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1. 发明申请

US20070051470A1 Plasma processing apparatus and method 审中-公开
标题翻译：等离子体处理装置及方法
公开(公告)号：US20070051470A1
公开(公告)日：2007-03-08
申请号：US11362024
申请日：2006-02-27
申请人： Takehisa Iwakoshi , Junichi Tanaka , Hiroyuki Kitsunai , Toshio Masuda , Daisuke Shiraishi
发明人： Takehisa Iwakoshi , Junichi Tanaka , Hiroyuki Kitsunai , Toshio Masuda , Daisuke Shiraishi
IPC分类号： B08B3/12 , B08B6/00 , G06F19/00 , C23C16/00 , C23F1/00
CPC分类号： H01J37/32935 , B08B7/0035
摘要： A plasma processing apparatus includes: a processing chamber; a state detector for detecting a state of plasma in the processing chamber; an input unit for inputting process result data of a specimen processed in the plasma processing chamber; and a controller including a prediction equation forming unit for forming a prediction equation of a process result in accordance with plasma state data detected with the state detector for the plasma process simulating a specimen existing state in the processing chamber in a specimen non-placed state and process result data of the specimen input with the input unit and processed by the plasma process in a specimen placed state, and storing the prediction equation, wherein the controller predicts the process result of a succeeding plasma process in accordance with plasma state data newly acquired via the state detector in the specimen non-placed state and the stored prediction equation.
摘要翻译：一种等离子体处理装置，包括：处理室; 状态检测器，用于检测处理室中的等离子体的状态; 用于输入在所述等离子体处理室中处理的样本的处理结果数据的输入单元; 以及控制器，其包括预测方程式形成单元，用于根据用于等离子体处理的状态检测器检测的等离子体状态数据形成处理结果的预测方程，所述等离子体处理模拟在处理室中的样本未放置状态，使用输入单元输入的样本的处理结果数据，并且在样本放置状态下通过等离子体处理进行处理，并存储预测方程，其中控制器根据根据新近获取的等离子体状态数据预测后续等离子体处理的处理结果样品未放置状态下的状态检测器和存储的预测方程。

2. 发明授权

US07343217B2 System for monitoring and controlling a semiconductor manufacturing apparatus using prediction model equation 有权
标题翻译：使用预测模型方程式监测和控制半导体制造装置的系统
公开(公告)号：US07343217B2
公开(公告)日：2008-03-11
申请号：US11439265
申请日：2006-05-24
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A semiconductor processing apparatus for processing a semiconductor wafer includes a plurality of sensors for monitoring a processing state, a processing result input unit, a model equation generation unit to generate a model equation for predicting a processing result, a processing result prediction unit which predicts a processing result, and a process recipe control unit. Further, a system is provided which comprises the model equation generation unit is provided at a remote location, and transmits the generated prediction model equation to the semiconductor processing apparatus through a network to control the processing condition of the semiconductor processing apparatus by the process recipe control unit.
摘要翻译：用于处理半导体晶片的半导体处理装置包括用于监视处理状态的多个传感器，处理结果输入单元，用于生成用于预测处理结果的模型方程式的模型方程生成单元，预测处理结果预测单元处理结果，以及处理配方控制单元。此外，提供了一种系统，其包括在远程位置处提供模型方程生成单元，并且通过网络将生成的预测模型方程发送到半导体处理装置，以通过处理配方控制来控制半导体处理装置的处理状态单元。

3. 发明授权

US06616759B2 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor 有权
标题翻译：监控和/或控制半导体制造装置的方法及其系统
公开(公告)号：US06616759B2
公开(公告)日：2003-09-09
申请号：US09946732
申请日：2001-09-06
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamato , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamato , Shoji Ikuhara , Toshio Masuda
IPC分类号： B05C1302
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A method and system are provided for controlling and/or monitoring a semiconductor processing apparatus while predicting its processing results. The system includes a sensor for monitoring a processing state of the processing apparatus, a sensed data storage unit for preserving sensed data sent from the sensor, an input device for inputting measured values for processing results of semiconductor devices processed by the processing apparatus, a processing result measured value storage unit for preserving the inputted processing result measured values, a model equation generation unit for generating a model equation from preserved sensed data and processing result measured values, a model equation storage unit for preserving the generated model equation, a model equation based prediction unit for predicting processing results from the preserved model equation and the sensed data, and a process recipe control unit for controlling processing conditions of the processing apparatus from predicted processing results.
摘要翻译：提供一种用于在预测其处理结果的同时控制和/或监视半导体处理装置的方法和系统。该系统包括用于监视处理装置的处理状态的传感器，用于保存从传感器发送的感测数据的感测数据存储单元，用于输入用于处理由处理装置处理的半导体装置的处理结果的测量值的输入装置，结果测量值存储单元，用于保存输入的处理结果测量值;模型方程生成单元，用于从保存的感测数据和处理结果测量值生成模型方程;模型方程式存储单元，用于保存生成的模型方程;基于模型方程预测单元，用于从保存的模型方程和感测数据预测处理结果;以及处理配方控制单元，用于根据预测的处理结果控制处理装置的处理条件。

4. 发明授权

US07058470B2 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor 有权
标题翻译：监控和/或控制半导体制造装置的方法及其系统
公开(公告)号：US07058470B2
公开(公告)日：2006-06-06
申请号：US10999006
申请日：2004-11-30
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A semiconductor processing apparatus for processing a semiconductor wafer includes a sensor for monitoring a processing state of the semiconductor processing apparatus, a processing result input unit which inputs measured values for processing results of a semiconductor wafer processed by the semiconductor processing apparatus, and a model equation generation unit relying on sensed data acquired by the sensor and the measured values to generate a model equation for predicting a processing result using the sensed data as an explanatory variable. The apparatus includes a processing result prediction unit which predicts a processing result based on the model equation and the sensed data, and a process recipe control unit which compares the predicted processing result with a previously set value to control a processing condition or input parameter. The process recipe control unit includes a controller which controls at least one of a plurality of different processing performances for processing of the semiconductor wafer.
摘要翻译：用于处理半导体晶片的半导体处理装置包括：用于监视半导体处理装置的处理状态的传感器;输入由半导体处理装置处理的半导体晶片的处理结果的测量值的处理结果输入单元;以及模型方程依赖于由传感器获取的感测数据和测量值，以产生用于使用感测数据作为解释变量来预测处理结果的模型方程。该装置包括：处理结果预测单元，其基于模型方程和感测数据预测处理结果;以及处理配方控制单元，其将预测的处理结果与预先设定的值进行比较，以控制处理条件或输入参数。处理配方控制单元包括控制器，用于控制用于处理半导体晶片的多个不同处理性能中的至少一个。

5. 发明申请

US20050087298A1 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor 有权
标题翻译：监控和/或控制半导体制造装置的方法及其系统
公开(公告)号：US20050087298A1
公开(公告)日：2005-04-28
申请号：US10999006
申请日：2004-11-30
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
IPC分类号： G05B19/418 , H01L21/66 , C23F1/00
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A semiconductor processing apparatus for processing a semiconductor wafer includes a sensor for monitoring a processing state of the semiconductor processing apparatus, a processing result input unit which inputs measured values for processing results of a semiconductor wafer processed by the semiconductor processing apparatus, and a model equation generation unit relying on sensed data acquired by the sensor and the measured values to generate a model equation for predicting a processing result using the sensed data as an explanatory variable. The apparatus includes a processing result prediction unit which predicts a processing result based on the model equation and the sensed data, and a process recipe control unit which compares the predicted processing result with a previously set value to control a processing condition. The process recipe control unit includes a controller which controls at least one among a plurality of different processing performances for processing of the semiconductor wafer.
摘要翻译：用于处理半导体晶片的半导体处理装置包括：用于监视半导体处理装置的处理状态的传感器;输入由半导体处理装置处理的半导体晶片的处理结果的测量值的处理结果输入单元;以及模型方程依赖于由传感器获取的感测数据和测量值，以产生用于使用感测数据作为解释变量来预测处理结果的模型方程。该装置包括：处理结果预测单元，其基于模型方程和感测数据预测处理结果;以及处理配方控制单元，其将预测处理结果与预先设定的值进行比较，以控制处理条件。处理配方控制单元包括控制用于处理半导体晶片的多个不同处理性能中的至少一个的控制器。

6. 发明申请

US20060212156A1 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and system therefor 有权
标题翻译：监控和/或控制半导体制造装置的方法及其系统
公开(公告)号：US20060212156A1
公开(公告)日：2006-09-21
申请号：US11439265
申请日：2006-05-24
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A semiconductor processing apparatus for processing a semiconductor wafer includes a plurality of sensors for monitoring a processing state, a processing result input unit, a model equation generation unit to generate a model equation for predicting a processing result, a processing result prediction unit which predicts a processing result, and a process recipe control unit. Further, a system is provided which comprises the model equation generation unit is provided at a remote location, and transmits the generated prediction model equation to the semiconductor processing apparatus through a network to control the processing condition of the semiconductor processing apparatus by the process recipe control unit.
摘要翻译：用于处理半导体晶片的半导体处理装置包括用于监视处理状态的多个传感器，处理结果输入单元，用于生成用于预测处理结果的模型方程式的模型方程生成单元，预测处理结果预测单元处理结果，以及处理配方控制单元。此外，提供了一种系统，其包括在远程位置处提供模型方程生成单元，并且通过网络将生成的预测模型方程发送到半导体处理装置，以通过处理配方控制来控制半导体处理装置的处理状态单元。

7. 发明授权

US06828165B2 Semiconductor plasma processing apparatus with first and second processing state monitoring units 有权
标题翻译：具有第一和第二处理状态监测单元的半导体等离子体处理装置
公开(公告)号：US06828165B2
公开(公告)日：2004-12-07
申请号：US10438842
申请日：2003-05-16
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
IPC分类号： H01L2166
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A semiconductor plasma processing apparatus for processing a semiconductor wafer includes a sensor for monitoring at least one processing state of the semiconductor plasma processing apparatus, first and second processing state monitoring units coupled to the sensor, and a selector unit for selecting one of the first and second processing state monitoring units.
摘要翻译：一种用于处理半导体晶片的半导体等离子体处理装置，包括用于监视半导体等离子体处理装置的至少一个处理状态的传感器，耦合到传感器的第一和第二处理状态监控单元，以及选择器单元，用于选择第一和第第二处理状态监控单元。

8. 发明授权

US06706543B2 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a therefor 有权
标题翻译：监控和/或控制半导体制造装置的方法和方法
公开(公告)号：US06706543B2
公开(公告)日：2004-03-16
申请号：US10196208
申请日：2002-07-17
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda
IPC分类号： H01L2166
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A method and system are provided for controlling and/or monitoring a semiconductor processing apparatus while predicting its processing results. The system includes a sensor for monitoring a processing state of the processing apparatus, a sensed data storage unit for preserving sensed data sent from the sensor, an input device for inputting measured values for processing results of semiconductor devices processed by the processing apparatus, a processing result measured value storage unit for preserving the inputted processing result measured values, a model equation generation unit for generating a model equation from preserved sensed data and processing result measured values, a model equation storage unit for preserving the generated model equation, a model equation based prediction unit for predicting processing results from the preserved model equation and the sensed data, and a process recipe control unit for controlling processing conditions of the processing apparatus from predicted processing results.
摘要翻译：提供一种用于在预测其处理结果的同时控制和/或监视半导体处理装置的方法和系统。该系统包括用于监视处理装置的处理状态的传感器，用于保存从传感器发送的感测数据的感测数据存储单元，用于输入用于处理由处理装置处理的半导体装置的处理结果的测量值的输入装置，结果测量值存储单元，用于保存输入的处理结果测量值;模型方程生成单元，用于从保存的感测数据和处理结果测量值生成模型方程;模型方程式存储单元，用于保存生成的模型方程;基于模型方程预测单元，用于从保存的模型方程和感测数据预测处理结果;以及处理配方控制单元，用于根据预测的处理结果控制处理装置的处理条件。

9. 发明申请

US20050158886A1 Method for processing semiconductor 有权
标题翻译：半导体处理方法
公开(公告)号：US20050158886A1
公开(公告)日：2005-07-21
申请号：US11066221
申请日：2005-02-28
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Hideyuki Yamamoto , Akira Kagoshima , Daisuke Shiraishi
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Hideyuki Yamamoto , Akira Kagoshima , Daisuke Shiraishi
IPC分类号： H01J37/32 , H01L21/00 , G01L21/30
CPC分类号： H01L21/67276 , H01J37/32935 , H01J37/32972 , H01J37/3299 , H01L21/67253
摘要： A method of processing a semiconductor which includes providing a process gas supply unit for supplying a process gas to a sample stand to hold a sample in a process chamber and to the process chamber, successively supplying a plurality of samples of a lot to the process chamber to conduct an intra-lot successive process, predicting, before a lot process is started and according to sensor data detected by a state sensor to detect a state in the process chamber, intra-lot variation patterns of results of the intra-lot successive process, and changing, according to a result of the prediction by the intra-lot variation pattern prediction unit, a process condition applied to a sample of the lot and conducting the lot process.
摘要翻译：一种处理半导体的方法，包括提供用于向样品台供应处理气体的处理气体供应单元，以将样品保持在处理室和处理室中，将多个样品批次连续地供应到处理室进行批量间连续处理，在大量处理开始之前，根据由状态传感器检测到的传感器数据来检测处理室中的状态，批量间连续处理的结果的批内变化模式并且根据批内变化模式预测单元的预测结果，改变应用于批次的样本的处理条件并进行批次处理。

10. 发明授权

US07473332B2 Method for processing semiconductor 有权
标题翻译：半导体处理方法
公开(公告)号：US07473332B2
公开(公告)日：2009-01-06
申请号：US11066221
申请日：2005-02-28
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Hideyuki Yamamoto , Akira Kagoshima , Daisuke Shiraishi
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Hideyuki Yamamoto , Akira Kagoshima , Daisuke Shiraishi
IPC分类号： H01L21/00 , C23C16/00 , C22C14/00
CPC分类号： H01L21/67276 , H01J37/32935 , H01J37/32972 , H01J37/3299 , H01L21/67253
摘要： A method of processing a semiconductor which includes providing a process gas supply unit for supplying a process gas to a sample stand to hold a sample in a process chamber and to the process chamber, successively supplying a plurality of samples of a lot to the process chamber to conduct an intra-lot successive process, predicting, before a lot process is started and according to sensor data detected by a state sensor to detect a state in the process chamber, intra-lot variation patterns of results of the intra-lot successive process, and changing, according to a result of the prediction by the intra-lot variation pattern prediction unit, a process condition applied to a sample of the lot and conducting the lot process.
摘要翻译：一种处理半导体的方法，包括提供用于向样品台供应处理气体的处理气体供应单元，以将样品保持在处理室和处理室中，将多个样品批次连续地供应到处理室进行批量间连续处理，在大量处理开始之前，根据由状态传感器检测到的传感器数据来检测处理室中的状态，批量间连续处理的结果的批内变化模式并且根据批内变化模式预测单元的预测结果，改变应用于批次的样本的处理条件并进行批次处理。

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