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1. 发明授权

US06695920B1 Mandrel for supporting a stent and a method of using the mandrel to coat a stent 有权
公开(公告)号：US06695920B1
公开(公告)日：2004-02-24
申请号：US09894248
申请日：2001-06-27
申请人： Stephen D. Pacetti , Mohammed E. Moein
发明人： Stephen D. Pacetti , Mohammed E. Moein
IPC分类号： B05C1302
CPC分类号： A61L31/00 , A61F2/91 , A61F2/915 , A61F2002/91533 , B05C13/025
摘要： A mandrel for supporting a stent and a method of applying a coating to the stent supported by the mandrel are disclosed.

2. 发明授权

US06673154B1 Stent mounting device to coat a stent 有权
标题翻译：用于支架的支架安装装置
公开(公告)号：US06673154B1
公开(公告)日：2004-01-06
申请号：US09896000
申请日：2001-06-28
申请人： Stephen D. Pacetti , Plaridel K. Villareal
发明人： Stephen D. Pacetti , Plaridel K. Villareal
IPC分类号： B05C1302
CPC分类号： B05B13/0442 , B05D1/002
摘要： A stent mounting device and a method of coating a stent using the device are provided.
摘要翻译：提供一种支架安装装置和使用该装置涂覆支架的方法。

3. 发明授权

US06616759B2 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor 有权
标题翻译：监控和/或控制半导体制造装置的方法及其系统
公开(公告)号：US06616759B2
公开(公告)日：2003-09-09
申请号：US09946732
申请日：2001-09-06
申请人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamato , Shoji Ikuhara , Toshio Masuda
发明人： Junichi Tanaka , Hiroyuki Kitsunai , Akira Kagoshima , Daisuke Shiraishi , Hideyuki Yamamato , Shoji Ikuhara , Toshio Masuda
IPC分类号： B05C1302
CPC分类号： H01L22/20 , G05B13/048 , G05B19/41865 , G05B23/024 , G05B2219/31357 , G05B2219/32058 , H01L21/67276 , H01L2924/0002 , Y02P90/12 , Y02P90/14 , Y02P90/18 , Y02P90/20 , H01L2924/00
摘要： A method and system are provided for controlling and/or monitoring a semiconductor processing apparatus while predicting its processing results. The system includes a sensor for monitoring a processing state of the processing apparatus, a sensed data storage unit for preserving sensed data sent from the sensor, an input device for inputting measured values for processing results of semiconductor devices processed by the processing apparatus, a processing result measured value storage unit for preserving the inputted processing result measured values, a model equation generation unit for generating a model equation from preserved sensed data and processing result measured values, a model equation storage unit for preserving the generated model equation, a model equation based prediction unit for predicting processing results from the preserved model equation and the sensed data, and a process recipe control unit for controlling processing conditions of the processing apparatus from predicted processing results.
摘要翻译：提供一种用于在预测其处理结果的同时控制和/或监视半导体处理装置的方法和系统。该系统包括用于监视处理装置的处理状态的传感器，用于保存从传感器发送的感测数据的感测数据存储单元，用于输入用于处理由处理装置处理的半导体装置的处理结果的测量值的输入装置，结果测量值存储单元，用于保存输入的处理结果测量值;模型方程生成单元，用于从保存的感测数据和处理结果测量值生成模型方程;模型方程式存储单元，用于保存生成的模型方程;基于模型方程预测单元，用于从保存的模型方程和感测数据预测处理结果;以及处理配方控制单元，用于根据预测的处理结果控制处理装置的处理条件。

4. 发明授权

US06471777B1 Holder for electroless plating and method of electroless plating 有权
标题翻译：化学镀的持有人和化学镀的方法
公开(公告)号：US06471777B1
公开(公告)日：2002-10-29
申请号：US09421725
申请日：1999-10-20
申请人： Mikiya Kobayashi , Yoshihiko Takano , Kiyomi Sasaki , Hiroyuki Ukai , Hidetsugu Hosomi , Akira Imamura
发明人： Mikiya Kobayashi , Yoshihiko Takano , Kiyomi Sasaki , Hiroyuki Ukai , Hidetsugu Hosomi , Akira Imamura
IPC分类号： B05C1302
CPC分类号： C23C18/163
摘要： A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.
摘要翻译：一种用于在化学镀处理期间用于保持陶瓷电子部件的多个陶瓷元件的保持器，所述陶瓷元件的每个表面将被无电镀，所述保持器包括多个单元以分别容纳所述多个陶瓷元件中的每一个，并且每个所述单元具有允许电镀液流入电池的结构。

5. 发明授权

US06319317B1 Coating film forming method and coating apparatus 有权
标题翻译：涂膜成型方法和涂布装置
公开(公告)号：US06319317B1
公开(公告)日：2001-11-20
申请号：US09551876
申请日：2000-04-18
申请人： Hideyuki Takamori
发明人： Hideyuki Takamori
IPC分类号： B05C1302
CPC分类号： H01L21/6715 , B05C11/08 , G03F7/162 , Y10S134/902 , Y10S430/136 , Y10T137/0324
摘要： A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.
摘要翻译：通过检测传感器检测涂布溶液的外周的轮廓的扩展状态，并且控制作为基板的晶片的旋转速度等，使得轮廓的扩展速度不超过预定的没有产生便签的危险。或者，测量暂存器的半径方向的宽度，并且控制晶片的旋转速度等，使得半径方向上的宽度不超过预定值。因此，防止了暂存器的发生或其程度降低，从而避免了涂布液在基板上的涂覆，并减少了所用的涂布溶液的量。

6. 发明授权

US06171400B2 Vertical semiconductor wafer carrier 有权
标题翻译：垂直半导体晶片载体
公开(公告)号：US06171400B2
公开(公告)日：2001-01-09
申请号：US09165542
申请日：1998-10-02
申请人： Larry S. Wingo
发明人： Larry S. Wingo
IPC分类号： B05C1302
CPC分类号： H01L21/67309 , Y10S206/832 , Y10S269/902 , Y10S269/904 , Y10S269/909 , Y10S414/135 , Y10S414/141 , Y10T29/49996
摘要： An apparatus for holding a plurality of semiconductor wafers during heat treatment of the wafers in a furnace comprises a plurality of rails extending essentially vertically between a top and bottom plate. Each rail contains a plurality of teeth arranged such that the space between adjacent teeth can receive a portion of a single semiconductor wafer. Each tooth contains a raised support structure, typically a ledge, located on the top surface of each tooth for supporting the wafer, usually from the edge of the wafer inward to a point located from the center of the wafer a distance equal to between about 25% and about 75% of the wafer's radius. Such an apparatus with its relatively long teeth is especially designed to uniformly support larger wafers, i.e., wafers having a nominal diameter greater than about 200 millimeters, such that their own weight does not cause the wafers to sag and thereby produce crystal dislocations or slip when the wafers are heated to high temperatures.
摘要翻译：在炉中的晶片的热处理期间保持多个半导体晶片的装置包括在顶板和底板之间基本垂直延伸的多个轨道。每个轨道包含多个齿，其布置成使得相邻齿之间的空间可以容纳单个半导体晶片的一部分。每个齿都包含凸起的支撑结构，通常为凸缘，其位于每个齿的顶表面上，用于支撑晶片，通常从晶片的边缘向内到达位于晶片中心的点，距离等于约25 ％和约75％的晶圆半径。具有相对长的齿的这种装置特别设计成均匀地支撑较大的晶片，即具有大于约200毫米的公称直径的晶片，使得它们自身的重量不会导致晶片下垂，从而产生晶体位错或滑动将晶片加热至高温。

7. 发明授权

US06818063B1 Stent mandrel fixture and method for minimizing coating defects 有权
标题翻译：支架心轴夹具和最小化涂层缺陷的方法
公开(公告)号：US06818063B1
公开(公告)日：2004-11-16
申请号：US10254203
申请日：2002-09-24
申请人： Cameron Kerrigan
发明人： Cameron Kerrigan
IPC分类号： B05C1302
CPC分类号： B05C13/025 , A61F2/82
摘要： A stent mandrel fixture for supporting a stent during the application of a coating substance is provided.
摘要翻译：提供了一种用于在施加涂层物质期间支撑支架的支架心轴夹具。

8. 发明授权

US06719844B2 Deposition method, deposition apparatus, and pressure-reduction drying apparatus 失效
标题翻译：沉积方法，沉积装置和减压干燥装置
公开(公告)号：US06719844B2
公开(公告)日：2004-04-13
申请号：US10302894
申请日：2002-11-25
申请人： Tatsuhiko Ema , Shinichi Ito
发明人： Tatsuhiko Ema , Shinichi Ito
IPC分类号： B05C1302
CPC分类号： B05D3/02 , B05D1/02 , B05D1/26
摘要： Using a scan coating method, a liquid film is formed on a substrate having a temperature distribution for correcting a temperature distribution of a liquid film caused by the heat of evaporation due to the volatilization of a solvent contained in the liquid film, and then the solvent is removed from the liquid film to form a coating film.
摘要翻译：使用扫描涂布法，在具有温度分布的基板上形成液膜，所述温度分布用于校正由于液膜中所含溶剂的挥发引起的蒸发热引起的液膜的温度分布，然后溶剂从液膜中除去以形成涂膜。

9. 发明授权

US06544338B1 Inverted hot plate cure module 有权
标题翻译：倒置热板固化模块
公开(公告)号：US06544338B1
公开(公告)日：2003-04-08
申请号：US09502417
申请日：2000-02-10
申请人： William Tom Batchelder , Fred Joseph Chetcuti , Lawrence Allen Gochberg
发明人： William Tom Batchelder , Fred Joseph Chetcuti , Lawrence Allen Gochberg
IPC分类号： B05C1302
CPC分类号： H01L21/67109
摘要： A curing module for use in fabricating semiconductor wafers is provided. The cure module comprises a housing and a bottom plate. The housing also contains a heating plate adjacent a top surface of the housing and side walls extending from the top surface. The housing sidewalls, the heating plate and the bottom plate define a chamber within the cure module. Films disposed on semiconductor wafers are cured within the chamber by being raised on lift pins to the heating plate during a heating operation and then lowered on the lift pins to the bottom plate during a cooling operation.
摘要翻译：提供了一种用于制造半导体晶片的固化模块。固化模块包括壳体和底板。壳体还包括邻近壳体的顶表面的加热板和从顶表面延伸的侧壁。壳体侧壁，加热板和底板在固化模块内限定腔室。设置在半导体晶片上的膜通过在加热操作期间在提升销上被升高到加热板而在室内固化，然后在制冷操作期间将升降销降低到底板。

10. 发明授权

US06491755B1 Painting apparatus with compound rack 失效
标题翻译：复合机架涂装
公开(公告)号：US06491755B1
公开(公告)日：2002-12-10
申请号：US09658908
申请日：2000-09-11
申请人： Joseph S. Meinke
发明人： Joseph S. Meinke
IPC分类号： B05C1302
CPC分类号： B05B13/0228 , B05B13/0242 , B05B13/0405 , B05B13/0442 , B05B13/0447
摘要： A painting apparatus including a rack assembly mounted on a carriage and adapted to be moved on the carriage between a load station, a paint application station, and an unload station. The rack assembly includes a main rack assembly mounted for rotation about a central axis and a plurality of rack subassemblies carried by the main rack assembly and mounted for respective rotation about a plurality of subassembly axes spaced circumferentially about and parallel to the central axis. As the main rack assembly undergoes rotation about the central axis at the paint application station, the rack subassemblies simultaneously rotate about their subassembly axes so that the parts carried by the subassemblies undergo a compound rotation with the result that even intricate interior surfaces on the parts are given a uniform coating of paint.
摘要翻译：一种涂装设备，包括安装在托架上并适于在装载站，涂漆施工站和卸载站之间在托架上移动的搁架组件。机架组件包括安装成用于围绕中心轴线旋转的主机架组件和由主机架组件承载的多个机架子组件，并且安装成围绕围绕并平行于中心轴线周向间隔开的多个子组件轴线进行各自旋转。当主机架组件在油漆施工台处经历围绕中心轴线的旋转时，齿条子组件同时围绕其子组件轴线旋转，使得由子组件承载的部件经历复合旋转，结果是部件上的复杂的内表面是给出均匀的油漆涂层。

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