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    • 2. 发明授权
    • Linear actuator
    • 线性执行机构
    • US08656798B2
    • 2014-02-25
    • US13516454
    • 2011-04-26
    • Hiroshi KawaharaTooru HaradaTomofumi Yamashita
    • Hiroshi KawaharaTooru HaradaTomofumi Yamashita
    • F16H1/26
    • F16H25/20F16H25/2015F16H25/2214F16H2025/204F16H2025/2081
    • A linear actuator is provided which is able to simplify its structure by adding a stopper function, too, to a detent mechanism and to prevent generation of radial load. The linear actuator comprises a ball screw mechanism, to which a rotational driving force is transmitted, for converting a rotational motion into a linear motion. The ball screw mechanism comprises radially projecting guide projections provided in a linear motion component, and a guide groove arranged in a securing portion facing the linear motion component and is engaged with the guide projections to guide the guide projections in an axial direction. The guide projection has a projection projecting by the predetermined length, while engaging into the guide groove, at a stroke end of the linear motion component and a locking portion provided in a rotary motion component is locked to the projection of the guide projection.
    • 提供了一种线性致动器,其能够通过向制动机构添加止动器功能并且防止径向载荷的产生来简化其结构。 线性致动器包括用于将旋转运动转换成直线运动的滚珠丝杠机构,旋转驱动力被传递到该滚珠丝杠机构。 滚珠丝杠机构包括设置在直线运动部件中的径向突出的引导突起,以及布置在面向线性运动部件的固定部分中的引导槽,并且与引导突起接合以沿轴向引导引导突起。 引导突起具有在线性运动部件的行程末端处突出预定长度的突起,同时在引导槽中接合,并且设置在旋转运动部件中的锁定部分锁定到引导突起的突出部。
    • 3. 发明授权
    • Methods for manufacturing piezoelectric vibrating pieces
    • 制造压电振动片的方法
    • US08429800B2
    • 2013-04-30
    • US12880514
    • 2010-09-13
    • Hiroshi KawaharaRyoichi Ichikawa
    • Hiroshi KawaharaRyoichi Ichikawa
    • H04R17/10H01L41/053
    • H03H9/1035H03H9/0595Y10T29/42Y10T29/49126Y10T29/49144Y10T156/10Y10T156/1052
    • In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film. A bonding material is placed between the stripes of first bonding film and respective stripes of second bonding film, and between stripes of first bonding film and respective stripes of third bonding film, by which the three wafers are bonded together after being aligned with each other in a sandwich manner.
    • 在一个示例性方法中,准备在其上形成多个压电框架的压电晶片。 每个框架具有包括激励电极的压电振动片,框架部分围绕振动片。 制备盖片晶片,其上形成有多个相应的盖子,每个尺寸基本上与各个框架类似。 制备基底晶片,其上形成有多个基底,每个尺寸基本上与各个框架类似。 每个基地都有通孔。 在每个框架的周围的压电晶片的两个主表面上形成第一接合膜的条纹。 第二接合膜的条纹形成在盖晶片的内主表面上,对应于第一接合膜的各条纹。 对应于第一接合膜的各个条纹,在基底晶片的内主表面上形成第三接合膜的条纹。 在第一接合膜的条纹和第二接合膜的条纹之间以及第一接合膜的条纹和第三接合膜的各条之间放置接合材料,通过该接合材料将三个晶片彼此对准接合在一起 一个三明治的方式。