远离的方向相对移动。

8. 发明申请

US20100164155A1 FIXING JIG AND METHOD OF PROCESSING WORK 有权
标题翻译：固定加工和加工工艺的方法
公开(公告)号：US20100164155A1
公开(公告)日：2010-07-01
申请号：US12452647
申请日：2008-07-31
申请人： Takeshi Segawa , Kiyofumi Tanaka
发明人： Takeshi Segawa , Kiyofumi Tanaka
IPC分类号： H01L21/683 , B25B11/00
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T29/49998 , Y10T156/1132
摘要： A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work. The jig main body (2) has formed therein a suction hole (8) which opens into an outer surface on the side of the close contact layer (3) but which is not communicated with the partitioned space (6). A through hole (9) in communication with the suction hole (8) is formed in the close contact layer (3). A suction force is applied to the work W by evacuation of the suction hole (8).
摘要翻译：固定夹具由能够可拆卸地保持工件（W）紧密接触的板状夹具主体（2）和紧密接触层（3）构成。夹具主体在其一个表面上具有多个支撑突起（4）以支撑紧密接触层; 并且沿着所述一个表面的外周部分具有与所述支撑突起基本相同的高度的侧壁（5）。紧密接触层粘附到侧壁的端面，从而在紧密接触层和夹具主体之间限定分隔空间（6）。通过在夹具主体中形成的通气孔（7）吸入分隔空间内的空气，使紧密接触层发生变形。因此，在对作业施加力的处理中，确实地支撑和固定工件。夹具主体（2）上形成有向密闭接触层（3）侧的外表面开口但不与分隔空间（6）连通的吸入孔（8）。在紧密接触层（3）中形成有与抽吸孔（8）连通的通孔（9）。通过抽吸吸入孔（8）将吸力施加到工件W。

9. 发明申请

US20080119359A1 Structure with a built-in recording medium, a laminate comprising the structure and method for recording in non-contact manner using the structure and the laminate 有权
标题翻译：具有内置记录介质的结构，包括使用该结构和层压体以非接触方式记录的结构和方法的层压体
公开(公告)号：US20080119359A1
公开(公告)日：2008-05-22
申请号：US11978515
申请日：2007-10-29
申请人： Tetsuyuki Utagawa , Takeshi Segawa , Takehiko Nishikawa , Chisato Iino
发明人： Tetsuyuki Utagawa , Takeshi Segawa , Takehiko Nishikawa , Chisato Iino
IPC分类号： B41M5/24
CPC分类号： B41M5/305 , B41M2205/04 , B41M2205/38 , B41M2205/40
摘要： A structure formed of a resin material with a built-in recording medium comprising at least a means for rewriting visible information with a laser light in a non-contact manner; a laminate comprising the structure and a method for recording in the non-contact manner using the structure or the laminate are disclosed. The recording and erasing of information in the recording medium can be conducted by irradiation with a laser light from outside. The laser light transmittance in a used wave length range and the visible light transmittance through a portion of the structure from a surface on which the laser light is irradiated to the recording medium are in a specified range. Surface destruction of the recording medium due to laser light on rewriting visible information, decrease in durability during cleaning, damages on the recording medium during transportation and deterioration in the color developing property due to light can be overcome.
摘要翻译：由具有内置记录介质的树脂材料形成的结构至少包括用于以非接触方式用激光重写可见信息的装置; 公开了一种包含该结构的层压体以及使用该结构或层压体以非接触方式进行记录的方法。记录介质中的信息的记录和擦除可以通过从外部照射激光来进行。在使用的波长范围内的激光透射率和从激光照射到记录介质的表面的结构的一部分的可见光透射率在规定的范围内。可以克服在重写可见信息时由于激光引起的记录介质的表面破坏，清洁期间的耐久性降低，运输期间记录介质的损坏以及由于光引起的显色性的劣化。

10. 发明授权

US07470436B2 Water-soluble composition containing coenzyme Q10 有权
标题翻译：含有辅酶Q10的水溶性组合物
公开(公告)号：US07470436B2
公开(公告)日：2008-12-30
申请号：US10537433
申请日：2003-12-02
申请人： Takeshi Segawa , Atsuko Abe , Tsuyoshi Minemura , Hironori Kubota
发明人： Takeshi Segawa , Atsuko Abe , Tsuyoshi Minemura , Hironori Kubota
IPC分类号： A61K9/00 , A61K9/14 , A61K38/43
CPC分类号： A61K31/122 , A23L29/10 , A23L33/10 , A23L33/115 , A61K8/355 , A61K8/375 , A61K9/08 , A61K47/14 , A61Q19/00 , A61Q19/007 , A61Q19/08
摘要： A water-soluble composition comprising (A) coenzyme Q10 of 5-40% by weight, (B) monoester of polyglycerol with average polymerization degree of 10 and fatty acid with 18 carbon atoms of 5-30% by weight, (C) mono-, di-, tri- or penta-ester of polyglycerol with average polymerization degree of 3-6 and fatty acid with 18 carbon atoms of 1-18% by weight, and (D) water, wherein its average particle diameter is 110 nm or smaller. It is superior in acid resistance, salt-resistance and heat resistance, and further enables to maintain the good water-soluble state being blended to medicines, foods and beverages, cosmetics, feeds, additives usually employed therein.
摘要翻译：一种水溶性组合物，其包含（A）5-40重量％的辅酶Q10，（B）平均聚合度为10的聚甘油单酯和5-30重量％的碳原子的脂肪酸，（C）单 - ，平均聚合度为3-6的聚甘油的二 - ，三 - 或五 - 酯，和18个碳原子的脂肪酸为1-18重量％，和（D）水，其平均粒径为110nm 或更小。耐酸性，耐盐性和耐热性优异，并且还能够将通常使用的药物，食品和饮料，化妆品，饲料，添加剂中的添加剂保持良好的水溶性状态。

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