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1. 发明授权

US08322218B2 Surface acoustic wave element and equipment for measuring characteristics of liquid material 有权
标题翻译：用于测量液体材料特性的表面声波元件和设备
公开(公告)号：US08322218B2
公开(公告)日：2012-12-04
申请号：US12743753
申请日：2008-11-17
申请人： Takashi Kogai , Hiromi Yatsuda
发明人： Takashi Kogai , Hiromi Yatsuda
IPC分类号： G01N29/00 , H01L11/08 , H01L41/053
CPC分类号： G01N29/022 , G01N29/222 , G01N2291/0423 , H03H9/1092
摘要： A surface acoustic wave device having electrodes disposed on a piezoelectric substrate, comprising a sealing member having a peripheral wall disposed on the piezoelectric substrate in surrounding relation to the electrodes, and a top plate covering the peripheral wall; and a sealing stiffener disposed on the piezoelectric substrate in facing relation to a liquid material imposed on the piezoelectric substrate and which extends parallel to a portion of the peripheral wall.
摘要翻译：一种表面声波装置，具有设置在压电基板上的电极，包括密封构件，所述密封构件具有围绕所述电极设置在所述压电基板上的周壁，以及覆盖所述周壁的顶板; 以及密封加强件，其设置在压电基板上，与施加在压电基板上的液体材料相对，并且平行于周壁的一部分延伸。

2. 发明申请

US20100236322A1 Surface Acoustic Wave Element and Equipment for Measuring Characteristics of Liquid Material 有权
标题翻译：表面声波元件和液体材料特性测量设备
公开(公告)号：US20100236322A1
公开(公告)日：2010-09-23
申请号：US12743753
申请日：2008-11-17
申请人： Takashi Kogai , Hiromi Yatsuda
发明人： Takashi Kogai , Hiromi Yatsuda
IPC分类号： G01H11/08 , H01L41/053 , G01N11/00
CPC分类号： G01N29/022 , G01N29/222 , G01N2291/0423 , H03H9/1092
摘要： A surface acoustic wave device having electrodes disposed on a piezoelectric substrate, comprising a sealing member having a peripheral wall disposed on the piezoelectric substrate in surrounding relation to the electrodes, and a top plate covering the peripheral wall; and a sealing stiffener disposed on the piezoelectric substrate in facing relation to a liquid material imposed on the piezoelectric substrate and which extends parallel to a portion of the peripheral wall.
摘要翻译：一种表面声波装置，具有设置在压电基板上的电极，包括密封构件，所述密封构件具有围绕所述电极设置在所述压电基板上的周壁，以及覆盖所述周壁的顶板; 以及密封加强件，其设置在压电基板上，与施加在压电基板上的液体材料相对，并且平行于周壁的一部分延伸。

3. 发明授权

US06321444B1 Method of making surface acoustic wave device 有权
标题翻译：制造表面声波装置的方法
公开(公告)号：US06321444B1
公开(公告)日：2001-11-27
申请号：US09546769
申请日：2000-04-11
申请人： Hiromi Yatsuda , Hiroaki Iijima , Nobuhiro Mineshima
发明人： Hiromi Yatsuda , Hiroaki Iijima , Nobuhiro Mineshima
IPC分类号： H05K330
CPC分类号： H03H9/1071 , H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/4913
摘要： In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.
摘要翻译：在表面声波（SAW）器件及其制造方法中，将SAW芯片倒装安装在封装中。封装具有面向SAW芯片的电极形成表面的窗口。安装SAW芯片后，将进程中的物品插入反应离子蚀刻设备中，窗口打开。通过引入到离子蚀刻设备中的蚀刻气体来蚀刻SAW芯片的基板或电极。可以在电极形成表面上形成膜来代替蚀刻。因此，可以抑制由制造工艺的变化引起的特性的变化。

4. 发明授权

US5471722A Method of manufacturing a surface acoustic wave 失效
标题翻译：声表面波装置的制造方法
公开(公告)号：US5471722A
公开(公告)日：1995-12-05
申请号：US56838
申请日：1993-05-03
申请人： Hiromi Yatsuda
发明人： Hiromi Yatsuda
IPC分类号： H03H9/25 , H03H9/05 , H01L41/22
CPC分类号： H03H9/0547 , H01L24/49 , H03H9/059 , H03H9/1071 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/4823 , H01L2224/48465 , H01L2224/49 , H01L2224/73204 , H01L2224/73265 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/0106 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , Y10T29/42 , Y10T29/49144
摘要： A surface acoustic wave device and its manufacturing method. A surface acoustic wave device is used as filters for VHF and UHF range signals, or resonators for VHF and UHF range, by driving the surface of a surface acoustic wave element with applied signal to electrodes, transmitting a surface acoustic wave, and receiving the surface acoustic wave with other electrodes. In a configuration of a surface mount type surface acoustic wave device where a surface acoustic wave element is stored inside a package consisting of a base and a cover, pads are attached on a surface of the base and the surface acoustic wave element is fixed to the base by face down bonding.
摘要翻译：声表面波器件及其制造方法。表面声波装置被用作VHF和UHF范围信号的滤波器，或用于VHF和UHF范围的谐振器，通过用施加的信号驱动表面声波元件的表面，传输表面声波和接收表面声波与其他电极。表面安装型表面声波装置的结构中，表面声波元件存储在由基底和盖子组成的封装体内，衬垫被安装在基座的表面上，声表面波元件被固定在基于面朝下粘接。

5. 发明授权

US06628179B2 Surface acoustic wave device with a window for adjustment of the device 失效
标题翻译：表面声波装置，具有用于调节装置的窗口
公开(公告)号：US06628179B2
公开(公告)日：2003-09-30
申请号：US09945767
申请日：2001-09-04
申请人： Hiromi Yatsuda , Hiroaki Iijima , Nobuhiro Mineshima
发明人： Hiromi Yatsuda , Hiroaki Iijima , Nobuhiro Mineshima
IPC分类号： H03H964
CPC分类号： H03H9/1071 , H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/4913
摘要： In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.
摘要翻译：在表面声波（SAW）器件及其制造方法中，将SAW芯片倒装安装在封装中。封装具有面向SAW芯片的电极形成表面的窗口。安装SAW芯片后，将进程中的物品插入反应离子蚀刻设备中，窗口打开。通过引入到离子蚀刻设备中的蚀刻气体来蚀刻SAW芯片的基板或电极。可以在电极形成表面上形成膜来代替蚀刻。因此，可以抑制由制造工艺的变化引起的特性的变化。

6. 发明授权

US06362518B1 Electronic compoment to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same 有权
标题翻译：电子元件安装在其上密封有电子电路装置的电路板及其制造方法
公开(公告)号：US06362518B1
公开(公告)日：2002-03-26
申请号：US09583382
申请日：2000-05-30
申请人： Hiromi Yatsuda
发明人： Hiromi Yatsuda
IPC分类号： H01L2306
CPC分类号： H01L23/10 , H01L21/50 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H05K3/3436 , H05K3/3442 , H05K2201/0379 , H05K2201/09472 , H05K2201/10666 , H05K2203/1147 , Y02P70/613 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： A first substrate has a plurality of bumps and a second substrate has a plurality of openings at positions in registration with the plurality of bumps when the first and second substrates are placed one on top of the other in a confronting manner. The first and second substrates are put together by fusing a sealing wall formed on the second substrate, to hermetically seal an electronic device lying on the first substrate therein. Gas that may be generated upon fusing of the sealing wall can be effectively removed through the openings in the second substrate.
摘要翻译：第一基板具有多个凸块，并且当第一和第二基板以相对的方式一个放置在另一个基板上时，第二基板在与多个凸块对准的位置处具有多个开口。通过将形成在第二基板上的密封壁融合，将第一和第二基板放置在一起，将位于其上的第一基板上的电子设备密封。可以通过第二基板中的开口有效地去除在密封壁融合时产生的气体。

7. 发明授权

US5521453A Surface acoustic wave filter and mobile communication system using same 失效
标题翻译：表面声波滤波器和移动通信系统使用相同
公开(公告)号：US5521453A
公开(公告)日：1996-05-28
申请号：US376678
申请日：1995-01-23
申请人： Hiromi Yatsuda
发明人： Hiromi Yatsuda
IPC分类号： H03H9/145 , H03H9/64 , H01L41/08
CPC分类号： H03H9/6483 , H03H9/1455 , H03H9/6436 , H03H9/6469 , H03H9/14526
摘要： A composite surface acoustic wave filter includes an interdigitated interdigital surface acoustic wave filter having input and output terminals. Two one-port surface acoustic wave resonators are electrically connected in series to the interdigitated interdigital surface acoustic wave filter respectively at the input and output terminals, the one-port surface acoustic wave resonators having antiresonant frequencies in a stop band that is close to and higher than the passband of the interdigitated interdigital surface acoustic wave filter. Two other one-port surface acoustic wave resonators are electrically connected parallel to the interdigitated interdigital surface acoustic wave filter, the one-port surface acoustic wave resonators having resonant frequencies in a stop band that is close to and lower than the passband of the interdigitated interdigital surface acoustic wave filter.
摘要翻译：复合表面声波滤波器包括具有输入和输出端的交叉指状的叉指式声表面波滤波器。两个单端口声表面波谐振器分别在输入和输出端分别电连接到叉指式叉指声表面波滤波器，单端声表面波谐振器具有接近或高于阻带的反谐振频率比交叉叉指声表面波滤波器的通带。另外两个单端口声表面波谐振器与交指叉指声表面波滤波器并联电连接，单端口声表面波谐振器的谐振频率处于接近于低于交叉指叉的通带的阻带表面声波滤波器。

8. 发明授权

US4973875A Surface elastic wave device 失效
标题翻译：表面弹性波装置
公开(公告)号：US4973875A
公开(公告)日：1990-11-27
申请号：US271711
申请日：1988-11-16
申请人： Hiromi Yatsuda
发明人： Hiromi Yatsuda
IPC分类号： H03H9/64 , H03H3/08 , H03H9/02 , H03H9/145
CPC分类号： H03H9/02787 , H03H9/02858 , H03H9/02874 , H03H9/14547 , H03H9/14558 , H03H9/14561
摘要： A surface elastic wave filter for processing a supplied signal into a signal with nonlinear-phase frequency characteristics has a piezoelectric substrate for propagating a surface elastic wave through a surface layer thereof and spaced input and output electrodes disposed on the surface layer for sending and receiving the surface elastic wave. Each of the input and output electrodes has a pair of common electrodes having comb-shaped interdigitating electrode fingers extending therebetween. The central electrode fingers of the input and output electrodes have central axes across the direction of propagation of the surface elastic wave. The distance along the direction of propagation between the central axes is varied in the direction substantially normal to the direction of propagation. The surface elastic wave filter may include an electric conductor disposed on the piezoelectric substrate between the input and output electrodes and having a dimension in the direction of propagation, the dimension being varied in the direction substantially normal to the direction of propagation. A medium for varying the speed of propagation of the surface elastic wave may be positioned in place of the electric conductor.
摘要翻译：用于将提供的信号处理成具有非线性相位频率特性的信号的表面弹性波滤波器具有压电基板，用于通过其表面层传播表面弹性波，并且设置在表面层上的间隔的输入和输出电极，用于发送和接收表面弹性波。每个输入和输出电极具有一对在其间延伸的梳状交叉指状电极指的公共电极。输入和输出电极的中心电极指具有穿过表面弹性波传播方向的中心轴。沿着中心轴之间的传播方向的距离在基本上垂直于传播方向的方向上变化。表面弹性波滤波器可以包括布置在输入和输出电极之间的压电基板上的导体，并且具有在传播方向上的尺寸，该尺寸在基本上垂直于传播方向的方向上变化。可以将用于改变表面弹性波的传播速度的介质代替导电体。

9. 发明公开

US20240118242A1 SHEAR-MODE LIQUID-PHASE SENSOR HAVING GROOVE STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME 审中-公开
公开(公告)号：US20240118242A1
公开(公告)日：2024-04-11
申请号：US17962787
申请日：2022-10-10
申请人： Hiromi Yatsuda
发明人： Hiromi Yatsuda
IPC分类号： G01N29/02
CPC分类号： G01N29/022 , G01N2291/012 , G01N2291/0256 , G01N2291/0423 , G01N2291/106
摘要： The present invention discloses a shear-mode liquid-phase sensor having a groove structure including a sensing area, over which a plurality of surface acoustic waves propagate, forming thereon the groove structure along a propagation direction of the plurality of surface acoustic waves, wherein the groove structure has a bottom surface to be bound with target molecules, a width ranging from 100% to 500% of a maximum length of each target molecule and a depth ranging from 50% to 500% of the maximum length of each target molecule.

10. 发明授权

US06815313B2 Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same 有权
标题翻译：要安装在其上密封有电子电路装置的电路板上的电子部件及其制造方法
公开(公告)号：US06815313B2
公开(公告)日：2004-11-09
申请号：US10033397
申请日：2001-12-27
申请人： Hiromi Yatsuda
发明人： Hiromi Yatsuda
IPC分类号： H01L21301
CPC分类号： H01L23/10 , H01L21/50 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H05K3/3436 , H05K3/3442 , H05K2201/0379 , H05K2201/09472 , H05K2201/10666 , H05K2203/1147 , Y02P70/613 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： A first substrate has a plurality of bumps and a second substrate has a plurality of openings at positions in registration with the plurality of bumps when the first and second substrates are placed one on top of the other in a confronting manner. The first and second substrates are put together by fusing a sealing wall formed on the second substrate, to hermetically seal an electronic device lying on the first substrate therein. Gas that may be generated upon fusing of the sealing wall can be effectively removed through the openings in the second substrate.
摘要翻译：第一基板具有多个凸块，并且当第一和第二基板以相对的方式一个放置在另一个基板上时，第二基板在与多个凸块对准的位置处具有多个开口。通过将形成在第二基板上的密封壁融合，将第一和第二基板放置在一起，将位于其上的第一基板上的电子设备密封。可以通过第二基板中的开口有效地去除在密封壁融合时产生的气体。

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