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1. 发明授权

US07602262B2 Elastic wave device and manufacturing method of the same 失效
标题翻译：弹性波装置及其制造方法相同
公开(公告)号：US07602262B2
公开(公告)日：2009-10-13
申请号：US11730961
申请日：2007-04-05
申请人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
IPC分类号： H03H9/00 , H03H9/10
CPC分类号： H03H9/72 , H03H3/08 , H03H9/0576 , H03H2250/00
摘要： An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
摘要翻译：公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。每个表面声波（SAW）器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面，对应于通过填充树脂粘合的部分在至少两个SAW器件之间，包括至少一个切口，并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面，背面和前表面的一部分，并且第一树脂树脂填充在包装的侧面上的至少一个切口中。

2. 发明授权

US08085116B2 Elastic wave device with a dielectric layer on the comb-shaped electrodes 有权
标题翻译：在梳状电极上具有介电层的弹性波器件
公开(公告)号：US08085116B2
公开(公告)日：2011-12-27
申请号：US12408188
申请日：2009-03-20
申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
IPC分类号： H03H9/54 , H03H9/145 , H03H9/25
CPC分类号： H03H9/1452 , H03H9/1457
摘要： An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.
摘要翻译：描述了一种弹性波装置，其包括压电基片，具有在压电基片上彼此相对配置的齿电极的梳状电极，梳状电极的齿电极的非重叠区域齿不重叠，齿电极重叠的重叠区域，声速比非重叠区域高。

3. 发明申请

US20100244979A1 DUPLEXER, SUBSTRATE FOR DUPLEXER, AND ELECTRONIC APPARATUS 有权
标题翻译：双工器，双工器基板和电子设备
公开(公告)号：US20100244979A1
公开(公告)日：2010-09-30
申请号：US12564648
申请日：2009-09-22
申请人： Takashi MATSUDA , Kazunori Inoue , Shogo Inoue
发明人： Takashi MATSUDA , Kazunori Inoue , Shogo Inoue
IPC分类号： H01P5/12
CPC分类号： H03H9/706 , H03H9/0571 , H03H9/0576 , H03H9/725
摘要： A duplexer includes a transmit filter connected between a common terminal and a transmission terminal, a receive filter connected between the common terminal and a reception terminal, a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal, and a package. The package includes an insulating layer, foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer, and interconnections formed on another surface opposite to the one surface of the insulating layer. The capacitor is composed of two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one food pad respectively.
摘要翻译：双工器包括连接在公共端子和发送端子之间的发送滤波器，连接在公共端子和接收端子之间的接收滤波器，与发射滤波器和接收滤波器之一并联连接的电容器，公共终端，发送终端和接收终端，以及包。封装包括绝缘层，包括公共端子，发送端子和接收端子并且形成在绝缘层的一个表面上的脚垫以及形成在与绝缘层的一个表面相对的另一表面上的互连。电容器由两个电容器形成单元组成，两个电容器形成单元彼此并联连接并且形成有足垫的至少一个脚垫和分别与至少一个食物垫的两个相对侧重叠的两个互连。

4. 发明申请

US20090267707A1 ELASTIC WAVE DEVICE 有权
标题翻译：弹性波装置
公开(公告)号：US20090267707A1
公开(公告)日：2009-10-29
申请号：US12408188
申请日：2009-03-20
申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
IPC分类号： H01L41/047 , H03H9/64
CPC分类号： H03H9/1452 , H03H9/1457
摘要： An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.
摘要翻译：描述了一种弹性波装置，其包括压电基片，具有在压电基片上彼此相对配置的齿电极的梳状电极，梳状电极的齿电极的非重叠区域齿不重叠，齿电极重叠的重叠区域，声速比非重叠区域高。

5. 发明申请

US20080018414A1 Elastic wave device and manufacturing method of the same 失效
标题翻译：弹性波装置及其制造方法相同
公开(公告)号：US20080018414A1
公开(公告)日：2008-01-24
申请号：US11730961
申请日：2007-04-05
申请人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
IPC分类号： H03H9/72
CPC分类号： H03H9/72 , H03H3/08 , H03H9/0576 , H03H2250/00
摘要： An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
摘要翻译：公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。每个表面声波（SAW）器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面，对应于通过填充树脂粘合的部分在至少两个SAW器件之间，包括至少一个切口，并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面，背面和前表面的一部分，并且第一树脂树脂填充在包装的侧面上的至少一个切口中。

6. 发明申请

US20100219906A1 ACOUSTIC WAVE DEVICE, DUPLEXER, COMMUNICATION MODULE, COMMUNICATION APPARATUS, AND MANUFACTURING METHOD FOR ACOUSTIC WAVE DEVICE 有权
标题翻译：声波设备，双工器，通信模块，通信设备和声波设备的制造方法
公开(公告)号：US20100219906A1
公开(公告)日：2010-09-02
申请号：US12608397
申请日：2009-10-29
申请人： Michio MIURA , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio MIURA , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
IPC分类号： H03H9/72 , H01L41/22
CPC分类号： H03H3/10 , H03H9/0222 , H03H9/25 , Y10T29/42 , Y10T29/49005
摘要： An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.
摘要翻译：声波装置包括：压电基板，布置在压电基板上的叉指电极，布置在叉指电极之间的第一电介质元件，覆盖指状电极和第一电介质元件的第二电介质元件和已形成的调节元件在第一电介质元件上。调整元件由比重大于第一电介质元件和第二电介质元件的比重的材料形成。

7. 发明授权

US08258891B2 Acoustic wave device, duplexer, communication module, communication apparatus, and manufacturing method for acoustic wave device 有权
标题翻译：声波装置，双工器，通信模块，通信装置和声波装置的制造方法
公开(公告)号：US08258891B2
公开(公告)日：2012-09-04
申请号：US12608397
申请日：2009-10-29
申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
IPC分类号： H03H9/25 , H03H9/15 , H03H9/70 , H03H9/72 , H03H3/02 , H03H3/08 , H03H3/04 , H03H3/10
CPC分类号： H03H3/10 , H03H9/0222 , H03H9/25 , Y10T29/42 , Y10T29/49005
摘要： An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.
摘要翻译：声波装置包括：压电基板，布置在压电基板上的叉指电极，布置在叉指电极之间的第一电介质元件，覆盖指状电极和第一电介质元件的第二电介质元件和已形成的调节元件在第一电介质元件上。调整元件由比重大于第一电介质元件和第二电介质元件的比重的材料形成。

8. 发明授权

US08174339B2 Duplexer, substrate for duplexer, and electronic apparatus 有权
标题翻译：双工器，双工器基板和电子设备
公开(公告)号：US08174339B2
公开(公告)日：2012-05-08
申请号：US12564648
申请日：2009-09-22
申请人： Takashi Matsuda , Kazunori Inoue , Shogo Inoue
发明人： Takashi Matsuda , Kazunori Inoue , Shogo Inoue
IPC分类号： H01P5/12 , H04B1/50 , H03H9/70
CPC分类号： H03H9/706 , H03H9/0571 , H03H9/0576 , H03H9/725
摘要： A duplexer includes a transmit filter connected between a common terminal and a transmission terminal, a receive filter connected between the common terminal and a reception terminal, a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal, and a package. The package includes an insulating layer, foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer, and interconnections formed on another surface opposite to the one surface of the insulating layer. The capacitor is composed of two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one food pad respectively.
摘要翻译：双工器包括连接在公共端子和发送端子之间的发送滤波器，连接在公共端子和接收端子之间的接收滤波器，与发射滤波器和接收滤波器之一并联连接的电容器，公共终端，发送终端和接收终端，以及包。封装包括绝缘层，包括公共端子，发送端子和接收端子并且形成在绝缘层的一个表面上的脚垫以及形成在与绝缘层的一个表面相对的另一表面上的互连。电容器由两个电容器形成单元组成，两个电容器形成单元彼此并联连接并且形成有足垫的至少一个脚垫和分别与至少一个食物垫的两个相对侧重叠的两个互连。

9. 发明申请

US20120105298A1 ACOUSTIC WAVE FILTER 有权
标题翻译：声波滤波器
公开(公告)号：US20120105298A1
公开(公告)日：2012-05-03
申请号：US13344274
申请日：2012-01-05
申请人： Kazunori Inoue , Takashi Matsuda , Michio Miura
发明人： Kazunori Inoue , Takashi Matsuda , Michio Miura
IPC分类号： H03H9/64 , H01Q1/50 , H03H9/72
CPC分类号： H03H9/02992 , H03H9/02952 , H03H9/6483 , H03H9/725
摘要： A configuration that reduces a parasitic capacitance between wires is achieved at a low cost. Disclosed is an acoustic wave filter provided with a piezoelectric substrate 1, resonators 2a and 2b that include a comb-shaped electrode formed on the piezoelectric substrate 1, a wiring portion 3 that is connected to the comb-shaped electrode, and a dielectric layer 4 formed to cover the comb-shaped electrode. The wiring portion 3 is provided with a lower layer wiring portion 3d that is disposed in the same layer as the comb-shaped electrode and an upper layer wiring portion 3e that is disposed on the lower layer wiring portion 3d. The upper layer wiring portion 3e includes a region that has a wider electrode width than the electrode width of the lower layer wiring portion 3d.
摘要翻译：以低成本实现降低电线之间的寄生电容的结构。公开了一种设置有压电基板1的谐波滤波器，包括形成在压电基板1上的梳状电极的谐振器2a和2b，连接到梳状电极的布线部分3和介电层4 形成为覆盖梳状电极。布线部分3设置有与梳状电极相同的层中的下层布线部分3d和布置在下层布线部分3d上的上层布线部分3e。上层布线部分3e包括具有比下层布线部分3d的电极宽度更宽的电极宽度的区域。

10. 发明授权

US07841064B2 Method of manufacturing an acoustic wave device 失效
标题翻译：制造声波装置的方法
公开(公告)号：US07841064B2
公开(公告)日：2010-11-30
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
IPC分类号： H04R31/00
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译：一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分，用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分密封部分，使得第二未覆盖部分被分割。

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