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1. 发明授权

US06187218B1 Method of producing Ni-Cu-Zn ferrite material 有权
标题翻译：生产Ni-Cu-Zn铁氧体材料的方法
公开(公告)号：US06187218B1
公开(公告)日：2001-02-13
申请号：US09408053
申请日：1999-09-29
申请人： Takashi Kodama , Hideo Ajichi , Takehiro Konoike , Kunisaburo Tomono
发明人： Takashi Kodama , Hideo Ajichi , Takehiro Konoike , Kunisaburo Tomono
IPC分类号： C04B3526
CPC分类号： C04B35/265 , C01G49/0018 , C01P2002/32 , C01P2006/10 , C01P2006/12 , C04B35/626
摘要： A method of producing a Ni—Cu—Zn ferrite material comprises the steps of preparing a mixture of an iron compound powder having a specific surface area of about 8.5 m2/g or more, a nickel compound powder, copper compound powder and a zinc compound powder, the mixture having a specific surface area of about 8.0 m2/g or more; pre-calcining the mixture such that the pre-calcined mixture has a surface area of about 5.0 m2/g or more and a spinel crystal synthesizability within a range of about 80.5% to 98%; and milling the pre-calcined mixture to obtain a powder of a Ni—Cu—Zn ferrite material having a specific surface area of about 6.0 m2/g or more.
摘要翻译：制造Ni-Cu-Zn铁氧体材料的方法包括以下步骤：制备比表面积为约8.5m 2 / g以上的铁化合物粉末，镍化合物粉末，铜化合物粉末和锌化合物所述混合物的比表面积为约8.0m 2 / g以上; 预煅烧混合物，使得预煅烧混合物的表面积为约5.0m 2 / g以上，尖晶石晶体合成性在约80.5％〜98％的范围内; 并研磨预煅烧混合物，得到比表面积为约6.0m 2 / g以上的Ni-Cu-Zn铁氧体材料粉末。

2. 发明授权

US06492733B2 Laminated electronic component 有权
公开(公告)号：US06492733B2
公开(公告)日：2002-12-10
申请号：US09855139
申请日：2001-05-14
申请人： Akihiro Nakamura , Kunisaburo Tomono , Takashi Kodama , Takehiro Konoike
发明人： Akihiro Nakamura , Kunisaburo Tomono , Takashi Kodama , Takehiro Konoike
IPC分类号： H01L2348
CPC分类号： C04B35/265 , B32B18/00 , C04B2235/6567 , C04B2237/34 , C04B2237/68 , H01F41/0246 , H01G4/40 , H03H7/0115
摘要： A laminated electronic component includes a composite obtained by integrally sintering a plurality of laminated magnetic layers, internal conductors being formed in the interior of the composite. The internal conductor and the magnetic layers constitute a plurality of inductance elements, or an inductance element and a capacitance element. The magnetic layer has a composition containing a primary component comprising 45 to 50 mole percent Fe2O3, 0 to 33 mole percent ZnO, and 6 to 20 mole percent CuO, and the balance being NiO, and a Mn compound wherein the Mn compound is contained in an amount of 0.01 to 2.0 weight percent as MnO in the composition.

3. 发明授权

US5589096A Magnetic material for high frequencies 失效
标题翻译：高频磁性材料
公开(公告)号：US5589096A
公开(公告)日：1996-12-31
申请号：US277909
申请日：1994-07-20
申请人： Takehiro Konoike , Hiroshi Marusawa , Hiroshi Takagi , Kunisaburo Tomono
发明人： Takehiro Konoike , Hiroshi Marusawa , Hiroshi Takagi , Kunisaburo Tomono
IPC分类号： C01G49/00 , C04B35/26 , H01F1/34 , C04B35/44
CPC分类号： H01F1/346 , C04B35/2641
摘要： A magnetic material for high frequencies consists essentially of a main component expressed by the general formula:(Y.sub.3-x-2z Ca.sub.x+2z)(Fe.sub.w-x-y-z Sn.sub.x Al.sub.y V.sub.z)O.sub.4.5+1.5wwhere x, y, z and w take respective values within the following ranges: 0.10.ltoreq.x.ltoreq.0.60, 0.00.ltoreq.y.ltoreq.0.20, 0.20.ltoreq.z.ltoreq.0.60, 4.88.ltoreq.w.ltoreq.4.92, and an additional component of CeO.sub.2 incorporated therein in an amount of not less than 0.1 wt % but not more than 0.5 wt %.
摘要翻译：用于高频的磁性材料主要由以下通式表示的主要成分组成：（Y3-x-2zCax + 2z）（Few-xy-zSnxAlyVz）O4.5 + 1.5w其中x，y，z和w分别为在以下范围内的值：0.10

4. 发明授权

US5498999A High-frequency use non-reciprocal circuit element 失效
标题翻译：高频使用不可逆电路元件
公开(公告)号：US5498999A
公开(公告)日：1996-03-12
申请号：US320675
申请日：1994-10-11
申请人： Hiroshi Marusawa , Takashi Kawanami , Takehiro Konoike , Kunisaburo Tomono
发明人： Hiroshi Marusawa , Takashi Kawanami , Takehiro Konoike , Kunisaburo Tomono
IPC分类号： H01P1/383 , H01P1/32 , H01P1/36 , H01P1/387
CPC分类号： H01P1/32
摘要： A high-frequency use non-reciprocal circuit includes a sintered body which is a high-frequency use magnetic body obtained by a ceramic lamination/integral firing technique, a plurality of central electrodes which are arranged in the sintered body to be separated from each other through a magnetic layer while intersecting with each other at central portions, and electrodes for deriving impedance-matching capacitance which are formed in the vicinity of the intersecting portion to be in series with the central electrodes. The magnetic layer provided between the central electrodes serves as an insulating layer for electrically insulating the central electrodes from each other, a high-frequency use magnetic layer, and a material layer for deriving the impedance-matching capacitance.
摘要翻译：高频用不可逆电路包括：烧结体，其是通过陶瓷层叠/整体烧制技术获得的高频用磁体;多个中心电极，布置在烧结体中以彼此分离通过中心部分彼此相交的磁性层，以及用于导出与交叉部分附近形成的与中心电极串联的阻抗匹配电容的电极。设置在中心电极之间的磁性层用作将中心电极彼此电绝缘的绝缘层，高频用磁性层和用于导出阻抗匹配电容的材料层。

5. 发明授权

US5774024A Microwave non-reciprocal circuit element 失效
标题翻译：微波不可逆电路元件
公开(公告)号：US5774024A
公开(公告)日：1998-06-30
申请号：US755148
申请日：1996-09-25
申请人： Hiroshi Marusawa , Takehiro Konoike , Kunisaburo Tomono , Takashi Kawanami , Takashi Hasegawa
发明人： Hiroshi Marusawa , Takehiro Konoike , Kunisaburo Tomono , Takashi Kawanami , Takashi Hasegawa
IPC分类号： H01P1/387 , H01P1/383
CPC分类号： H01P1/387
摘要： A microwave non-reciprocal circuit element which is further miniaturized and of low losses without causing conductor losses in center electrodes following miniaturization. The microwave non-reciprocal circuit element according to the present invention comprises a plurality of center electrodes which are arranged to intersect with each other in a state electrically insulated from each other, and a microwave magnetic or dielectric body which is arranged on an intersecting portion of the plurality of center electrodes, and the respective center electrodes are formed by a plurality of conductors 55, 56 and 57 which are stacked through the microwave magnetic or dielectric body.
摘要翻译：微波不可逆电路元件，其进一步小型化并且具有低损耗，而不会在小型化之后引起中心电极中的导体损耗。根据本发明的微波不可逆电路元件包括多个中心电极，它们被布置成彼此电绝缘的状态彼此相交;以及微波磁场或电介质体，其布置在相互交叉的部分上多个中心电极和各个中心电极由多个通过微波磁性体或介电体层叠的导体55,56,57形成。

6. 发明授权

US5458797A Magnetic material for high frequencies 失效
标题翻译：高频磁性材料
公开(公告)号：US5458797A
公开(公告)日：1995-10-17
申请号：US278036
申请日：1994-07-20
申请人： Takehiro Konoike , Hiroshi Marusawa , Hiroshi Takagi , Kunisaburo Tomono
发明人： Takehiro Konoike , Hiroshi Marusawa , Hiroshi Takagi , Kunisaburo Tomono
IPC分类号： C01G49/00 , C04B35/26 , H01F1/34 , H01F1/00
CPC分类号： C04B35/2641 , H01F1/346
摘要： A magnetic material for high frequencies consists essentially of a main component expressed by the general formula:(Y.sub.3-2z Ca.sub.2z) (Fe.sub.w-x-y-z In.sub.x Al.sub.y V.sub.z)O.sub.4.5+1.5wwhere x, y, z and w take respective values within the following ranges: 0.02.ltoreq.x.ltoreq.0.80, 0.00.ltoreq.y.ltoreq.0.10, 0.30.ltoreq.z.ltoreq.0.50, 4.88.ltoreq.w.ltoreq.4.92, and an additional component composed of at least one oxide selected from the group consisting of CeO.sub.2, TiO.sub.2, ZrO.sub.2, SnO.sub.2 and HfO.sub.2. The additional component is incorporated into the main component in an amount of not less than 0.1 percent by weight but not more than 0.5 percent by weight.
摘要翻译：用于高频的磁性材料基本上由以下通式表示的主要成分组成：（Y3-2zCa2z）（Few-xy-zInxAlyVz）O4.5 + 1.5w其中x，y，z和w取下面的值范围：0.02

7. 发明授权

US5933318A Laminated capacitor and process for producing the same 失效
标题翻译：层压电容器及其制造方法
公开(公告)号：US5933318A
公开(公告)日：1999-08-03
申请号：US531324
申请日：1995-09-20
申请人： Kunisaburo Tomono , Koji Kajiyoshi
发明人： Kunisaburo Tomono , Koji Kajiyoshi
IPC分类号： C08F14/24 , H01G4/30 , H01G4/08
CPC分类号： H01G4/30 , Y10T29/435
摘要： A laminated capacitor and a process for producing the same. The laminated capacitor includes a plurality of capacitor assemblies and external electrodes, the capacitor assemblies each including a thermoplastic resin film having consecutively thereon a metal film as a first internal electrode, an inorganic dielectric material film, and a metal film as a second internal electrode, the plurality of capacitor assemblies being laminated with each other to form a laminated body, the external electrodes each being provided on an end surface of the laminated body, on which the first or second internal electrode is exposed, and being electrically connected to the first and second internal electrodes, respectively.
摘要翻译：叠层电容器及其制造方法。层叠电容器包括多个电容器组件和外部电极，电容器组件各自包括连续地具有作为第一内部电极的金属膜，无机介电材料膜和作为第二内部电极的金属膜的热塑性树脂膜，所述多个电容器组件彼此层叠以形成层叠体，所述外部电极各自设置在所述层叠体的端面上，所述第一或第二内部电极暴露在所述端面上，并且电连接到所述第一和第二内部电极第二内部电极。

8. 发明授权

US5264402A Non-reducible dielectric ceramic composition 失效
标题翻译：不可还原电介质陶瓷组合物
公开(公告)号：US5264402A
公开(公告)日：1993-11-23
申请号：US57252
申请日：1993-05-03
申请人： Harunobu Sano , Yukio Hamaji , Kunisaburo Tomono
发明人： Harunobu Sano , Yukio Hamaji , Kunisaburo Tomono
IPC分类号： C04B35/468 , C04B35/49 , H01B3/12 , H01G4/12 , C04B35/46
CPC分类号： C04B35/49 , C04B35/4682 , H01B3/12 , H01G4/1227
摘要： The present invention is directed to non-reducible dielectric composition consisting essentially of a main composition composed of a modified barium titanate system and additives (A) and (B) incorporated therein, said main composition consisting essentially of oxides of Ba, Ca, Ti, Zr, and Nb and having a composition represented by general formula:{(Ba.sub.1-x Ca.sub.x)O}.sub.m (Ti.sub.1-o-p Zr.sub.o Nb.sub.p)O.sub.2+p/2'wherein x, o, p and m satisfy the relationships of, ##EQU1## said additive (A) being composed at least one oxides selected from the group consisting of oxides of Mn, Fe, Cr, Co, and Ni, said additive (A) being incorporated into said main composition in an amount of 0.02 to 2.0 moles per 100 moles of said main composition in terms of respective oxides, MnO.sub.2, FeO.sub.3, Cr.sub.2 O.sub.3, CoO, and NiO, said additive (B) consisting of SiO.sub.2 and/or ZnO and incorporated into said main composition in an amount of 0.1 to 2.0 moles per 100 moles of said main composition. The composition is useful as material for monolithic ceramic capacitor.
摘要翻译：本发明涉及不可还原的电介质组合物，其基本上由由改性钛酸钡体系组成的主要组合物和其中加入的添加剂（A）和（B）组成，所述主要组合物主要由Ba，Ca，Ti， Zr和Nb，并且具有由通式{（Ba1-xCax）O} m（Ti1-o-pZroNbp）O2 + p / 2'表示的组成，其中x，o，p和m满足关系，所述添加剂（A）由选自氧化物中的至少一种氧化物组成，所述氧化物选自氧化物，氧化物，氧化物，氧化物，氧化物，氧化物，氧化物的Mn，Fe，Cr，Co和Ni中的至少一种，所述添加剂（A）以相对于氧化物，MnO 2，FeO 3，Cr 2 O 3， CoO和NiO，所述添加剂（B）由SiO 2和/或ZnO组成，并且以每100摩尔所述主要com计为0.1至2.0摩尔的量加入所述主组合物中位置。该组合物可用作单片陶瓷电容器的材料。

9. 发明授权

US4689594A Multi-layer chip coil 失效
标题翻译：多层芯片线圈
公开(公告)号：US4689594A
公开(公告)日：1987-08-25
申请号：US906095
申请日：1986-09-10
申请人： Toshio Kawabata , Kunisaburo Tomono
发明人： Toshio Kawabata , Kunisaburo Tomono
IPC分类号： H01F17/00 , H01F41/02 , H01F5/00 , H01F27/28
CPC分类号： H01F17/0013 , H01F41/02
摘要： A multi-layer chip coil which comprises a stack of intermediate laminas of magnetizeable material having a through-hole defined therein so as to extend completely through the thickness thereof, first and second patterned electric conductors formed on the opposite surfaces of each of the intermediate laminas, respectively, and an electroconductive element extending through the through-hole so as to connect the first and second conductors together. The intermediate laminas are stacked one above the other with the first and second conductors in one intermediate lamina partially overlapping in contact with the second conductor in the neighboring intermediate lamina immediately thereabove and the first conductor in the neighboring intermediate lamina immediately therebelow, respectively, whereby the first and second conductors in all of the intermediate laminas, which are connected in series with each other through the respective conductive element, are connected in series with each other.
摘要翻译：一种多层芯片线圈，其包括可磁化材料的中间层叠层，其具有限定在其中的通孔，以便完全延伸穿过其厚度，形成在每个中间层片的相对表面上的第一和第二图案化导电体以及延伸穿过通孔的导电元件，以将第一和第二导体连接在一起。中间层叠体一个在另一个之上堆叠，其中一个中间层中的第一和第二导体部分重叠地与紧邻其上的相邻中间层中的第二导体和相邻中间层中的第一导体紧密接触，由此，通过相应的导电元件彼此串联连接的所有中间薄片中的第一和第二导体彼此串联连接。

10. 发明授权

US06488879B1 Method of producing an electronic device having a sheathed body 有权
标题翻译：具有护套体的电子装置的制造方法
公开(公告)号：US06488879B1
公开(公告)日：2002-12-03
申请号：US09602941
申请日：2000-06-23
申请人： Kozo Moriyasu , Toshiya Oshima , Kunisaburo Tomono
发明人： Kozo Moriyasu , Toshiya Oshima , Kunisaburo Tomono
IPC分类号： B29C3502
CPC分类号： H05K3/284 , H01L23/293 , H01L23/3135 , H01L2924/0002 , H01L2924/19041 , Y10T29/435 , Y10T29/49012 , Y10T428/23 , Y10T428/234 , Y10T428/239 , Y10T428/249958 , Y10T428/24998 , Y10T428/249981 , Y10T428/249992 , H01L2924/00
摘要： An outer sheath for an electronic device which includes an electronic element is formed by placing a thermosetting resin on the outer surface of the electronic element to form a first thermosetting resin layer, placing a thermoplastic resin on the outer surface of the first thermosetting resin layer to form a thermoplastic layer and placing a thermosetting resin layer on the thermoplastic layer to form a second thermosetting resin layer. All three layers are then heated so as to cure the first and second thermosetting resin layers and to cause the thermoplastic layer to melt and form a non-porous layer which is subsequently solidified.
摘要翻译：通过在电子元件的外表面上放置热固性树脂以形成第一热固性树脂层，将热塑性树脂放置在第一热固性树脂层的外表面上，形成包括电子元件的电子器件用外护套形成热塑性层并将热固性树脂层放置在热塑性层上以形成第二热固性树脂层。然后加热所有三个层，以固化第一和第二热固性树脂层，并使热塑性层熔化并形成随后固化的无孔层。

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