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    • 4. 发明授权
    • Method of manufacturing single crystal Si film
    • 制造单晶Si膜的方法
    • US07479442B2
    • 2009-01-20
    • US11071175
    • 2005-03-04
    • Takashi NoguchiWenxu XianyuHuaxiang Yin
    • Takashi NoguchiWenxu XianyuHuaxiang Yin
    • H01L21/461
    • H01L21/76254
    • Provided is a method of manufacturing a single crystal Si film. The method includes: preparing a Si substrate on which a first oxide layer is formed and an insulating substrate on which a second oxide layer is formed; forming a dividing layer at a predetermined depth from a surface of the Si substrate by implanting hydrogen ions from above the first oxide layer; bonding the insulating substrate to the Si substrate so that the first oxide layer contacts the second oxide layer; and forming a single crystal Si film having a predetermined thickness on the insulating substrate by cutting the dividing layer by irradiating a laser beam from above the insulating substrate. Therefore, a single crystal Si film having a predetermined thickness can be formed on an insulating substrate.
    • 提供制造单晶Si膜的方法。 该方法包括:制备其上形成有第一氧化物层的Si衬底和形成有第二氧化物层的绝缘衬底; 通过从所述第一氧化物层上方注入氢离子,从所述Si衬底的表面形成预定深度的分隔层; 将绝缘基板接合到Si衬底,使得第一氧化物层接触第二氧化物层; 以及通过从绝缘基板上方照射激光束切割分隔层,在绝缘基板上形成具有预定厚度的单晶硅膜。 因此,可以在绝缘基板上形成具有预定厚度的单晶Si膜。