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1. 发明授权

US07841064B2 Method of manufacturing an acoustic wave device 失效
标题翻译：制造声波装置的方法
公开(公告)号：US07841064B2
公开(公告)日：2010-11-30
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
IPC分类号： H04R31/00
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译：一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分，用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分密封部分，使得第二未覆盖部分被分割。

2. 发明申请

US20080125662A1 Acoustic wave device and method of manufacturing the same 失效
标题翻译：声波装置及其制造方法
公开(公告)号：US20080125662A1
公开(公告)日：2008-05-29
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
IPC分类号： A61B8/12 , H04R31/00
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译：一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分，用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分密封部分，使得第二未覆盖部分被分割。

3. 发明申请

US20090096321A1 SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR 失效
标题翻译：表面声波装置及其制造方法
公开(公告)号：US20090096321A1
公开(公告)日：2009-04-16
申请号：US12239525
申请日：2008-09-26
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura
IPC分类号： H01L41/08 , H01L41/22
CPC分类号： H03H9/059 , H01L2224/11 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H03H3/08 , H03H9/1092 , Y10T29/42 , Y10T29/49005 , Y10T29/49146 , H01L2924/00014
摘要： A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.
摘要翻译：表面声波装置能够在没有任何特定的环境过程的情况下防止电极腐蚀。表面声波装置包括压电基片，形成表面声波的电极，形成在压电基片上，压电基片上，围绕用于形成表面声波的电极的框状层，以及盖体通过接合而形成在框状层上，从而在盖体和用于形成表面声波的电极之间形成中空部分。框状层和盖体包括感光性树脂，盖体包括通孔，并且通过无卤热固性树脂密封通孔。

4. 发明授权

US07854050B2 Method of manufacturing a surface acoustic wave device 失效
标题翻译：声表面波装置的制造方法
公开(公告)号：US07854050B2
公开(公告)日：2010-12-21
申请号：US12239525
申请日：2008-09-26
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura
IPC分类号： H04R17/10
CPC分类号： H03H9/059 , H01L2224/11 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H03H3/08 , H03H9/1092 , Y10T29/42 , Y10T29/49005 , Y10T29/49146 , H01L2924/00014
摘要： A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.
摘要翻译：表面声波装置能够在没有任何特定的环境过程的情况下防止电极腐蚀。表面声波装置包括压电基片，形成表面声波的电极，形成在压电基片上，压电基片上，围绕用于形成表面声波的电极的框状层，以及盖体通过接合而形成在框状层上，从而在盖体和用于形成表面声波的电极之间形成中空部分。框状层和盖体包括感光性树脂，盖体包括通孔，并且通过无卤热固性树脂密封通孔。

5. 发明申请

US20080111247A1 Electronic device and method of fabricating the same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US20080111247A1
公开(公告)日：2008-05-15
申请号：US11598816
申请日：2006-11-14
申请人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
发明人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
IPC分类号： H01L23/488 , B23K31/02 , H01L21/60
CPC分类号： B23K1/0016 , H01L23/10 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01079 , H03H9/059 , H03H9/1078 , H03H9/1085 , H01L2224/81 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要翻译：提供了一种制造电子器件的方法，该电子器件包括将器件芯片安装在衬底上的倒装芯片，以及通过在器件芯片上提供焊料并在焊料上施加热和压力来在相邻器件芯片之间提供焊料，以及接触角的焊料熔化时，器件芯片和焊料大于90°。

6. 发明授权

US08093101B2 Electronic device and method of fabricating the same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08093101B2
公开(公告)日：2012-01-10
申请号：US11598816
申请日：2006-11-14
申请人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
发明人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
IPC分类号： H01L21/00
CPC分类号： B23K1/0016 , H01L23/10 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01079 , H03H9/059 , H03H9/1078 , H03H9/1085 , H01L2224/81 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要翻译：提供了一种制造电子器件的方法，该电子器件包括将器件芯片安装在衬底上的倒装芯片，以及通过在器件芯片上提供焊料并在焊料上施加热和压力来在相邻器件芯片之间提供焊料，以及接触角的焊料熔化时，器件芯片和焊料大于90°。

7. 发明授权

US07816794B2 Electronic device and method of fabricating the same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US07816794B2
公开(公告)日：2010-10-19
申请号：US11314007
申请日：2005-12-22
申请人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
发明人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
IPC分类号： H01L23/29
CPC分类号： H03H9/1085 , H01L2224/97 , H03H9/1078 , H01L2224/81
摘要： An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.
摘要翻译：电子装置包括由绝缘体制成的封装基板，在封装基板上安装倒装芯片的器件芯片和密封器件芯片的密封部分。密封部分包括由焊料制成的侧壁。包括侧壁的整个密封部分可以由焊料制成。电子设备可以包括设置在密封部分上的金属层。

8. 发明申请

US20060138672A1 Electronic device and method of fabricating the same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US20060138672A1
公开(公告)日：2006-06-29
申请号：US11314007
申请日：2005-12-22
申请人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
发明人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H03H9/1085 , H01L2224/97 , H03H9/1078 , H01L2224/81
摘要： An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.
摘要翻译：电子装置包括由绝缘体制成的封装基板，在封装基板上安装倒装芯片的器件芯片和密封器件芯片的密封部分。密封部分包括由焊料制成的侧壁。包括侧壁的整个密封部分可以由焊料制成。电子设备可以包括设置在密封部分上的金属层。

9. 发明申请

US20060049489A1 Surface acoustic wave device and manufacturing method of the same 失效
标题翻译：声表面波装置及其制造方法相同
公开(公告)号：US20060049489A1
公开(公告)日：2006-03-09
申请号：US11212914
申请日：2005-08-29
申请人： Naoyuki Mishima , Takumi Kooriike
发明人： Naoyuki Mishima , Takumi Kooriike
IPC分类号： H01L23/552
CPC分类号： H03H9/1071 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H03H3/08 , H01L2924/00014 , H01L2924/00
摘要： A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap 32. The SAW device element is mounted on one of the metal patterns of the resin substrate. The resin cap is adhered to the resin substrate to cover the SAW device element. The surfaces of the resin substrate are flush with corresponding end surfaces of the resin cap.
摘要翻译：表面声波装置具有SAW器件元件10和容纳SAW器件元件的封装20。该包装包括一个在其两个表面上形成有金属图案21和22的树脂基板20和一个树脂盖32。 SAW器件元件安装在树脂基板的一个金属图案上。树脂盖粘附到树脂基板上以覆盖SAW器件元件。树脂基板的表面与树脂盖的相应端面齐平。

10. 发明授权

US6037698A Acoustic surface wave device 失效
标题翻译：声表面波装置
公开(公告)号：US6037698A
公开(公告)日：2000-03-14
申请号：US615144
申请日：1996-03-14
申请人： Masanori Ueda , Yoshiro Fujiwara , Takumi Kooriike
发明人： Masanori Ueda , Yoshiro Fujiwara , Takumi Kooriike
IPC分类号： H03H9/25 , H03H9/05 , H03H9/64 , H03H9/10
CPC分类号： H03H9/1071 , H03H9/058 , H03H9/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195
摘要： This invention relates to an acoustic surface wave device suitably used in a high-frequency circuit, in which high attenuation characteristics are provided.The present invention includes an acoustic surface wave element, a ceramic package having a ceramic substrate of a multi-layer structure, the ceramic substrate having a die-attach portion on which the acoustic surface wave element is mounted, the ceramic package having an input terminal and an output terminal connected to the acoustic surface wave element, the ceramic package having an opening located above the ceramic substrate, each of the input terminal and the output terminal having a ground terminal, and a metallic cap sealing the opening of the ceramic package. The metallic cap is electrically connected to one of the ground terminal of the input terminal and the ground terminal of the output terminal.
摘要翻译：本发明涉及适用于提供高衰减特性的高频电路中的声表面波装置。本发明包括声表面波元件，具有多层结构的陶瓷基片的陶瓷封装体，陶瓷基片具有安装声表面波元件的管芯附着部分，陶瓷封装具有输入端子以及连接到所述声表面波元件的输出端子，所述陶瓷封装具有位于所述陶瓷基板上方的开口，所述输入端子和所述输出端子中的每一个具有接地端子，以及密封所述陶瓷封装的开口的金属盖。金属盖电连接到输入端子的接地端子和输出端子的接地端子之间。

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