专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07955675B2 Weld joint for fuel tank 有权
标题翻译：燃油箱焊接
公开(公告)号：US07955675B2
公开(公告)日：2011-06-07
申请号：US11951549
申请日：2007-12-06
申请人： Takayuki Maeda , Atsuo Miyajima , Kazushige Sakazaki , Kentaro Sugita
发明人： Takayuki Maeda , Atsuo Miyajima , Kazushige Sakazaki , Kentaro Sugita
IPC分类号： B32B27/08 , B29C47/00 , F16L13/02 , B65D57/00
CPC分类号： B60K15/03177 , B29C45/0025 , B29C45/14065 , B29C65/2061 , B29C66/112 , B29C66/1122 , B29C66/131 , B29C66/232 , B29C66/24221 , B29C66/53247 , B29C66/71 , B29C66/712 , B29C66/7234 , B29C66/73921 , B29C66/8322 , B29C2045/14131 , B29K2023/065 , B29K2023/086 , B29K2077/00 , B29K2995/0041 , B29K2995/0069 , B29L2009/00 , B29L2031/7172 , Y10T428/1379 , Y10T428/139
摘要： A weld joint has a weld portion for being welded and bonded to a rim portion around an opening of a resin fuel tank. The weld portion is made of a resin alloy material that is obtained by alloying EVOH or PA with a modified HDPE. A highly-weldable layer is provided in an extremity portion of the weld portion throughout an entire circumference of the weld portion. The highly-weldable layer is made of HDPE and/or a modified HDPE having good weldability to the resin fuel tank. An extremity end surface of the highly-weldable layer serves as a weld surface for welding the weld portion to the resin fuel tank.
摘要翻译：焊接接头具有焊接部分，用于焊接并结合到围绕树脂燃料箱的开口的边缘部分。焊接部由EVOH或PA与改性HDPE合金化得到的树脂合金材料制成。在焊接部的整个圆周上的焊接部的末端部设置高度可焊接层。高可焊接层由HDPE和/或与树脂燃料箱具有良好可焊性的改性HDPE制成。高可焊接层的末端表面用作将焊接部分焊接到树脂燃料箱的焊接表面。

2. 发明申请

US20080138554A1 Weld Joint for Fuel Tank 有权
标题翻译：燃油箱焊接
公开(公告)号：US20080138554A1
公开(公告)日：2008-06-12
申请号：US11951549
申请日：2007-12-06
申请人： Takayuki Maeda , Atsuo Miyajima , Kazushige Sakazaki , Kentaro Sugita
发明人： Takayuki Maeda , Atsuo Miyajima , Kazushige Sakazaki , Kentaro Sugita
IPC分类号： B32B1/08
CPC分类号： B60K15/03177 , B29C45/0025 , B29C45/14065 , B29C65/2061 , B29C66/112 , B29C66/1122 , B29C66/131 , B29C66/232 , B29C66/24221 , B29C66/53247 , B29C66/71 , B29C66/712 , B29C66/7234 , B29C66/73921 , B29C66/8322 , B29C2045/14131 , B29K2023/065 , B29K2023/086 , B29K2077/00 , B29K2995/0041 , B29K2995/0069 , B29L2009/00 , B29L2031/7172 , Y10T428/1379 , Y10T428/139
摘要： A weld joint has a weld portion for being welded and bonded to a rim portion around an opening of a resin fuel tank. The weld portion is made of a resin alloy material that is obtained by alloying EVOH or PA with a modified HDPE. A highly-weldable layer is provided in an extremity portion of the weld portion throughout an entire circumference of the weld portion. The highly-weldable layer is made of HDPE and/or a modified HDPE having good weldability to the resin fuel tank. An extremity end surface of the highly-weldable layer serves as a weld surface for welding the weld portion to the resin fuel tank.
摘要翻译：焊接接头具有焊接部分，用于焊接并结合到围绕树脂燃料箱的开口的边缘部分。焊接部由EVOH或PA与改性HDPE合金化得到的树脂合金材料制成。在焊接部的整个圆周上的焊接部的末端部设置高度可焊接层。高可焊接层由HDPE和/或与树脂燃料箱具有良好可焊性的改性HDPE制成。高可焊接层的末端表面用作将焊接部分焊接到树脂燃料箱的焊接表面。

3. 发明申请

US20100141587A1 ELECTRONIC DEVICE HAVING RECONFIGURABLE KEYBOARD LAYOUT AND METHOD FOR RECONFIGURING KEYBOARD LAYOUT 审中-公开
标题翻译：具有可重构键盘布局的电子设备和用于重新构建键盘布局的方法
公开(公告)号：US20100141587A1
公开(公告)日：2010-06-10
申请号：US12541313
申请日：2009-08-14
申请人： Yukio Takahashi , Takayuki Maeda
发明人： Yukio Takahashi , Takayuki Maeda
IPC分类号： G06F3/02 , H04M1/02
CPC分类号： G06F1/1624 , G06F1/1664 , G06F3/0238 , G06F2200/1614 , H04M1/0235 , H04M1/22 , H04M2250/12
摘要： An electronic device having a plurality of operation keys, a position sensor, a keyboard layout controller and a keyboard illumination controller is provided. The operation keys are configured to form a reconfigurable keyboard layout. The keyboard layout controller is configured to reconfigure the keyboard layout in accordance with the position of the electronic device sensed by the position sensor. The keyboard illumination controller is configured to illuminate one of the operation keys being usable in the keyboard layout after the reconfiguration.
摘要翻译：提供具有多个操作键的电子设备，位置传感器，键盘布局控制器和键盘照明控制器。操作键被配置成形成可重新配置的键盘布局。键盘布局控制器被配置为根据位置传感器感测到的电子设备的位置重新配置键盘布局。键盘照明控制器被配置为在重新配置之后照亮在键盘布局中可用的操作键之一。

4. 发明授权

US5804871A Lead on chip semiconductor device having bus bars and crossing leads 失效
标题翻译：具有母线和交叉引线的芯片上半导体器件
公开(公告)号：US5804871A
公开(公告)日：1998-09-08
申请号：US838471
申请日：1997-04-07
申请人： Takayuki Maeda
发明人： Takayuki Maeda
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49517 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/14
摘要： Along the column of bonding pad (1), bidding terminal portions (2c), (3c), (4a), (5a) of bus bars (2), (3), and signal lines (4), (5) are arranged; principal wiring portions (2a), (3a) are made to extend in a 3-dimensional crossing configuration with respect to the signal lines, and they are connected to the bonding terminal portion of the bus bars, forming the IC package of the LOC type. Between the various bonding terminal portions and the various bonding pads, there exists no main wiring portion of the bus bar. Consequently, bonding wires (6), (7), (8), (9) do not straddle the bus bar principal wiring portion. As a result, when the bonding wire is not elevated, the bonding wire still does not make contact with the bus bar principal wiring portion to cause short circuit; as a result, the reliability is high and the device becomes thinner.
摘要翻译：沿着接合焊盘（1）的列，母线（2），（3）和信号线（4），（5）的招标终端部分（2c），（3c），（4a），（5a）安排主配线部分（2a），（3a）相对于信号线以三维交叉构造延伸，并且连接到母线的接合端子部分，形成LOC型的IC封装。在各种接合端子部分和各种接合焊盘之间，母线不存在主配线部分。因此，接合线（6），（7），（8），（9）不跨越母线主布线部。结果，当接合线不升高时，接合线仍然不会与母线主布线部分接触而导致短路; 结果，可靠性高，装置变薄。

5. 发明授权

US08431047B2 Polyvinyl acetal resin composition 有权
标题翻译：聚乙烯醇缩醛树脂组合物
公开(公告)号：US08431047B2
公开(公告)日：2013-04-30
申请号：US12921450
申请日：2009-09-16
申请人： Kenichi Ootsuki , Motokuni Ichitani , Takayuki Maeda , Yuki Hirose
发明人： Kenichi Ootsuki , Motokuni Ichitani , Takayuki Maeda , Yuki Hirose
IPC分类号： H01B1/00 , C08F283/00 , C03B29/00 , B32B3/00
CPC分类号： C04B35/6342 , B32B17/10761 , C04B35/04 , C04B35/111 , C04B35/18 , C04B35/453 , C04B35/46 , C04B35/468 , C04B35/486 , C04B35/565 , C04B35/581 , C04B35/584 , C04B35/597 , C08F8/28 , C08F8/48 , C08L29/14 , C08L2205/02 , Y10T428/24926 , C08L2666/04 , C08F16/06
摘要： It is an object of the present invention to provide a polyvinyl acetal resin composition capable of giving a ceramic green sheet which has sufficient flexibility and is hardly damaged even when being formed into a thin film and comprises a polyvinyl acetal resin composition containing a polyvinyl acetal resin A and a polyvinyl acetal resin B incompatible with the polyvinyl acetal resin A, which is formed by acetalizing a mixed polyvinyl alcohol containing two or more kinds of polyvinyl alcohols wherein a phase composed of the polyvinyl acetal resin A and a phase composed of the polyvinyl acetal resin B form a sea-island structure.
摘要翻译：本发明的目的是提供一种聚乙烯醇缩醛树脂组合物，其能够得到具有足够的柔软性并且即使形成薄膜也几乎不被损坏的陶瓷生片，并且包含含有聚乙烯醇缩醛树脂的聚乙烯醇缩醛树脂组合物 A和与聚乙烯醇缩醛树脂A不相容的聚乙烯醇缩醛树脂B，其通过缩醛化含有两种或更多种聚乙烯醇的混合聚乙烯醇形成，其中由聚乙烯醇缩醛树脂A组成的相和由聚乙烯醇缩醛树脂B形成海岛结构。

6. 发明授权

US06334977B1 Powder material for powder plasma overlaying and powder plasma overlaying metal 有权
标题翻译：用于粉末等离子体覆盖和粉末等离子覆盖金属的粉末材料
公开(公告)号：US06334977B1
公开(公告)日：2002-01-01
申请号：US09581166
申请日：2000-08-21
申请人： Masakazu Matsui , Akira Notomi , Toshiaki Nishio , Takayuki Maeda , Iwami Ishihara , Tetsuji Yamaguchi , Yoshimi Onitsuka , Yuichi Kojima , Ryoji Miki , Takashi Inami
发明人： Masakazu Matsui , Akira Notomi , Toshiaki Nishio , Takayuki Maeda , Iwami Ishihara , Tetsuji Yamaguchi , Yoshimi Onitsuka , Yuichi Kojima , Ryoji Miki , Takashi Inami
IPC分类号： C22C3826
CPC分类号： C22C33/0285 , B23K35/0255 , B23K35/308 , C23C4/04 , C23C4/073
摘要： A powder material for powder plasma build-up welding which exhibits excellent resistance and bending properties comprises C in an amount of 0.06 to 0.15% (% by weight, the same hereinafter), Si in an amount of 0.2 to 1.0%, Mn in an amount of 0.2 to 1.0%, Cr in an amount of 17 to 30%, Nb in an amount of 0.6 to 1.5%, Ni in an amount of not more than 0.5%, and the balance consisting of Fe and unavoidable impurities.
摘要翻译：表现出优异的电阻和弯曲性能的粉末等离子体堆积焊接用粉末材料，其含量为0.06〜0.15％（重量％，以下相同），Si：0.2〜1.0％，Mn：用量为0.2〜1.0％，Cr为17〜30％，Nb为0.6〜1.5％，Ni为0.5％以下，余量由Fe和不可避免的杂质构成。

7. 发明授权

US5550401A Lead on chip semiconductor device having bus bars and crossing leads 失效
标题翻译：具有母线和交叉引线的芯片上半导体器件
公开(公告)号：US5550401A
公开(公告)日：1996-08-27
申请号：US324330
申请日：1994-10-17
申请人： Takayuki Maeda
发明人： Takayuki Maeda
IPC分类号： H01L23/50 , H01L23/495 , H01L23/48
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49517 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/14
摘要： Along the column of bonding pad (1), bonding terminal portions (2c), (3c), (4a), (5a) of bus bars (2), (3), and signal lines (4), (5) are arranged; principal wiring portions (2a), (3a) are made to extend in a 3-dimensional crossing configuration with respect to the signal lines, and they are connected to the bonding terminal portion of the bus bars, forming the IC package of the LOC type. Between the various bonding terminal portions and the various bonding pads, there exists no main wiring portion of the bus bar. Consequently, bonding wires (6), (7), (8), (9) do not straddle the bus bar principal wiring portion. As a result, when the bonding wire is not elevated, the bonding wire still does not make contact with the bus bar principal wiring portion to cause short circuit; as a result, the reliability is high and the device becomes thinner.
摘要翻译：沿着焊盘（1）的列，母线（2），（3）和信号线（4），（5）的接合端子部分（2c），（3c），（4a），（5a）安排主配线部分（2a），（3a）相对于信号线以三维交叉构造延伸，并且连接到母线的接合端子部分，形成LOC型的IC封装。在各种接合端子部分和各种接合焊盘之间，母线不存在主配线部分。因此，接合线（6），（7），（8），（9）不跨越母线主布线部。结果，当接合线不升高时，接合线仍然不会与母线主布线部分接触而导致短路; 结果，可靠性高，装置变薄。

8. 发明授权

US08420298B2 Method for production of crosslinked polyvinyl acetal resin, and crosslinked polyvinyl acetal resin 有权
标题翻译：交联聚乙烯醇缩醛树脂的制造方法和交联聚乙烯醇缩醛树脂
公开(公告)号：US08420298B2
公开(公告)日：2013-04-16
申请号：US12450673
申请日：2008-04-11
申请人： Yuki Hirose , Hiroaki Takehara , Motokuni Ichitani , Takayuki Maeda
发明人： Yuki Hirose , Hiroaki Takehara , Motokuni Ichitani , Takayuki Maeda
IPC分类号： G03F7/00
CPC分类号： B41M5/395 , B41M2205/40 , B41N1/14 , C08F216/38 , C08J3/28 , C08J2329/14 , C09D129/14 , G03F7/038
摘要： An object of the present invention is to provide a method for producing a cross-linked polyvinyl acetal resin, which can provide a cross-linked polyvinyl acetal resin having high mechanical strength and excellent solvent resistance by a simple method without a cross-linking agent, and can solve such problems as sheet attack, insufficient strength, and instability of viscosity for a long-time storage, and another object of the present invention is to provide a cross-linked polyvinyl acetal resin produced by the above method for producing a cross-linked polyvinyl acetal resin. The method for producing a cross-linked polyvinyl acetal resin comprises the step of irradiating a polyvinyl acetal resin at least having structural units represented by the following formulas (1) to (4) with ultraviolet light having a wavelength in a range of 200 to 365 nm, wherein R1 represents a hydrogen atom or a C1-C20 hydrocarbon group; and R2 represents a group having two or more functional groups, the two or more functional groups each selected from the group consisting of the functional groups represented by the following formulas (5), (6), and (7).
摘要翻译：本发明的目的是提供一种生产交联聚乙烯醇缩醛树脂的方法，其可以通过简单的方法提供具有高机械强度和优异的耐溶剂性的交联聚乙烯醇缩醛树脂，而无交联剂，并且可以解决长时间保存时的片材侵蚀，强度不足，粘度不稳定等问题，本发明的另一目的在于提供一种交联聚乙烯醇缩醛树脂，连接的聚乙烯醇缩醛树脂。交联聚乙烯醇缩醛树脂的制造方法包括：将具有下述通式（1）〜（4）表示的结构单元的聚乙烯醇缩醛树脂用200〜365nm的范围的紫外线照射的工序 nm，其中R1表示氢原子或C1-C20烃基; 并且R 2表示具有两个以上官能团的基团，所述两个以上的官能团各自选自由下式（5），（6）和（7）表示的官能团。

9. 发明申请

US20100112480A1 METHOD FOR PRODUCTION OF CROSSLINKED POLYVINYL ACETAL RESIN, AND CROSSLINKED POLYVINYL ACETAL RESIN 有权
标题翻译：交联聚乙烯乙烯树脂和交联聚乙烯乙烯树脂的生产方法
公开(公告)号：US20100112480A1
公开(公告)日：2010-05-06
申请号：US12450673
申请日：2008-04-11
申请人： Yuki Hirose , Hiroaki Takehara , Motokuni Ichitani , Takayuki Maeda
发明人： Yuki Hirose , Hiroaki Takehara , Motokuni Ichitani , Takayuki Maeda
IPC分类号： G03F7/004 , C08J3/28 , G03F7/20
CPC分类号： B41M5/395 , B41M2205/40 , B41N1/14 , C08F216/38 , C08J3/28 , C08J2329/14 , C09D129/14 , G03F7/038
摘要： An object of the present invention is to provide a method for producing a cross-linked polyvinyl acetal resin, which can provide a cross-linked polyvinyl acetal resin having high mechanical strength and excellent solvent resistance by a simple method without a cross-linking agent, and can solve such problems as sheet attack, insufficient strength, and instability of viscosity for a long-time storage, and another object of the present invention is to provide a cross-linked polyvinyl acetal resin produced by the above method for producing a cross-linked polyvinyl acetal resin. The method for producing a cross-linked polyvinyl acetal resin comprises the step of irradiating a polyvinyl acetal resin at least having structural units represented by the following formulas (1) to (4) with ultraviolet light having a wavelength in a range of 200 to 365 nm, wherein R1 represents a hydrogen atom or a C1-C20 hydrocarbon group; and R2 represents a group having two or more functional groups, the two or more functional groups each selected from the group consisting of the functional groups represented by the following formulas (5), (6), and (7).
摘要翻译：本发明的目的是提供一种生产交联聚乙烯醇缩醛树脂的方法，其可以通过简单的方法提供具有高机械强度和优异的耐溶剂性的交联聚乙烯醇缩醛树脂，而无交联剂，并且可以解决长时间保存时的片材侵蚀，强度不足，粘度不稳定等问题，本发明的另一目的在于提供一种交联聚乙烯醇缩醛树脂，连接的聚乙烯醇缩醛树脂。交联聚乙烯醇缩醛树脂的制造方法包括：将具有下述通式（1）〜（4）表示的结构单元的聚乙烯醇缩醛树脂用200〜365nm的范围的紫外线照射的工序 nm，其中R1表示氢原子或C1-C20烃基; 并且R 2表示具有两个以上官能团的基团，所述两个以上的官能团各自选自由下式（5），（6）和（7）表示的官能团。

10. 发明授权

US5840085A Process for removing sodium chloride and potassium salts from ash collected from a soda recovery boiler 失效
标题翻译：从苏打水回收锅炉收集的灰分中除去钾盐的方法
公开(公告)号：US5840085A
公开(公告)日：1998-11-24
申请号：US538790
申请日：1995-10-03
申请人： Kikuo Tokunaga , Masakazu Tateishi , Michimasa Yagi , Takayuki Maeda , Yoshihisa Arakawa
发明人： Kikuo Tokunaga , Masakazu Tateishi , Michimasa Yagi , Takayuki Maeda , Yoshihisa Arakawa
IPC分类号： B09B3/00 , C01D5/02 , C01D5/16 , D21C11/00 , B01D9/02
CPC分类号： C01D5/02 , C01D5/16
摘要： This invention relates to a process for removing sodium chloride and potassium salts, which are impurities concentrated and accumulated in pulp digesting chemicals, from ash collected from a soda recovery boiler. This process comprises the steps of (a) mixing ash collected from the combustion exhaust gas of the soda recovery boiler with water to form a slurry, adjusting the pH of the slurry to 10 or less by the addition of sulfuric acid, adjusting the temperature of the slurry to 20.degree. C. or above, and holding the slurry at that temperature for a sufficient time to cause sodium chloride and potassium salts present in the collected ash to be dissolved in the water; (b) cooling the slurry to a temperature below 20.degree. C. by the addition of ice and/or water so as to precipitate solid matter therefrom; and (c) separating the slurry into solid and liquid components and recovering the solid component while discharging the liquid component out of the system.
摘要翻译：本发明涉及从苏打水回收锅炉收集的灰分中除去作为浓缩并积聚在纸浆消化剂中的杂质的氯化钠和钾盐的方法。该方法包括以下步骤：（a）将从苏打水回收锅炉的燃烧废气中收集的灰混合，形成浆料，通过加入硫酸将浆料的pH调节至10以下，调节温度将浆料加热到20℃以上，并在该温度下保持浆料足够的时间，使收集的灰分中存在的氯化钠和钾盐溶解在水中; （b）通过加入冰和/或水将浆料冷却到低于20℃的温度，从而沉淀固体物质; 和（c）将浆料分离成固体和液体组分，并在将液体组分排出系统的同时回收固体组分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式