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1. 发明授权

US07411382B2 Current detection apparatus 有权
标题翻译：电流检测装置
公开(公告)号：US07411382B2
公开(公告)日：2008-08-12
申请号：US11398639
申请日：2006-04-06
申请人： Yukihiko Tanizawa , Seiichirou Ootake , Takashige Saitou , Masahiro Aratani , Takeshi Tukamoto , Masato Ishihara , Norio Miyahara
发明人： Yukihiko Tanizawa , Seiichirou Ootake , Takashige Saitou , Masahiro Aratani , Takeshi Tukamoto , Masato Ishihara , Norio Miyahara
IPC分类号： G01R15/20
CPC分类号： G01R15/202 , G01R15/183 , G01R15/207
摘要： A current detection apparatus includes a magnetic core having a ring shape with a gap and a center opening portion through which a current path is disposed, and a magnetic sensor including a magnetic sensing element such as a Hall effect element arranged in the gap. When a current flows through the current path, the magnetic core generates magnetic flux therein so that magnetic field is generated in the gap. The magnetic sensor outputs different electrical signals, each of which is measured in a different measurement range and corresponds to intensity of the magnetic field in the gap. The current detection apparatus measures the current based on the electrical signals outputted from the magnetic sensor.
摘要翻译：电流检测装置包括具有间隙的环形的磁芯和设置电流路径的中心开口部，以及包括布置在间隙中的诸如霍尔效应元件的磁感应元件的磁传感器。当电流流过电流路径时，磁芯在其中产生磁通，使得在间隙中产生磁场。磁传感器输出不同的电信号，每个电信号在不同的测量范围内被测量，并且对应于间隙中的磁场的强度。电流检测装置基于从磁传感器输出的电信号来测量电流。

2. 发明授权

US06868733B2 Sensor having membrane and method for manufacturing the same 有权
标题翻译：具有膜的传感器及其制造方法
公开(公告)号：US06868733B2
公开(公告)日：2005-03-22
申请号：US10759123
申请日：2004-01-20
申请人： Toshiya Ikezawa , Takashige Saitou , Masaaki Tanaka
发明人： Toshiya Ikezawa , Takashige Saitou , Masaaki Tanaka
IPC分类号： G01D21/00 , B81C3/00 , G01J1/02 , G01J5/02 , G01J5/10 , G01J5/12 , G01J5/14 , G01L9/00 , G01N27/00 , G01N27/12 , H01L21/52 , H01L29/84
CPC分类号： B81C3/001 , B81B2201/0264 , G01J5/10 , G01L9/0042
摘要： A sensor device includes a circuit chip, an adhesion film, and a sensor chip mounted on the circuit chip through the adhesion film. The sensor chip includes a substrate having foreside and backside surfaces, a concavity disposed on the backside surface of the substrate, and a membrane disposed on the foreside surface of the substrate so that the membrane covers the concavity. The adhesion film is disposed between the sensor chip and the circuit chip so as to form a passage for connecting between the concavity and an outside of the concavity.
摘要翻译：传感器装置包括电路芯片，粘合膜和通过粘合膜安装在电路芯片上的传感器芯片。传感器芯片包括具有前侧和后侧表面的基板，设置在基板的背面上的凹部以及设置在基板的前表面上的膜，以使膜覆盖该凹部。粘合膜设置在传感器芯片和电路芯片之间，以形成用于连接凹部和凹部外侧的通道。

3. 发明授权

US07223637B2 Method of manufacturing a sensor device with binding material having a foaming agent 有权
标题翻译：制造具有发泡剂的粘结材料的传感器装置的方法
公开(公告)号：US07223637B2
公开(公告)日：2007-05-29
申请号：US11046793
申请日：2005-02-01
申请人： Takashige Saitou
发明人： Takashige Saitou
IPC分类号： H01L21/00
CPC分类号： G01D11/245 , G01P1/023 , H01L24/29 , H01L24/73 , H01L2224/29 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15787 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A sensor device includes a sensor chip and a bonding wire being fixed on a substrate. The sensor device is manufactured by using a binding material made of an adhesive containing a foaming agent that evaporates upon exposure to heat. The binding material reduces its elasticity after a wire bonding process because voids being functional as a cushion are formed by evaporation of the foaming agent.
摘要翻译：传感器装置包括固定在基板上的传感器芯片和接合线。传感器装置通过使用由含有发泡剂的粘合剂制成的粘结材料制造，所述发泡剂在暴露于热量时蒸发。由于通过发泡剂的蒸发形成空隙作为衬垫而起作用，所以粘合材料在引线接合工艺之后降低其弹性。

4. 发明授权

US07084617B2 Electric current sensor having magnetic gap 失效
标题翻译：具有磁隙的电流传感器
公开(公告)号：US07084617B2
公开(公告)日：2006-08-01
申请号：US11094153
申请日：2005-03-31
申请人： Shinji Ozaki , Takashige Saitou
发明人： Shinji Ozaki , Takashige Saitou
IPC分类号： G01R33/00
CPC分类号： G01R15/202 , G01R15/207
摘要： An electric current sensor includes: a core having a ring shape and including a plurality of core pieces, which are laminated and integrated to provide the core; a magnetic gap disposed on a predetermined part of the core; a Hall element disposed in the magnetic gap; a body for accommodating the core and the Hall element; and a seal member for sealing the core and the Hall element into the body. Each core piece has a thin plate shape, and the core includes deformation preventing means for preventing a deformation of the magnetic gap.
摘要翻译：电流传感器包括：具有环形并且包括多个芯片的芯体，其被层压并一体化以提供芯体; 设置在所述芯的预定部分上的磁隙; 设置在所述磁隙中的霍尔元件; 用于容纳所述芯体和所述霍尔元件的主体; 以及用于将芯体和霍尔元件密封到体内的密封构件。每个芯片具有薄板形状，并且芯部包括用于防止磁隙变形的变形防止装置。

5. 发明申请

US20050237049A1 Electric current sensor having magnetic gap 失效
标题翻译：具有磁隙的电流传感器
公开(公告)号：US20050237049A1
公开(公告)日：2005-10-27
申请号：US11094153
申请日：2005-03-31
申请人： Shinji Ozaki , Takashige Saitou
发明人： Shinji Ozaki , Takashige Saitou
IPC分类号： G01R15/18 , G01R15/20 , G01R33/00
CPC分类号： G01R15/202 , G01R15/207
摘要： An electric current sensor includes: a core having a ring shape and including a plurality of core pieces, which are laminated and integrated to provide the core; a magnetic gap disposed on a predetermined part of the core; a Hall element disposed in the magnetic gap; a body for accommodating the core and the Hall element; and a seal member for sealing the core and the Hall element into the body. Each core piece has a thin plate shape, and the core includes deformation preventing means for preventing a deformation of the magnetic gap.
摘要翻译：电流传感器包括：具有环形并且包括多个芯片的芯体，其被层压并一体化以提供芯体; 设置在所述芯的预定部分上的磁隙; 设置在所述磁隙中的霍尔元件; 用于容纳所述芯体和所述霍尔元件的主体; 以及用于将芯体和霍尔元件密封到体内的密封构件。每个芯片具有薄板形状，并且芯部包括用于防止磁隙变形的变形防止装置。

6. 发明申请

US20060023768A1 Temperature sensor and sensor using a resistance element 失效
标题翻译：温度传感器和传感器使用电阻元件
公开(公告)号：US20060023768A1
公开(公告)日：2006-02-02
申请号：US11184073
申请日：2005-07-19
申请人： Masato Ishihara , Takashige Saitou
发明人： Masato Ishihara , Takashige Saitou
IPC分类号： G01K7/00 , G01K1/08
CPC分类号： G01K7/36
摘要： A temperature sensor utilizes the temperature characteristics of a resistance element to detect the temperature by sensing a change in the temperature as a change in the resistance of the resistance element. The resistance element includes a first resistance element which is arranged at such an angle that the resistance thereof increases relative to an angular change in one direction of a magnetic vector that is imparted, and a second resistance element which is arranged at such an angle that the resistance thereof decreases relative thereto. The change in the temperature is sensed as a change in the added value of resistances of the first and second resistance elements.
摘要翻译：温度传感器利用电阻元件的温度特性通过感测温度的变化来检测温度，作为电阻元件的电阻的变化。电阻元件包括第一电阻元件，该第一电阻元件以相对于施加的磁矢量的一个方向上的角度变化的电阻增加的角度布置;以及第二电阻元件，其设置成与其电阻相对于其减小。感测温度的变化是第一和第二电阻元件的电阻的相加值的变化。

7. 发明申请

US20050173810A1 Sensor device 有权
标题翻译：传感器装置
公开(公告)号：US20050173810A1
公开(公告)日：2005-08-11
申请号：US11046793
申请日：2005-02-01
申请人： Takashige Saitou
发明人： Takashige Saitou
IPC分类号： G01P15/125 , G01D11/24 , G01P1/02 , G01P15/08 , H01L21/50 , H01L21/58 , H01L23/48 , H01L29/84
CPC分类号： G01D11/245 , G01P1/023 , H01L24/29 , H01L24/73 , H01L2224/29 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15787 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A sensor device includes a sensor chip and a bonding wire being fixed on a substrate. The sensor device is manufactured by using a binding material made of an adhesive containing a foaming agent that evaporates upon exposure to heat. The binding material reduces its elasticity after a wire bonding process because voids being functional as a cushion are formed by evaporation of the foaming agent.
摘要翻译：传感器装置包括固定在基板上的传感器芯片和接合线。传感器装置通过使用由含有发泡剂的粘合剂制成的粘结材料制造，所述发泡剂在暴露于热量时蒸发。由于通过发泡剂的蒸发形成空隙作为衬垫而起作用，所以粘合材料在引线接合工艺之后降低其弹性。

8. 发明授权

US06898974B2 Semiconductor dynamic quantity sensor 失效
标题翻译：半导体动量传感器
公开(公告)号：US06898974B2
公开(公告)日：2005-05-31
申请号：US10465669
申请日：2003-06-20
申请人： Masaaki Tanaka , Toshiya Ikezawa , Takashige Saitou
发明人： Masaaki Tanaka , Toshiya Ikezawa , Takashige Saitou
IPC分类号： G01L9/04 , G01D5/18 , G01L9/00 , H01L21/52 , H01L29/84 , G01P15/125
CPC分类号： G01L9/0052 , G01L9/0055
摘要： A semiconductor dynamic quantity sensor includes a supporting portion, an adhesive, and a sensor chip. The adhesive is located on a surface of the supporting portion. The sensor chip is located on the adhesive. The sensor chip and the supporting portion have been bonded together by heating the adhesive. The adhesive has a deformation factor of 0.5% or smaller at the temperature at which the adhesive is heated for bonding the sensor chip and the supporting portion together in order to reduce the stress caused by the hardening shrinkage of the adhesive.
摘要翻译：半导体动态量传感器包括支撑部分，粘合剂和传感器芯片。粘合剂位于支撑部分的表面上。传感器芯片位于粘合剂上。传感器芯片和支撑部分通过加热粘合剂而结合在一起。粘合剂在加热粘合剂的温度下的变形系数为0.5％以下，以将传感器芯片和支撑部分粘合在一起，以减少由粘合剂的硬化收缩引起的应力。

9. 发明授权

US07237952B2 Temperature sensor and sensor using a resistance element 失效
标题翻译：温度传感器和传感器使用电阻元件
公开(公告)号：US07237952B2
公开(公告)日：2007-07-03
申请号：US11184073
申请日：2005-07-19
申请人： Masato Ishihara , Takashige Saitou
发明人： Masato Ishihara , Takashige Saitou
IPC分类号： G01K7/16
CPC分类号： G01K7/36
摘要： A temperature sensor utilizes the temperature characteristics of a resistance element to detect the temperature by sensing a change in the temperature as a change in the resistance of the resistance element. The resistance element includes a first resistance element which is arranged at such an angle that the resistance thereof increases relative to an angular change in one direction of a magnetic vector that is imparted, and a second resistance element which is arranged at such an angle that the resistance thereof decreases relative thereto. The change in the temperature is sensed as a change in the added value of resistances of the first and second resistance elements.
摘要翻译：温度传感器利用电阻元件的温度特性通过感测温度的变化来检测温度，作为电阻元件的电阻的变化。电阻元件包括第一电阻元件，该第一电阻元件以相对于施加的磁矢量的一个方向上的角度变化的电阻增加的角度布置;以及第二电阻元件，其设置成与其电阻相对于其减小。感测温度的变化是第一和第二电阻元件的电阻的相加值的变化。

10. 发明申请

US20060216800A1 Mounting structure of current sensor 有权
标题翻译：电流传感器的安装结构
公开(公告)号：US20060216800A1
公开(公告)日：2006-09-28
申请号：US11334433
申请日：2006-01-19
申请人： Masato Ishihara , Masahiro Aratani , Takashige Saitou
发明人： Masato Ishihara , Masahiro Aratani , Takashige Saitou
IPC分类号： C12P7/62
CPC分类号： G01R15/207 , G01R1/04 , G01R31/3696 , Y10S439/957
摘要： A mounting structure of a current sensor includes: the current sensor including a detection portion; and a connection member for electrically connecting between a battery post of a battery and a harness. The current sensor is mounted on the connection member. The connection member includes a predetermined portion, a current density of which is higher than that of other portions of the connection member. The detection portion of the current sensor is disposed on the predetermined portion of the connection member when the current sensor is mounted on the connection member.
摘要翻译：电流传感器的安装结构包括：电流传感器，包括检测部分; 以及用于电连接电池的电池柱和线束之间的连接构件。电流传感器安装在连接件上。连接构件包括其电流密度高于连接构件的其它部分的电流密度的预定部分。当电流传感器安装在连接构件上时，电流传感器的检测部分设置在连接构件的预定部分上。

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