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    • 6. 发明申请
    • METAL SUBSTRATE/METAL IMPREGNATED CARBON COMPOSITE MATERIAL STRUCTURE AND METHOD FOR MANUFACTURING SAID STRUCTURE
    • 金属基板/金属印制碳复合材料结构及制造结构的方法
    • US20120164468A1
    • 2012-06-28
    • US11909349
    • 2005-03-23
    • Noriaki Kawamura
    • Noriaki Kawamura
    • B32B15/04B32B15/20B23K31/02
    • H01L23/3736B32B15/14H01L23/15H01L23/373H01L23/3732H01L23/3735H01L2924/0002Y10T428/12007Y10T428/12083H01L2924/00
    • Provided are a heat releasing material for an electronic device being manufactured by the junction of a metal impregnated carbon composite material on a copper or aluminum substrate with reduced warpage; and a method for manufacturing the heat releasing material. A metal substrate/metal impregnated carbon composite material structure, characterized in that it comprises a metal substrate comprising a metal sheet, plate or block and, being joined on the metal substrate via a brazing material, a metal impregnated carbon composite material having a thickness of 0.1 mm to 2 mm; and a method for manufacturing the metal substrate/metal impregnated carbon composite material structure, characterized in that it comprises a step wherein a brazing material is caused to be present between the metal substrate and the metal impregnated carbon composite material, and they are kept at a temperature of 500° C. or higher and under a pressure of 0.2 MPa or more and then cooled.
    • 提供一种用于电子器件的散热材料,其通过金属浸渍的碳复合材料在铜或铝衬底上的接合处制造,具有减小的翘曲; 以及制造散热材料的方法。 金属基板/金属浸渍碳复合材料结构,其特征在于,它包括金属基板,包括金属板,板或块,并通过钎焊材料接合在金属基板上,金属浸渍碳复合材料的厚度为 0.1毫米至2毫米; 以及金属基材/金属浸渍碳复合材料结构体的制造方法,其特征在于,包括使所述金属基材和所述浸渍了金属的碳复合材料之间存在钎焊材料的工序,将其保持在 温度为500℃以上,压力为0.2MPa以上,然后冷却。
    • 8. 发明授权
    • Metal substrate/metal impregnated carbon composite material structure and method for manufacturing said structure
    • 金属基材/金属浸渍碳复合材料结构及其制造方法
    • US09390999B2
    • 2016-07-12
    • US11909349
    • 2005-03-21
    • Noriaki Kawamura
    • Noriaki Kawamura
    • B32B9/00H01L23/373B32B15/14H01L23/15
    • H01L23/3736B32B15/14H01L23/15H01L23/373H01L23/3732H01L23/3735H01L2924/0002Y10T428/12007Y10T428/12083H01L2924/00
    • Provided are a heat releasing material for an electronic device being manufactured by the junction of a metal impregnated carbon composite material on a copper or aluminum substrate with reduced warpage; and a method for manufacturing the heat releasing material. A metal substrate/metal impregnated carbon composite material structure, characterized in that it comprises a metal substrate comprising a metal sheet, plate or block and, being joined on the metal substrate via a brazing material, a metal impregnated carbon composite material having a thickness of 0.1 mm to 2 mm; and a method for manufacturing the metal substrate/metal impregnated carbon composite material structure, characterized in that it comprises a step wherein a brazing material is caused to be present between the metal substrate and the metal impregnated carbon composite material, and they are kept at a temperature of 500° C. or higher and under a pressure of 0.2 MPa or more and then cooled.
    • 提供一种用于电子器件的散热材料,其通过金属浸渍的碳复合材料在铜或铝衬底上的接合处制造,具有减小的翘曲; 以及制造散热材料的方法。 金属基板/金属浸渍碳复合材料结构,其特征在于,它包括金属基板,包括金属板,板或块,并通过钎焊材料接合在金属基板上,金属浸渍碳复合材料的厚度为 0.1毫米至2毫米; 以及金属基材/金属浸渍碳复合材料结构体的制造方法,其特征在于,包括使所述金属基材和所述浸渍了金属的碳复合材料之间存在钎焊材料的工序,将其保持在 温度为500℃以上,压力为0.2MPa以上,然后冷却。