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1. 发明申请

US20050289269A1 Slave device, master device and stacked device 有权
标题翻译：从设备，主设备和堆叠设备
公开(公告)号：US20050289269A1
公开(公告)日：2005-12-29
申请号：US11149171
申请日：2005-06-10
申请人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
发明人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
IPC分类号： G06F13/00 , G06F13/40 , G06F13/42
CPC分类号： G06F13/409 , G06F13/4226 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.
摘要翻译：公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令，被连接在每个从设备中的不同位置。

2. 发明申请

US20060097748A1 Semiconductor device and communications terminal and automobile having the same 有权
公开(公告)号：US20060097748A1
公开(公告)日：2006-05-11
申请号：US11268662
申请日：2005-11-08
申请人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito
发明人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito
IPC分类号： H03K19/01
CPC分类号： H03H7/38 , G06F1/26
摘要： A semiconductor device is disclosed in which resistance to the influence of external noise on internal power source network is improved. A semiconductor device operating at any predetermined frequency among a plurality thereof, and having power source networks for supplying power from a power source to internal functional units in the semiconductor device comprises switches, a storage unit, and a control unit. The switches are provided in the power source networks, and switch ON/OFF the supply of power from the power source to the functional units. In the storage unit are mapped and stored a plurality of predetermined operating frequencies and switching information designating an ON state or an OFF state for the switches. The control unit reads, from the storage, switching information corresponding to a current operating frequency, and controls the ON/OFF switching of the switches in accordance with the read switching information.

3. 发明授权

US07346051B2 Slave device, master device and stacked device 有权
标题翻译：从设备，主设备和堆叠设备
公开(公告)号：US07346051B2
公开(公告)日：2008-03-18
申请号：US11149171
申请日：2005-06-10
申请人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
发明人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
IPC分类号： H04Q11/00 , H04L12/50 , H04L12/28 , H04L12/56 , H02J13/00 , G06F3/00 , G06F15/76
CPC分类号： G06F13/409 , G06F13/4226 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.
摘要翻译：公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令，被连接在每个从设备中的不同位置。

4. 发明授权

US07574312B2 Semiconductor device and communications terminal and automobile having the same 有权
标题翻译：半导体装置和通信终端和汽车具有相同的功能
公开(公告)号：US07574312B2
公开(公告)日：2009-08-11
申请号：US11268662
申请日：2005-11-08
申请人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito
发明人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito
IPC分类号： G01F23/00
CPC分类号： H03H7/38 , G06F1/26
摘要： A semiconductor device is disclosed in which resistance to the influence of external noise on internal power source network is improved. A semiconductor device operating at any predetermined frequency among a plurality thereof, and having power source networks for supplying power from a power source to internal functional units in the semiconductor device comprises switches, a storage unit, and a control unit. The switches are provided in the power source networks, and switch ON/OFF the supply of power from the power source to the functional units. In the storage unit are mapped and stored a plurality of predetermined operating frequencies and switching information designating an ON state or an OFF state for the switches. The control unit reads, from the storage, switching information corresponding to a current operating frequency, and controls the ON/OFF switching of the switches in accordance with the read switching information.
摘要翻译：公开了一种半导体器件，其中改善了对外部噪声对内部电源网络的影响的抵抗力。一种半导体器件，在其多个中以任何预定频率工作，并具有用于从电源向半导体器件中的内部功能单元供电的电源网络，包括开关，存储单元和控制单元。开关设置在电源网络中，并从电源向功能单元接通/断开电源。在存储单元中映射并存储多个预定操作频率和指定开关的ON状态或OFF状态的切换信息。控制单元从存储器读取与当前工作频率相对应的切换信息，并且根据读取的切换信息来控制开关的ON / OFF切换。

5. 发明授权

US06901343B2 MULTILAYER BOARD IN WHICH WIRING OF SIGNAL LINE THAT REQUIRES TAMPER-RESISTANCE IS COVERED BY COMPONENT OR FOIL, DESIGN APPARATUS, METHOD, AND PROGRAM FOR THE MULTILAYER BOARD, AND MEDIUM RECORDING THE PROGRAM 有权
标题翻译：组件或者硬盘所要求的防篡改信号线的多层板，多层板的设计，方法和程序，以及程序的中程记录
公开(公告)号：US06901343B2
公开(公告)日：2005-05-31
申请号：US10029571
申请日：2001-12-20
申请人： Eiji Takahashi , Yukihiro Fukumoto , Yoshiyuki Saito , Osamu Shibata , Shinichi Tanimoto , Takeshi Nakayama
发明人： Eiji Takahashi , Yukihiro Fukumoto , Yoshiyuki Saito , Osamu Shibata , Shinichi Tanimoto , Takeshi Nakayama
IPC分类号： G06F17/50 , H05K1/00 , H05K1/02 , H05K1/11 , H04L9/32
CPC分类号： G06F17/5068 , H05K1/0275 , H05K1/0298 , H05K1/114 , H05K2201/09627 , H05K2201/09772 , H05K2201/10151
摘要： A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.
摘要翻译：在组件101的六层板和连接端子102与元件114的端子115之间的信号线需要防篡改。信号线由外层的箔103，通孔104，第三层上的箔111，通孔105，第四层上的箔112，第106层和第六层上的箔113组成。存在于外层的信号线部分都隐藏在电路元件下面。箔103和通孔104的末端放置在第一层116上的部件101下方，通孔105的端部放置在层116上的部件107的下方，通孔106的端部放置在层116上的部件108的下方，另一端通孔104被放置在第六层121上的部件109的下方，通孔105的另一端被放置在层121上的部件110下方，并且箔113和通孔106的另一端放置在层121上的部件114下方。

6. 发明申请

US20090097301A1 SEMICONDUCTOR STORAGE APPARATUS AND SEMICONDUCTOR INTEGRATED CIRCUIT INCORPORATING THE SAME 审中-公开
标题翻译：半导体存储器件和半导体集成电路并入其中
公开(公告)号：US20090097301A1
公开(公告)日：2009-04-16
申请号：US11915816
申请日：2006-05-18
申请人： Eiji Takahashi , Yoshiyuki Saito
发明人： Eiji Takahashi , Yoshiyuki Saito
IPC分类号： G11C11/24 , G11C7/00
CPC分类号： H01L27/101 , G11C11/404 , G11C11/4074 , G11C11/4076 , H01L27/1085 , H01L27/10882
摘要： An object is to provide a semiconductor memory device which can dynamically change the number of memory cells used as by-pass capacitors. In each memory block, one selector signal line is provided in parallel to one word line. In a pair of the word line and the selector signal line adjacent to each other, states are maintained opposite to each other. Further, in a memory block, one branch of a supply line is provided in parallel to one bit line. In each of the memory cells, a first transistor connects a capacitor to the bit line in accordance with the state of the word line. Furthermore, a second transistor connects the same capacitor to the branch of the supply line in accordance with the state of the selector signal line. In the memory cells aligned in a row direction, gates of the first transistors are connected to the same word line, and gates of the second transistors are connected to the same selector signal line.
摘要翻译：本发明的目的是提供一种半导体存储器件，其可以动态地改变用作旁路电容器的存储单元的数量。在每个存储块中，一条选择器信号线与一条字线平行地提供。在彼此相邻的一对字线和选择器信号线中，状态保持彼此相对。此外，在存储块中，供给线的一个分支与一个位线并行设置。在每个存储单元中，第一晶体管根据字线的状态将电容器连接到位线。此外，第二晶体管根据选择器信号线的状态将相同的电容器连接到电源线的分支。在沿行方向排列的存储单元中，第一晶体管的栅极连接到相同的字线，第二晶体管的栅极连接到相同的选择信号线。

7. 发明申请

US20050184381A1 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US20050184381A1
公开(公告)日：2005-08-25
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R13/24 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/34 , H05K3/36 , H05K3/40 , H01R27/02 , H01L23/48 , H01R12/00 , H01R25/00 , H01R31/00 , H01R33/88 , H01R33/90 , H01R33/92 , H01R33/94
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
摘要翻译：提供了可以在没有通孔形成步骤的情况下制造的连接构件。连接构件100包括绝缘基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面。

8. 发明授权

US08878559B2 IC current measuring apparatus and IC current measuring adapter 有权
标题翻译： IC电流测量仪和IC电流测量适配器
公开(公告)号：US08878559B2
公开(公告)日：2014-11-04
申请号：US13382690
申请日：2011-04-19
申请人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
发明人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
IPC分类号： G01R31/26 , G01R31/28 , G01R1/20 , G01R31/02
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： An IC current measuring apparatus is provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译： IC电流测量装置设置在IC和基板之间。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压与IC端子相对应的插入电阻，他/她希望通过电流测量流动。

9. 发明申请

US20120112737A1 IC CURRENT MEASURING APPARATUS AND IC CURRENT MEASURING ADAPTER 有权
标题翻译： IC电流测量装置和IC电流测量适配器
公开(公告)号：US20120112737A1
公开(公告)日：2012-05-10
申请号：US13382690
申请日：2011-04-19
申请人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
发明人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
IPC分类号： G01R1/20
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： Provided is an IC current measuring apparatus provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译：提供了设置在IC和基板之间的IC电流测量装置。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压与IC端子相对应的插入电阻，他/她希望通过电流测量流动。

10. 发明申请

US20080047137A1 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US20080047137A1
公开(公告)日：2008-02-28
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R43/20 , H01R12/00 , H01R13/24
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

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