专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06723762B1 Foamable vinyl chloride-base resin compositions 失效
标题翻译：可发泡氯乙烯基树脂组合物
公开(公告)号：US06723762B1
公开(公告)日：2004-04-20
申请号：US10069953
申请日：2002-03-07
申请人： Takenobu Sunagawa , Noriko Sakashita , Mitsutaka Sato , Mamoru Kadokura
发明人： Takenobu Sunagawa , Noriko Sakashita , Mitsutaka Sato , Mamoru Kadokura
IPC分类号： C08J908
CPC分类号： C08J9/0061 , C08F259/04 , C08J9/04 , C08J9/06 , C08J2327/06 , C08J2433/00 , C08L27/06 , C08L51/003 , C08F220/14 , C08L2666/24
摘要： There is provided a foamable poly(vinyl chloride) resin composition which can remarkably improve an expansion ratio. There is used a foamable poly(vinyl chloride) resin composition comprising 100 parts by weight of (A) a poly(vinyl chloride) resin, 0.5 to 30 parts by weight of (B) a processing aid, and 0.5 to 15 parts by weight of water and 0 to 20 parts by weight of a thermal decomposition foaming agent as a foaming agent (C), wherein the processing aid is obtained by adding and polymerizing 0 to 50 parts of a monomer mixture (b) comprising 0 to 50% by weight of methyl methacrylate, 50 to 100% by weight of at least one monomer selected from the group consisting of methacrylate excluding methyl methacrylate and acrylate, and 0 to 20% by weight of a vinyl monomer copolymerizable therewith, in the presence of a latex of a (co)polymer obtained by emulsion polymerizing 50 to 100 parts by weight of a monomer mixture (a) comprising 50 to 100% by weight of methyl methacrylate, 0 to 50% by weight of a monomer selected from the group consisting of methacrylate excluding methyl methacrylate and acrylate, and 0 to 20% of a vinyl monomer copolymerizable therewith in an amount that a total amount of (a) and (b) is 100 parts by weight.
摘要翻译：提供可显着提高膨胀率的可发泡聚氯乙烯树脂组合物。使用包含100重量份（A）聚（氯乙烯）树脂，0.5-30重量份（B）加工助剂）和0.5-15重量份的可发泡聚氯乙烯树脂组合物的水和0〜20重量份的作为发泡剂（C）的热分解发泡剂，其中，所述加工助剂是通过将0〜50份由0〜50％的单体混合物（b）重量的甲基丙烯酸甲酯，50至100重量％的至少一种选自甲基丙烯酸甲酯和丙烯酸酯的甲基丙烯酸酯的单体和0至20重量％的与其可共聚的乙烯基单体，在胶乳的存在下通过将50至100重量份的单体混合物（a）通过乳液聚合而获得的（共）聚合物，所述单体混合物（a）包含50至100重量％的甲基丙烯酸甲酯，0至50重量％的选自甲基丙烯酸甲酯甲基丙烯酸甲酯和丙烯酸酯，和0 至20％的可与其共聚的乙烯基单体，其量（a）和（b）的总量为100重量份。

2. 发明授权

US06610757B2 Foamable vinyl chloride resin composition 有权
公开(公告)号：US06610757B2
公开(公告)日：2003-08-26
申请号：US09926428
申请日：2001-10-31
申请人： Takenobu Sunagawa , Mitsutaka Sato , Noriko Sakashita , Mamoru Kadokura
发明人： Takenobu Sunagawa , Mitsutaka Sato , Noriko Sakashita , Mamoru Kadokura
IPC分类号： C08J908
CPC分类号： C08J9/0061 , C08J9/08 , C08J2201/03 , C08J2327/06 , C08J2433/00
摘要： An expandable vinyl chloride resin composition that the expansion ratio of a vinyl chloride resin can be greatly increased by the use of thermally decomposable inorganic blowing agents without the use of organic solvent blowing agents, and which comprises 100 parts by weight of a vinyl chloride resin, 0.5 to 30 parts by weight of, as a processing aid, a (meth)acrylic acid ester polymer having a specific viscosity of not less than 0.73 measured at 30° C. with respect to a solution of 0.1 g of the polymer dissolved in 100 ml of chloroform, and not less than 0.3 to less than 2 parts by weight of a thermally decomposable inorganic blowing agent such as sodium bicarbonate.

3. 发明授权

US06635687B2 Expandable vinyl chloride resin composition 有权
公开(公告)号：US06635687B2
公开(公告)日：2003-10-21
申请号：US10069956
申请日：2002-03-07
申请人： Takenobu Sunagawa , Mitsutaka Sato , Mamoru Kadokura
发明人： Takenobu Sunagawa , Mitsutaka Sato , Mamoru Kadokura
IPC分类号： C08J908
CPC分类号： C08J9/0061 , C08F265/04 , C08F265/06 , C08J9/06 , C08J9/08 , C08J9/103 , C08J2327/06 , C08J2433/00 , C08L27/06 , C08L33/12 , C08L51/00 , C08L51/003 , C08L2666/24 , C08L2666/04 , C08L2666/02
摘要： An expandable vinyl chloride resin composition which can provide foamed articles having a greatly enhanced expansion ratio without remarkably lowering the surface property and strength by the use of thermally decomposable blowing agents without the use of organic solvent blowing agents, and which comprises 100 parts by weight of a vinyl chloride resin, 0.5 to 30 parts by weight of, as a processing aid, a two stage (meth)acrylic ester polymer having a specific viscosity of at least 0.5 (0.1 % chloroform solution, 30° C.) prepared by polymerizing a monomer component containing as a main component a monomer selected from acrylic esters and methacrylic esters excepting methyl methacrylate in the presence of a latex of a methyl methacrylate polymer having a specific viscosity of at least 0.7, 0.3 to 25 parts by weight of a thermally decomposable inorganic blowing agent, 0.01 to 15 parts by weight of a thermally decomposable organic blowing agent and 0 to 20 parts by weight of a filler.

4. 发明申请

US20070197728A1 Processing aid and vinyl chloride resin composition containing the same 审中-公开
标题翻译：加工助剂和含有它的氯乙烯树脂组合物
公开(公告)号：US20070197728A1
公开(公告)日：2007-08-23
申请号：US11785479
申请日：2007-04-18
申请人： Mitsutaka Sato , Takenobu Sunagawa , Mamoru Kadokura
发明人： Mitsutaka Sato , Takenobu Sunagawa , Mamoru Kadokura
IPC分类号： C08L67/02
CPC分类号： C08L25/14 , C08L27/06 , C08L33/06 , C08L33/12 , C08L2205/02 , C08L2205/03 , C08L2666/04
摘要： Generation of air marks and flow marks is prevented when a vinyl chloride resin is molded into a sheet or the like. To a vinyl chloride resin is added a processing aid for a vinyl chloride resin comprising a copolymer composition containing, (A) 70 to 99 parts by weight of a copolymer obtained by polymerizing a monomer mixture comprising 50 to 99% by weight of methyl methacrylate, 1 to 50% by weight of an aromatic vinyl compound and 0 to 30% by weight of another monomer copolymerizable with these components, said copolymer having a specific viscosity at 30° C. of 0.3 to 1.8 when 0.4 g of said copolymer is dissolved in 100 ml of toluene; and (B) 1 to 30 parts by weight of a copolymer obtained by polymerizing a monomer mixture comprising 0 to 60% by weight of methyl methacrylate, 40 to 100% by weight of methacrylic ester other than methyl methacrylate and/or 40 to 99% by weight of acrylic ester, and 0 to 50% by weight of another monomer copolymerizable with these components, the total amount of (A) and (B) being 100 parts by weight, wherein said copolymer composition has a specific viscosity at 30° C. of 0.3 to 2.0 when 0.4 g of said copolymer composition is dissolved in 100 ml of toluene.
摘要翻译：当将氯乙烯树脂模制成片材等时，防止产生气痕和流痕。向氯乙烯树脂中加入氯乙烯树脂的加工助剂，该加工助剂包含共聚物组合物，该共聚物组合物含有（A）70-99重量份通过聚合包含50-99重量％甲基丙烯酸甲酯的单体混合物获得的共聚物， 1至50重量％的芳族乙烯基化合物和0至30重量％的可与这些组分共聚的其它单体，所述共聚物在30℃下的比粘度为0.3至1.8，当将0.4g所述共聚物溶解于 100ml甲苯; 和（B）1至30重量份通过聚合包含0至60重量％的甲基丙烯酸甲酯，40至100重量％的甲基丙烯酸甲酯和/或40至99重量％的甲基丙烯酸酯的单体混合物而获得的共聚物，的丙烯酸酯和0至50重量％的可与这些组分共聚的另一单体，（A）和（B）的总量为100重量份，其中所述共聚物组合物在30℃下具有比粘度当将0.4g所述共聚物组合物溶解在100ml甲苯中时为0.3-2.0。

5. 发明申请

US20090227734A1 Thermoplastic Resin Composition 审中-公开
标题翻译：热塑性树脂组合物
公开(公告)号：US20090227734A1
公开(公告)日：2009-09-10
申请号：US12225168
申请日：2007-03-13
申请人： Yoshiaki Matsuoka , Toru Terada , Hirotsugu Yamada , Mitsutaka Sato
发明人： Yoshiaki Matsuoka , Toru Terada , Hirotsugu Yamada , Mitsutaka Sato
IPC分类号： C08B37/00 , C08L51/00
CPC分类号： C08F265/04 , C08F265/06 , C08F285/00 , C08L51/003 , C08L101/00 , C08L2666/04 , C08L2666/02 , C08L2666/24
摘要： A thermoplastic resin composition having excellent weather resistance and high impact resistance in the present invention is the thermoplastic resin composition containing 100 parts by weight of a thermoplastic resin (A) and 0.5 to 20 parts by weight of a graft copolymer (B), wherein the graft copolymer (B) consists of 50% to 99.5% by weight of a core (bc) and 0.5% to 50% by weight of a non-crosslinked shell (bs), the core (bc) is constituted of only layer having a glass transition temperature of 20° C. or lower, and the non-crosslinked shell (bs) is obtained by polymerizing a monomer mixture for non-crosslinked shell, containing 52% to 100% by weight of an acrylic ester and 0% to 48% by weight of a vinyl monomer copolymerizable with the acrylic ester.
摘要翻译：本发明中耐热性优异，耐冲击性优异的热塑性树脂组合物是含有100重量份热塑性树脂（A）和0.5〜20重量份接枝共聚物（B）的热塑性树脂组合物，其中，接枝共聚物（B）由芯（bc）的50〜99.5重量％和非交联壳（bs）的0.5〜50重量％构成，芯（bc）仅由具有玻璃化转变温度为20℃以下，非交联壳（bs）通过聚合含有52重量％至100重量％的丙烯酸酯和0重量％至48重量％的非交联壳的单体混合物可与丙烯酸酯共聚的乙烯基单体的重量％。

6. 发明申请

US20070001298A1 Semiconductor device with built-in capacitor, and method of producing the same 有权
标题翻译：具有内置电容器的半导体器件及其制造方法
公开(公告)号：US20070001298A1
公开(公告)日：2007-01-04
申请号：US11508289
申请日：2006-08-23
申请人： Kaname Ozawa , Mitsutaka Sato , Yoshiyuki Yoneda
发明人： Kaname Ozawa , Mitsutaka Sato , Yoshiyuki Yoneda
IPC分类号： H01L23/34
CPC分类号： H01L24/49 , H01L23/50 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05554 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/48229 , H01L2224/48465 , H01L2224/4903 , H01L2224/4911 , H01L2224/49171 , H01L2224/4945 , H01L2224/73204 , H01L2224/73265 , H01L2224/85191 , H01L2225/06506 , H01L2225/0651 , H01L2225/06572 , H01L2225/06582 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19107 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2924/00015
摘要： A semiconductor device of the invention includes a substrate in which a power-supply electrode and a ground electrode are provided. A first semiconductor chip is disposed over the substrate and has a first conductor layer formed on a surface facing a second semiconductor chip. A second conductor layer is disposed over the first semiconductor chip and has a second conductor layer formed on a surface facing the first semiconductor chip. And an adhesive layer is disposed between the first conductor layer and the second conductor layer and bonds together the first semiconductor chip and the second semiconductor chip. In the semiconductor device, the adhesive layer and the first and second conductor layers function as a capacitor.
摘要翻译：本发明的半导体器件包括其中设置有电源电极和接地电极的基板。第一半导体芯片设置在衬底上并且具有形成在面向第二半导体芯片的表面上的第一导体层。第二导体层设置在第一半导体芯片的上方，并且具有形成在面向第一半导体芯片的表面上的第二导体层。并且粘合剂层设置在第一导体层和第二导体层之间并且将第一半导体芯片和第二半导体芯片接合在一起。在半导体器件中，粘合剂层和第一和第二导体层用作电容器。

7. 发明授权

US06696754B2 Semiconductor module including a plurality of semiconductor devices detachably 失效
标题翻译：半导体模块可拆卸地包括多个半导体器件
公开(公告)号：US06696754B2
公开(公告)日：2004-02-24
申请号：US10214306
申请日：2002-08-08
申请人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
发明人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
IPC分类号： H01L2334
CPC分类号： H01L25/105 , H01L2224/48227 , H01L2225/1023 , H01L2924/09701 , H01L2924/1533 , H01L2924/3025 , H01R12/82 , H05K7/1431 , H01L2924/00
摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.
摘要翻译：半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可拆卸地保持半导体器件的插座。

8. 发明授权

US5773313A Semiconductor device and method of producing the same 失效
公开(公告)号：US5773313A
公开(公告)日：1998-06-30
申请号：US547616
申请日：1995-10-24
申请人： Mitsutaka Sato , Junichi Kasai
发明人： Mitsutaka Sato , Junichi Kasai
IPC分类号： H01L21/56 , H01L21/48 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50 , H05K3/34 , H01L21/60
CPC分类号： H01L24/06 , H01L21/4835 , H01L23/3107 , H01L23/3114 , H01L23/4951 , H01L23/49537 , H01L23/49548 , H01L23/49551 , H01L23/49555 , H01L24/05 , H05K3/3426 , H01L2224/04042 , H01L2224/05556 , H01L2224/05639 , H01L2224/05644 , H01L2224/06136 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/18165 , H01L2924/19107 , H05K2201/10689 , H05K2201/1084 , Y02P70/613 , Y10T29/49121
摘要： A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) and second ends which form external terminals (16) and each of the external terminals have a bottom surface, and a package (17, 31) encapsulating the semiconductor chip (11) and the leads (14) so that the bottom surface of each of the external terminals (16) is exposed at a bottom surface (17a, 31a) of the package (17, 31) and remaining portions of the leads (14) are embedded within the package (17, 31), where the package (17, 31) has a size which is approximately the same as that of the semiconductor chip (11) in a plan view viewed from above the top surface of the semiconductor chip (11).

9. 发明授权

US5409866A Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe 失效
标题翻译：用于制造固定到上引线框架和下引线框架的半导体器件的工艺
公开(公告)号：US5409866A
公开(公告)日：1995-04-25
申请号：US996589
申请日：1992-12-24
申请人： Mitsutaka Sato , Junichi Kasai , Masanori Yoshimoto , Kouichi Takeshita
发明人： Mitsutaka Sato , Junichi Kasai , Masanori Yoshimoto , Kouichi Takeshita
IPC分类号： H01L21/48 , H01L21/56 , H01L23/495 , H01L21/58 , H01L21/603
CPC分类号： H01L24/83 , H01L21/4842 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49544 , H01L23/49551 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/8385 , H01L2224/85181 , H01L2224/92147 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/181
摘要： A process for manufacturing semiconductor device including a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.
摘要翻译：一种制造半导体器件的方法，该半导体器件包括具有顶表面和底表面的半导体芯片，电连接到半导体芯片的上引线，其中在上引线和半导体芯片的顶表面之间形成第一间隙，半导体芯片，其中在下引线和半导体芯片的底表面之间形成第二间隙，以及封装树脂，其封装半导体芯片以保持第一和第二间隙。

10. 发明授权

US08664338B2 Processability improver for foam molding and vinyl chloride resin composition containing same 有权
标题翻译：泡沫成型加工性改进剂和含有它的氯乙烯树脂组合物
公开(公告)号：US08664338B2
公开(公告)日：2014-03-04
申请号：US13375652
申请日：2010-05-25
申请人： Mitsutaka Sato , Hideyuki Sakamoto , Hiroomi Tokimoto
发明人： Mitsutaka Sato , Hideyuki Sakamoto , Hiroomi Tokimoto
IPC分类号： C08J9/06 , C08F265/06 , C08L27/06 , C08L33/00
CPC分类号： C08L27/06 , C08F220/14 , C08F265/06 , C08J3/126 , C08J2333/06 , C08J2433/06 , C08L33/06 , C08L33/12 , C08L2205/02 , C08L2205/03 , C08L2666/04 , C08L51/003 , C08F2220/1825 , C08F2/22
摘要： An object of the present invention is to provide a foaming vinyl chloride resin composition having excellent foaming properties and providing a foam molded product with an excellent appearance by enhancing the melt strength of the vinyl chloride resin composition. A processability improver for foam molding according to the present invention includes a (meth)acrylic polymer powder with a weight average molecular weight of 2,000,000 to 7,000,000, wherein the (meth)acrylic polymer powder includes 1 to 20% by weight of a (meth)acrylic polymer (A) with a weight average molecular weight of 10,000 to 300,000, and 80 to 99% by weight of a (meth)acrylic polymer (B) with a weight average molecular weight of 2,000,000 to 7,000,000.
摘要翻译：本发明的目的是提供一种发泡性优异的发泡氯乙烯树脂组合物，通过提高氯乙烯树脂组合物的熔体强度，提供具有优异外观的发泡成型体。本发明的发泡成型加工性改进剂含有重均分子量为200万〜7,000,000的（甲基）丙烯酸系聚合物粉末，其中（甲基）丙烯酸系聚合物粉末含有1〜20重量％的（甲基）重均分子量为10,000〜300,000的丙烯酸系聚合物（A）和80〜99重量％的重均分子量为200万〜7,000,000的（甲基）丙烯酸系聚合物（B）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式