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1. 发明申请

US20110079902A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20110079902A1
公开(公告)日：2011-04-07
申请号：US12847526
申请日：2010-07-30
申请人： Takeshi SAKAMOTO , Katsumi Otani , Kimihito Kuwabara
发明人： Takeshi SAKAMOTO , Katsumi Otani , Kimihito Kuwabara
IPC分类号： H01L23/488 , H01L23/31 , H01L23/48 , H01L23/373
CPC分类号： H01L23/4006 , H01L21/563 , H01L23/367 , H01L23/3677 , H01L23/42 , H01L24/32 , H01L2224/131 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/0001 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2224/13099
摘要： A semiconductor device has a wiring substrate provided with an external connecting terminal on a lower surface, a semiconductor chip mounted onto an upper surface of the wiring substrate, a cap-shaped heat dissipation member arranged on the upper surface of the wiring substrate so as to cover the semiconductor chip, a fixing pin for fixing the heat dissipation member onto the upper surface of the wiring substrate, and a heat transfer material sandwiched between a lower surface of the heat dissipation member just above the semiconductor chip and the upper surface of the semiconductor chip.
摘要翻译：半导体器件具有在下表面上设置有外部连接端子的布线基板，安装在布线基板的上表面上的半导体芯片，布置在布线基板的上表面上的帽状散热部件，以便覆盖半导体芯片，用于将散热构件固定在布线基板的上表面上的固定销和夹在半导体芯片正上方的散热构件的下表面和半导体的上表面之间的传热材料芯片。

2. 发明申请

US20110303646A1 LASER WORKING METHOD 有权
标题翻译：激光工作方法
公开(公告)号：US20110303646A1
公开(公告)日：2011-12-15
申请号：US13213175
申请日：2011-08-19
申请人： Takeshi SAKAMOTO
发明人： Takeshi SAKAMOTO
IPC分类号： B23K26/00
CPC分类号： H01L21/78 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D5/0011 , C03B33/0222
摘要： An object to be processed is restrained from warping at the time of laser processing. A modified region M2 is formed within a wafer 11, and fractures a2, b2 extending in directions parallel to the thickness direction of the wafer 11 and tilted with respect to a plane including lines 5 are generated from the modified region M2. A modified region M3 is formed within the wafer 11, and a fracture a3 extending in a direction parallel to the thickness direction of the wafer 11 and tilted with respect to the plane including the lines 5 is generated from the modified region M3 so as to connect with the fracture b2. That is, the fractures a2, a3, b2 are generated so as to be connected together. Therefore, at the time of laser processing, the fractures cause both side parts holding the lines to cut 5 therebetween in the wafer 11 to mesh with each other, whereby internal stresses occurring in a direction parallel to the thickness direction of the wafer 11 and perpendicular to the surface including the lines 5 when the modified regions are formed can be reduced.
摘要翻译：在激光加工时，抑制被处理物体发生翘曲。在晶片11内形成有改质区域M2，并且从改质区域M2产生从平行于晶片11的厚度方向延伸的方向相对于包含线5的面倾斜的断裂的a2，b2。在晶片11内形成改质区域M3，从修正区域M3产生沿与晶片11的厚度方向平行的方向延伸且相对于包含线5的平面倾斜的断面a3，与骨折b2。也就是说，产生断裂a2，a3，b2以便连接在一起。因此，在激光加工时，由于在晶片11中使夹着切断线5的两个部分彼此啮合，因此在与晶片11的厚度方向平行的方向上产生内应力，可以减少形成修饰区域时包括线5的表面。

3. 发明申请

US20100178751A1 LASER PROCESSING METHOD AND SEMICONDUCTOR CHIP 有权
标题翻译：激光加工方法和半导体芯片
公开(公告)号：US20100178751A1
公开(公告)日：2010-07-15
申请号：US12748077
申请日：2010-03-26
申请人： Takeshi SAKAMOTO , Kenshi Fukumitsu
发明人： Takeshi SAKAMOTO , Kenshi Fukumitsu
IPC分类号： H01L21/268
CPC分类号： B28D5/0011 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50
摘要： A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision.This laser processing method irradiates a substrate 4 with laser light L while using a rear face 21 as a laser light entrance surface and locating a light-converging point P within the substrate 4, so as to form modified regions 71, 72, 73 within the substrate 4. Here, the quality modified region 71 is formed at a position where the distance between the front face 3 of the substrate 4 and the end part of the quality modified region 71 on the front face side is 5 μm to 15 μm. When the quality modified region 71 is formed at such a position, a laminate part 16 (constituted by interlayer insulating films 17a, 17b here) formed on the front face 3 of the substrate 4 is also cut along a line to cut with a high precision together with the substrate 4.
摘要翻译：提供了一种激光加工方法，即使当形成有包括多个功能元件的层叠部件的基板较厚时，也可以高精度地切割基板并层压部件。该激光加工方法使用背面21作为激光入射面，用激光L照射基板4，并且将聚光点P定位在基板4内，以在其内部形成改质区域71,72,73 这里，质量改质区域71形成在基板4的正面3与正面侧的质量改质区域71的端部之间的距离为5μm〜15μm的位置。当在这样的位置形成质量改良区域71时，也形成在基板4的正面3上形成的层叠体部16（由这里的层间绝缘膜17a，17b构成），沿着切割线切割高精度与基板4一起。

4. 发明申请

US20090237939A1 INDICATION PLATE 失效
标题翻译：指示板
公开(公告)号：US20090237939A1
公开(公告)日：2009-09-24
申请号：US12405286
申请日：2009-03-17
申请人： Takeshi SAKAMOTO
发明人： Takeshi SAKAMOTO
IPC分类号： F21S6/00
CPC分类号： G09F7/00 , H05K5/0017
摘要： Disclosed herein is an indication plate including: a plate member including a light-transmitting material; and an indication part provided at a surface on one side with respect to the thickness direction of the plate member, wherein the indication part includes a light-shielding part including a light-shielding material and covering the surface on one side, and a convex portion including the light-transmitting material, the convex portion projecting from the surface on one side and being exposed from the light-shielding part; the convex portion has a circumferential surface projecting from the light-shielding part, and an end face connecting tip portions of the circumferential surface to each other, and a metallic foil having a light-transmitting property is attached to the end face.
摘要翻译：本文公开了一种指示板，包括：板构件，其包括透光材料; 以及指示部，其设置在相对于所述板构件的厚度方向的一侧的表面上，其中所述指示部包括：遮光部，所述遮光部包括遮光材料，并且覆盖所述表面的一侧;以及凸部包括透光材料，从一侧的表面突出并从遮光部露出的凸部; 所述凸部具有从所述遮光部突出的周面以及将所述周面的前端部彼此连接的端面，并且具有透光性的金属箔附着到所述端面。

5. 发明申请

US20120121255A1 OPTICAL SWITCHING DEVICE AND COMMUNICATIONS SYSTEM 有权
标题翻译：光学切换设备和通信系统
公开(公告)号：US20120121255A1
公开(公告)日：2012-05-17
申请号：US13218069
申请日：2011-08-25
申请人： Takeshi SAKAMOTO
发明人： Takeshi SAKAMOTO
IPC分类号： H04J14/02 , H04B10/08
CPC分类号： H04B10/2939 , H04J14/0212 , H04J14/0217 , H04J14/0221 , H04J14/0275 , H04Q11/0005 , H04Q2011/0015 , H04Q2011/0049
摘要： An optical switching device includes a optical add/drop multiplexer that at least adds an optical signal into and/or drops an optical signal from wavelength division multiplexed light that is wavelength division multiplexed optical signals; a plurality of amplifiers that are disposed on optical paths included in the optical add/drop multiplexer and that can use supplied pump light to amplify the optical signals; an optical source that generates the pump light; and an optical switch that supplies the generated pump light to any one of the amplifiers.
摘要翻译：光开关装置包括：光分插多路复用器，其至少将光信号从波分复用光信号中加入和/或丢弃光信号;波分复用光信号; 多个放大器，其设置在包括在光分插复用器中的光路上，并且可以使用提供的泵浦光来放大光信号; 产生泵浦光的光源; 以及将产生的泵浦光提供给任何一个放大器的光开关。

6. 发明申请

US20120067857A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：US20120067857A1
公开(公告)日：2012-03-22
申请号：US13308814
申请日：2011-12-01
申请人： Takeshi SAKAMOTO , Kenichi MURAMATSU
发明人： Takeshi SAKAMOTO , Kenichi MURAMATSU
IPC分类号： B23K26/38
CPC分类号： B28D5/0011 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L2224/48091 , H01L2924/00014
摘要： A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions 77 to 712 is made different from an irradiation condition of laser light L for forming the modified regions 713 to 719 such as to correct the spherical aberration of laser light L in areas where the depth from the front face 3 of a silicon wafer 11 is 335 μm to 525 μm. Therefore, even when the silicon wafer 11 and a functional device layer 16 are cut into semiconductor chips from modified regions 71 to 719 acting as a cutting start point, twist hackles do not appear remarkably in the areas where the depth is 335 μm to 525 μm, whereby particles are hard to occur.
摘要翻译：提供了一种用于防止由切割硅晶片获得的切屑切割部分发生颗粒的激光加工方法。使形成改质区域77〜712的激光L的照射条件与用于形成改质区域713〜719的激光L的照射条件不同，例如将激光L的球面像差校正为硅晶片11的正面3为335μm〜525μm。因此，即使将硅晶片11和功能元件层16从作为切割起点的改质区域71〜719切割成半导体芯片，在深度为335μm〜525μm的区域中也不会显着出现扭曲，由此难以发生颗粒。

7. 发明申请

US20110229128A1 OPTICAL NODE, OPTICAL NETWORK SYSTEM, AND METHOD FOR MEASURING POLARIZATION MODE DISPERSION 有权
标题翻译：光学节点，光网络系统和测量极化模式分散的方法
公开(公告)号：US20110229128A1
公开(公告)日：2011-09-22
申请号：US13004532
申请日：2011-01-11
申请人： Takeshi SAKAMOTO , Katsumi FUKUMITSU , Kosuke KOMAKI
发明人： Takeshi SAKAMOTO , Katsumi FUKUMITSU , Kosuke KOMAKI
IPC分类号： H04B10/08
CPC分类号： H04B10/0775 , H04B2210/074 , H04B2210/078
摘要： An optical node disposed along a transmission line that uses optical fiber. The optical node includes a first signal generator and a monitor. The first signal generator generates a first measurement signal for measuring polarization mode dispersion values and transmits the first measurement signal along the transmission line. The monitor detects a second measurement signal from the transmission line and measures polarization mode dispersion values by performing signal processing with respect to the second measurement signal.
摘要翻译：沿着使用光纤的传输线设置的光学节点。光节点包括第一信号发生器和监视器。第一信号发生器产生用于测量偏振模色散值的第一测量信号，并沿传输线发送第一测量信号。监视器从传输线检测第二测量信号，并通过对第二测量信号执行信号处理来测量偏振模色散值。

8. 发明申请

US20110188186A1 DISPLAY APPARATUS 有权
标题翻译：显示设备
公开(公告)号：US20110188186A1
公开(公告)日：2011-08-04
申请号：US13011333
申请日：2011-01-21
申请人： Takeshi SAKAMOTO , Yusuke MORI , Jun KATSUNUMA
发明人： Takeshi SAKAMOTO , Yusuke MORI , Jun KATSUNUMA
IPC分类号： H05K5/00
CPC分类号： H05K5/00
摘要： A display apparatus of present invention includes a tabular display unit having a display screen for displaying an image and a support section constituted by a bent stick member. One end of the support section is inserted into a hole arranged on a back surface of the display unit from a lower side, and the support section is arranged between a placement surface and a lower end of the display unit, whereby the support section supports the display unit from the lower side.
摘要翻译：本发明的显示装置包括：具有用于显示图像的显示屏的表格显示单元和由弯曲的棒状部件构成的支撑部。支撑部分的一端从下侧插入到布置在显示单元的后表面上的孔中，并且支撑部分布置在显示单元的放置表面和下端之间，由此支撑部分支撑显示单元从下侧。

9. 发明申请

US20120051754A1 OPTICAL RECEIVER, METHOD FOR RECEIVING OPTICAL SIGNAL, AND OPTICAL TRANSMISSION SYSTEM 有权
标题翻译：光接收机，接收光信号的方法和光传输系统
公开(公告)号：US20120051754A1
公开(公告)日：2012-03-01
申请号：US13177644
申请日：2011-07-07
申请人： Takeshi SAKAMOTO , Kosuke Komaki
发明人： Takeshi SAKAMOTO , Kosuke Komaki
IPC分类号： H04B10/06 , H04B10/00
CPC分类号： H04B10/032 , H04B10/07951 , H04B10/07953 , H04B10/616
摘要： An optical receiver includes: an optical to electric converter that converts a received optical signal into an analog electric signal; an analog to digital converter that converts the analog electric signal obtained by the optical to electric converter into a digital signal; a digital signal processor that performs wave shaping on the digital signal; an information extract circuit that extracts information related to loss or deterioration of the optical signal from a signal propagating from the analog to digital converter to the digital signal processor or a signal in the digital signal processor; and a judging circuit that judges, based on the information extracted by the information extract circuit, whether the optical signal is lost or deteriorates.
摘要翻译：一种光接收机包括：光接收电转换器，将接收到的光信号转换为模拟电信号; 将由光电转换器获得的模拟电信号转换为数字信号的模数转换器; 数字信号处理器，对数字信号进行波形整形; 信息提取电路，从从模数转换器传播到数字信号处理器的信号或数字信号处理器中的信号中提取与光信号的丢失或劣化有关的信息; 以及判断电路，其基于由信息提取电路提取的信息判断光信号是丢失还是劣化。

10. 发明申请

US20100227453A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：US20100227453A1
公开(公告)日：2010-09-09
申请号：US12785033
申请日：2010-05-21
申请人： Takeshi SAKAMOTO
发明人： Takeshi SAKAMOTO
IPC分类号： H01L21/268
CPC分类号： H01L21/78 , B23K26/16 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011
摘要： A laser processing method which can securely prevent particles from attaching to chips obtained by cutting a planar object is provided. When applying a stress to an object to be processed 1 through an expandable tape 23, forming materials of the object 1 (the object 1 formed with molten processed regions 13, semiconductor chips 25 obtained by cutting the object 1, particles produced from cut sections of the semiconductor chips 25, and the like) are irradiated with soft x-rays. As a consequence, the particles produced from the cut sections of the semiconductor chips 25 obtained by cutting the object 1 fall on the expandable tape 23 without dispersing randomly. This can securely prevent the particles from attaching to the semiconductor chips 25 obtained by cutting the object 1.
摘要翻译：提供一种激光加工方法，其可以可靠地防止颗粒附着到通过切割平面物体而获得的切屑。当通过可膨胀带23向待处理物体1施加应力时，形成物体1（形成有熔融处理区域13的物体1，通过切割物体1获得的半导体芯片25），由切割部分半导体芯片25等）用软X射线照射。结果，从通过切割物体1获得的半导体芯片25的切割部分产生的颗粒落在可膨胀带23上而不会随机分散。这可以可靠地防止颗粒附着到通过切割物体1而获得的半导体芯片25。

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