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    • 2. 发明授权
    • Method for manufacturing molded foam
    • 制造模制泡沫的方法
    • US08343413B2
    • 2013-01-01
    • US12913003
    • 2010-10-27
    • Masaaki OnoderaTeruo TamadaTatsuya FukudaYu IgarashiYoshinori Ohno
    • Masaaki OnoderaTeruo TamadaTatsuya FukudaYu IgarashiYoshinori Ohno
    • B29C44/50B29C44/34
    • B29C44/08B29C44/06B29C44/3403
    • An object of the invention is to provide a method for manufacturing a molded foam which is lightweight and excellent in strength. According to the invention, a method for manufacturing a molded foam from a foamed parison includes: an extruding step of extruding a resin blend containing a foaming agent and a thermoplastic resin to form a foamed parison; an attaching step of closely attaching facing portions of an inner wall surface of the foamed parison to each other to form a foamed parison laminated body; a mold clamping step of sealing and mold clamping the foamed parison laminated body by clamping the foamed parison laminated body by split mold blocks; and a sucking step of sucking air between the split mold blocks to reduce a pressure between the split mold blocks, after the attaching step and the mold clamping step.
    • 本发明的目的是提供一种轻质且强度优异的模制泡沫塑料的制造方法。 根据本发明,用于从发泡型坯制造模塑泡沫的方法包括:挤出包含发泡剂和热塑性树脂的树脂共混物以形成发泡型坯的挤出步骤; 将发泡型坯的内壁面的面对部彼此紧密连接以形成发泡型坯层压体的安装步骤; 通过用分开的模块夹紧发泡型坯层压体来密封和模制夹紧发泡型坯层压体的模具夹紧步骤; 以及在安装步骤和合模步骤之后,在分开的模具块之间吸入空气以减小分开的模具块之间的压力的抽吸步骤。
    • 3. 发明申请
    • TRAVEL DISTANCE ESTIMATING APPARATUS, TRAVEL DISTANCE ESTIMATING METHOD, TRAVEL DISTANCE ESTIMATING PROGRAM, AND RECORDING MEDIUM
    • 旅行距离估计装置,旅行距离估计方法,旅行距离估计程序和记录介质
    • US20130179062A1
    • 2013-07-11
    • US13822012
    • 2010-09-17
    • Mitsuo YasushiSusumu OhsawaTatsuya FukudaKyoichiro Fujii
    • Mitsuo YasushiSusumu OhsawaTatsuya FukudaKyoichiro Fujii
    • G06F17/00
    • G06F17/00G01C21/3469
    • A travel distance estimating apparatus (100) estimates a travel distance of a moving body in a given section through which the moving body travels (hereinafter referred to as a “travel interval”). A current position acquiring unit (101) acquires the current position of the moving body. A variable acquiring unit (102) acquires information related to the speed of the moving body in the travel interval. An estimating unit (103) estimates based on a consumed energy estimating equation, energy consumption and a travelable distance for travel through the travel interval. A correcting unit (104) corrects information related to the moving body and used as variables of the consumed energy estimating equation. A storage unit (105) stores information related to roads associated with a travel history of the moving body. A display unit (110) displays map data including information related to travelable distance calculated by the estimating unit (103).
    • 移动距离估计装置(100)估计移动体行进的给定部分中的移动体的移动距离(以下称为“行进间隔”)。 当前位置获取单元(101)获取移动体的当前位置。 变量获取单元(102)在移动间隔中获取与移动体的速度相关的信息。 估计单元(103)基于消耗的能量估计方程,能量消耗和通过行进间隔的行进行驶距离来估计。 校正单元(104)校正与移动体相关的信息并将其用作消耗的能量估计方程的变量。 存储单元(105)存储与移动体的旅行历史相关的道路的信息。 显示单元(110)显示包括由估计单元(103)计算的与可行驶距离有关的信息的地图数据。
    • 6. 发明授权
    • Semiconductor memory device surely reset upon power on
    • 上电时,半导体存储器件确实复位
    • US5870342A
    • 1999-02-09
    • US990575
    • 1997-12-15
    • Tatsuya Fukuda
    • Tatsuya Fukuda
    • G11C11/413G11C11/401G11C29/14G11C29/46G11C7/00G11C8/00G11C16/04
    • G11C29/46
    • A mode setting signal generating circuit activates mode setting signals in accordance with external signals. A test mode activating signal generating circuit takes in an externally applied address signal Add as the mode setting signals are activated, and drives a test mode activating signal to the active state in accordance with the state thereof. As power on detection signal from a power on detection circuit is activated, test mode activating signal is reset to the initial state, and a reset circuit holds the test mode activating signal at the inactive state, in accordance with imperfect activation of the power on detection signal. Internal state is prevented from erroneously set to a test mode state, even when power on detection signal is imperfectly generated at the time of power on.
    • 模式设定信号发生电路根据外部信号激活模式设定信号。 当模式设定信号被激活时,测试模式激活信号发生电路接收外部施加的地址信号,并根据其状态将测试模式激活信号驱动到激活状态。 由于来自上电检测电路的上电检测信号被激活,测试模式激活信号被复位到初始状态,并且复位电路将测试模式激活信号保持在不活动状态,这是根据电源开启检测的不完全激活 信号。 即使在接通电源时不完全地产生上电检测信号,也防止内部状态错误地设定为测试模式状态。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06784529B2
    • 2004-08-31
    • US10329342
    • 2002-12-27
    • Tatsuya FukudaTomokazu Otani
    • Tatsuya FukudaTomokazu Otani
    • H01L2302
    • H05K1/181H01L25/105H01L2225/1023H01L2225/1029H01L2225/1064H01L2225/107H01L2924/0002H05K2201/10515H05K2201/10689H05K2201/10734Y02P70/611H01L2924/00
    • A semiconductor device of the present invention includes the multi-stacked structure having the bottom semiconductor package with BGA or PGA terminals so that the total number of terminals of the semiconductor device can be increased without increasing the mounting area. In particular, the semiconductor device includes a first semiconductor package having an upper and lower surfaces. The first semiconductor package has a plurality of land terminals on the lower surface. The semiconductor device also includes a second semiconductor package having a planar configuration substantially the same as that of the first semiconductor package, which is provided on the upper surface of the first semiconductor package. The second semiconductor package has a plurality of lead terminals extending from a side surface of the second semiconductor package.
    • 本发明的半导体器件包括具有BGA或PGA端子的底部半导体封装的多层结构,从而可以在不增加安装面积的情况下增加半导体器件的端子总数。 特别地,半导体器件包括具有上表面和下表面的第一半导体封装。 第一半导体封装在下表面上具有多个焊盘端子。 半导体器件还包括第二半导体封装,其具有与设置在第一半导体封装的上表面上的与第一半导体封装基本相同的平面配置。 第二半导体封装具有从第二半导体封装的侧表面延伸的多个引线端子。