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    • 3. 发明申请
    • Vacuum processing apparatus and vacuum processing method
    • 真空加工设备和真空加工方法
    • US20050220575A1
    • 2005-10-06
    • US10874241
    • 2004-06-24
    • Takeshi OonoKenji NakataShoji OkiguchiTooru UenoHidehiro OomaeShigeharu MinamiYoshitaka Kai
    • Takeshi OonoKenji NakataShoji OkiguchiTooru UenoHidehiro OomaeShigeharu MinamiYoshitaka Kai
    • H01L21/3065B65G1/00H01L21/00H01L21/677H01L21/68
    • H01L21/67167H01L21/67745Y10S414/136
    • The invention provides a vacuum processing apparatus and vacuum processing method capable of improving the yield factor of a product. A vacuum processing apparatus 1 comprises a plurality of vacuum processing chambers 7 for providing vacuum processing to a sample 2, a vacuum carriage means 8 for carrying a sample into and out of the vacuum processing chamber 7, a switchable chamber 9 capable of being switched between atmosphere and vacuum for carrying a sample into and out of the vacuum processing chamber, a cassette supporting means 10 for supporting a plurality of cassettes housing samples, a carriage means 4 capable of moving vertically for taking out a sample from a given cassette on the cassette supporting means, and a control means performing carriage control for carrying the sample in the given cassette via the carriage means, the switchable chamber and the vacuum carriage means into the vacuum processing chamber and for carrying the processed sample out of the vacuum processing chamber, wherein the apparatus is further equipped with a waiting cassette supporting means for supporting a waiting cassette 5 capable of preventing the processed samples and the unprocessed samples from being mixed in a single cassette.
    • 本发明提供能够提高产品的成品率的真空处理装置和真空处理方法。 真空处理装置1包括用于向样品2提供真空处理的多个真空处理室7,用于将样品进出真空处理室7的真空载置装置8,可切换室9 用于将样品携带到真空处理室中的气体和真空;用于支撑容纳样品的多个盒的盒支撑装置10;能够垂直移动的托架装置4,用于从盒上的给定盒带取出样品 支撑装置,以及执行托架控制的控制装置,用于将经由所述托架装置,所述可切换室和所述真空托架装置的所述样本运送到所述真空处理室中并将所述经处理的样品运送出所述真空处理室, 该装置还配备有用于支撑等待盒式磁带5插头的等待盒支持装置 防止处理的样品和未处理的样品在单个盒中混合。
    • 8. 发明授权
    • Vacuum processing apparatus and vacuum processing method
    • 真空加工设备和真空加工方法
    • US07112805B2
    • 2006-09-26
    • US10875231
    • 2004-06-25
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • G01F23/00G01K5/08
    • H01L21/67207H01L21/67167
    • The invention provides a semiconductor fabrication apparatus capable of preventing increase of carriage time of samples, deterioration of sample output, increase of footprint and increase of investment costs. The vacuum processing apparatus comprises a plurality of vacuum processing chambers for subjecting a sample to vacuum processing; a vacuum carriage for carrying the sample into and out of the vacuum processing chamber; a switchable chamber capable of being switched between atmosphere and vacuum for carrying the sample into and out of the vacuum processing chamber; a cassette support for supporting a plurality of cassettes and a controller for controlling carrying of the sample from a cassette through the switchable chambers, the vacuum carriage means into and out of the vacuum processing chamber. The vacuum processing chamber is equipped with an etching chamber and a critical dimension measurement chamber for critical dimension inspection of the sample.
    • 本发明提供一种半导体制造装置,其能够防止样品的携带时间增加,样品输出的劣化,占地面积的增加和投资成本的增加。 真空处理装置包括用于对样品进行真空处理的多个真空处理室; 用于将样品进入和离开真空处理室的真空托架; 能够在大气和真空之间切换以将样品进出真空处理室的可切换室; 用于支撑多个盒的盒支撑件和控制器,用于控制样品从盒通过可切换室的携带,真空托架装置进入和离开真空处理室。 真空处理室配有蚀刻室和临界尺寸测量室,用于对样品进行临界尺寸检验。
    • 10. 发明申请
    • Vacuum processing apparatus and vacuum processing method
    • 真空加工设备和真空加工方法
    • US20050218337A1
    • 2005-10-06
    • US10875231
    • 2004-06-25
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • H01L21/66H01J37/20H01L21/00H01L21/02H01L21/677H01L21/68
    • H01L21/67207H01L21/67167
    • The invention provides a semiconductor fabrication apparatus capable of preventing increase of carriage time of samples, deterioration of sample output, increase of footprint and increase of investment costs. The vacuum processing apparatus comprises a plurality of vacuum processing chambers 3, 4 for subjecting a sample 8 to vacuum processing; a vacuum carriage means 2 for carrying the sample into and out of the vacuum processing chamber; a switchable chamber 5 capable of being switched between atmosphere and vacuum for carrying the sample into and out of the vacuum processing chamber; a cassette supporting means 9 for supporting a plurality of cassettes 7 capable of housing samples; a carriage means 6 capable of moving vertically for taking out a sample from a given cassette on the cassette supporting means; and a control means performing carriage control for carrying the sample taken out of the given cassette via the carriage means, the switchable chamber and the vacuum carriage means into the vacuum processing chamber, and for carrying the processed sample out of the vacuum processing chamber; wherein the vacuum processing chamber is equipped with an etching chamber 3 and a defect inspection chamber or CD measurement chamber 4 for inspecting the sample for defects.
    • 本发明提供一种半导体制造装置,其能够防止样品的携带时间增加,样品输出的劣化,占地面积的增加和投资成本的增加。 真空处理装置包括用于对样品8进行真空处理的多个真空处理室3,4; 用于将样品进出真空处理室的真空托架装置2; 能够在大气和真空之间切换的可切换室5,用于将样品进出真空处理室; 用于支撑能够容纳样品的多个盒带7的盒支撑装置9; 能够垂直移动以从盒支撑装置上的给定盒带取出样品的托架装置6; 以及控制装置,执行托架控制,用于将从所述给定盒中取出的样品经由所述滑架装置,所述可切换室和所述真空托架装置运送到所述真空处理室中,并将所述经处理的样品运送出所述真空处理室; 其中真空处理室配备有用于检查样品缺陷的蚀刻室3和缺陷检查室或CD测量室4。