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1. 发明授权

US08878559B2 IC current measuring apparatus and IC current measuring adapter 有权
标题翻译： IC电流测量仪和IC电流测量适配器
公开(公告)号：US08878559B2
公开(公告)日：2014-11-04
申请号：US13382690
申请日：2011-04-19
申请人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
发明人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
IPC分类号： G01R31/26 , G01R31/28 , G01R1/20 , G01R31/02
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： An IC current measuring apparatus is provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译： IC电流测量装置设置在IC和基板之间。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压与IC端子相对应的插入电阻，他/她希望通过电流测量流动。

2. 发明申请

US20120112737A1 IC CURRENT MEASURING APPARATUS AND IC CURRENT MEASURING ADAPTER 有权
标题翻译： IC电流测量装置和IC电流测量适配器
公开(公告)号：US20120112737A1
公开(公告)日：2012-05-10
申请号：US13382690
申请日：2011-04-19
申请人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
发明人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
IPC分类号： G01R1/20
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： Provided is an IC current measuring apparatus provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译：提供了设置在IC和基板之间的IC电流测量装置。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压与IC端子相对应的插入电阻，他/她希望通过电流测量流动。

3. 发明授权

US07346051B2 Slave device, master device and stacked device 有权
标题翻译：从设备，主设备和堆叠设备
公开(公告)号：US07346051B2
公开(公告)日：2008-03-18
申请号：US11149171
申请日：2005-06-10
申请人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
发明人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
IPC分类号： H04Q11/00 , H04L12/50 , H04L12/28 , H04L12/56 , H02J13/00 , G06F3/00 , G06F15/76
CPC分类号： G06F13/409 , G06F13/4226 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.
摘要翻译：公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令，被连接在每个从设备中的不同位置。

4. 发明申请

US20050289269A1 Slave device, master device and stacked device 有权
标题翻译：从设备，主设备和堆叠设备
公开(公告)号：US20050289269A1
公开(公告)日：2005-12-29
申请号：US11149171
申请日：2005-06-10
申请人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
发明人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
IPC分类号： G06F13/00 , G06F13/40 , G06F13/42
CPC分类号： G06F13/409 , G06F13/4226 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.
摘要翻译：公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令，被连接在每个从设备中的不同位置。

5. 发明申请

US20050199420A1 Circuit board and method for manufacturing the same 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20050199420A1
公开(公告)日：2005-09-15
申请号：US11075578
申请日：2005-03-08
申请人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
发明人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
IPC分类号： H01L21/48 , H01L23/14 , H05K1/00 , H05K1/09 , H05K1/16 , H05K3/00 , H05K3/10 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4038 , H05K1/167 , H05K3/105 , H05K3/4644 , H05K2201/0326 , H05K2203/107 , H05K2203/171 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a circuit board according to the present invention, on a substrate, in at least a portion of a phase change layer including a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, a conductive path is formed that has been put into an electrically conductive state by a phase change in the phase change layer, wherein the phase change material includes a chalcogenide semiconductor, changes between the electrically insulating state and the electrically conductive state by irradiation of laser light, goes into the electrically conductive state in a crystalline phase, and goes into the electrically insulating state in an amorphous phase. In this way, a conductive path is formed by irradiating laser light onto a phase change layer using phase change in a phase change layer formed from a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, and therefore very small-dimension minute vias and conductors can be formed. Furthermore, subsequent repair, rework, or trimming also is easy.
摘要翻译：在根据本发明的电路板中，在基板上，在包括能够在电绝缘状态和导电状态之间交替变化的相变材料的相变层的至少一部分中，导电路径为形成为通过相变层中的相变而导致导电状态，其中相变材料包括硫族化物半导体，通过激光的照射在电绝缘状态和导电状态之间的变化进入在结晶相中导电状态，并且在非晶相中进入电绝缘状态。以这种方式，通过使用在能够在电绝缘状态和导电状态之间交替变化的相变材料形成的相变层中的相变来将激光照射到相变层上形成导电路径，以及因此可以形成非常小尺寸的微通孔和导体。此外，随后的修理，返修或修整也很容易。

6. 发明申请

US20070124926A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20070124926A1
公开(公告)日：2007-06-07
申请号：US11674454
申请日：2007-02-13
申请人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
发明人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
IPC分类号： H05K1/03
CPC分类号： H05K3/4038 , H05K1/167 , H05K3/105 , H05K3/4644 , H05K2201/0326 , H05K2203/107 , H05K2203/171 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a circuit board according to the present invention, on a substrate, in at least a portion of a phase change layer including a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, a conductive path is formed that has been put into an electrically conductive state by a phase change in the phase change layer, wherein the phase change material includes a chalcogenide semiconductor, changes between the electrically insulating state and the electrically conductive state by irradiation of laser light, goes into the electrically conductive state in a crystalline phase, and goes into the electrically insulating state in an amorphous phase. In this way, a conductive path is formed by irradiating laser light onto a phase change layer using phase change in a phase change layer formed from a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, and therefore very small-dimension minute vias and conductors can be formed. Furthermore, subsequent repair, rework, or trimming also is easy.
摘要翻译：在根据本发明的电路板中，在基板上，在包括能够在电绝缘状态和导电状态之间交替变化的相变材料的相变层的至少一部分中，导电路径为形成为通过相变层中的相变而导致导电状态，其中相变材料包括硫族化物半导体，通过激光的照射在电绝缘状态和导电状态之间的变化进入在结晶相中导电状态，并且在非晶相中进入电绝缘状态。以这种方式，通过使用在能够在电绝缘状态和导电状态之间交替变化的相变材料形成的相变层中的相变来将激光照射到相变层上形成导电路径，以及因此可以形成非常小尺寸的微通孔和导体。此外，随后的修理，返修或修整也很容易。

7. 发明授权

US07341890B2 Circuit board with built-in electronic component and method for manufacturing the same 失效
标题翻译：具有内置电子部件的电路板及其制造方法
公开(公告)号：US07341890B2
公开(公告)日：2008-03-11
申请号：US11478415
申请日：2006-06-28
申请人： Yukihiro Ishimaru , Tousaku Nishiyama , Yasuhiro Sugaya , Toshiyuki Asahi
发明人： Yukihiro Ishimaru , Tousaku Nishiyama , Yasuhiro Sugaya , Toshiyuki Asahi
IPC分类号： H01L23/02 , H01L23/12
CPC分类号： H05K1/187 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H05K1/188 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.
摘要翻译：根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

8. 发明授权

US07136543B2 Mount assembly, optical transmission line and photoelectric circuit board 有权
标题翻译：安装组件，光传输线和光电路板
公开(公告)号：US07136543B2
公开(公告)日：2006-11-14
申请号：US10879067
申请日：2004-06-30
申请人： Tousaku Nishiyama , Yukihiro Ishimaru , Yasuhiro Sugaya , Toshiyuki Asahi , Seiji Karashima
发明人： Tousaku Nishiyama , Yukihiro Ishimaru , Yasuhiro Sugaya , Toshiyuki Asahi , Seiji Karashima
IPC分类号： G02B6/12 , H01L3/00
CPC分类号： H01L31/035281 , G02B6/43 , H01L33/20 , H01L33/24 , H01L2224/16225 , H01L2924/1017 , Y02E10/50
摘要： A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly (100) is obtained by connecting a photo-electro conversion device (10a), spherical semiconductor devices (12a) and (12b) and an electro-photo conversion device (10b) through electrical-connection portions (14) so that a light received by the photo-electro conversion device (10a) is amplified by the spherical semiconductor devices (12a) and (12b) and then emitted from the electro-photo conversion device (10b).
摘要翻译：一种安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且不需要在光传输线和安装组件之间的连接部分处的高度精确的垂直度。通过电连接部分（100a）连接光电转换装置（10a），球形半导体装置（12a）和（12b）和电转换装置（10b） 14），使得由光电转换装置（10a）接收的光被球形半导体器件（12a）和（12b）放大，然后从电光转换装置（10b）发射。

9. 发明授权

US06510059B2 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module 失效
公开(公告)号：US06510059B2
公开(公告)日：2003-01-21
申请号：US09889523
申请日：2001-07-18
申请人： Tsutomu Mitani , Yukihiro Ishimaru , Takashi Kitae , Hiroaki Takezawa
发明人： Tsutomu Mitani , Yukihiro Ishimaru , Takashi Kitae , Hiroaki Takezawa
IPC分类号： H05K118
CPC分类号： H05K3/321 , C09J9/02 , H01L23/49883 , H01L2924/0002 , H05K3/305 , H05K2201/10636 , H05K2201/10977 , H05K2203/0278 , H05K2203/0783 , Y02P70/611 , Y10S205/925 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.

10. 发明申请

US20070069393A1 Wiring board embedded with spherical semiconductor element 审中-公开
标题翻译：嵌入球形半导体元件的接线板
公开(公告)号：US20070069393A1
公开(公告)日：2007-03-29
申请号：US10565378
申请日：2004-07-22
申请人： Toshiyuki Asahi , Yukihiro Ishimaru , Tousaku Nishiyama , Seiichi Nakatani , Yasuhiro Sugaya
发明人： Toshiyuki Asahi , Yukihiro Ishimaru , Tousaku Nishiyama , Seiichi Nakatani , Yasuhiro Sugaya
IPC分类号： H01L23/48
CPC分类号： H01L23/5389 , H01L29/0657 , H01L2224/16 , H01L2224/16145 , H01L2924/1017 , H05K1/185 , H05K1/187
摘要： A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.
摘要翻译：通过将球状半导体元件嵌入构成布线板的电绝缘基板中，可以获得具有高密度布线的双面或多层布线板，并且可以使用这种布线板设置薄的电子设备。此外，可以通过嵌入球形半导体元件来提供能够容纳在有限空间中同时保持所需形式的柔性双面或多层布线板，并且可以使用各种这样的布线来提供薄的电子设备通过根据需要向这种布线板的期望部件赋予不同类型的柔性。

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