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1. 发明申请

US20080032103A1 Multilayer Printed Circuit Board 审中-公开
标题翻译：多层印刷电路板
公开(公告)号：US20080032103A1
公开(公告)日：2008-02-07
申请号：US11587771
申请日：2005-04-27
申请人： Takashi Kikuchi , Hiroyuki Tsuji , Takashi Itoh , Shigeru Tanaka , Eiichiro Kuribayashi , Greg Clements
发明人： Takashi Kikuchi , Hiroyuki Tsuji , Takashi Itoh , Shigeru Tanaka , Eiichiro Kuribayashi , Greg Clements
IPC分类号： H05K1/03 , H05K3/46
CPC分类号： H05K1/0346 , H05K3/386 , H05K3/4626 , H05K2201/0129 , H05K2201/0154 , Y10T428/24959 , Y10T428/31725
摘要： A multilayer printed circuit board can be used in high-frequency applications, is not easily affected by environmental changes, and has stable dielectric characteristics. A multilayer printed circuit board suitable for use in the high-frequency range includes at least two printed wiring sheets laminated with an interlayer bonding member therebetween. At least one of the at least two printed wiring sheets includes an insulating film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the insulating film, and a metal wiring layer disposed on the adhesive layer. The interlayer bonding member contains a thermoplastic polyimide.
摘要翻译：多层印刷电路板可用于高频应用，不易受环境变化的影响，具有稳定的介电特性。适用于高频范围的多层印刷电路板包括至少两层印刷布线片，其间夹有层间接合构件。所述至少两个印刷布线板中的至少一个包括绝缘膜，包含设置在所述绝缘膜的至少一个表面上的热塑性聚酰亚胺的粘合剂层和设置在所述粘合剂层上的金属布线层。层间结合部件含有热塑性聚酰亚胺。

2. 发明申请

US20060205891A1 Thermosetting resin composition, multilayer body using same, and circuit board 有权
公开(公告)号：US20060205891A1
公开(公告)日：2006-09-14
申请号：US10552540
申请日：2004-04-12
申请人： Shigeru Tanaka , Kanji SHimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
发明人： Shigeru Tanaka , Kanji SHimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
IPC分类号： C08G65/48
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.

3. 发明申请

US20060048963A1 Laminate, printed circuit board, and preparing method thereof 审中-公开
标题翻译：层压板，印刷电路板及其制备方法
公开(公告)号：US20060048963A1
公开(公告)日：2006-03-09
申请号：US10537838
申请日：2003-12-05
申请人： Masaru Nishinaka , Takashi Itoh , Shigeru Tanaka , Mutsuaki Murakami
发明人： Masaru Nishinaka , Takashi Itoh , Shigeru Tanaka , Mutsuaki Murakami
IPC分类号： B32B15/08
CPC分类号： H05K1/0346 , B32B7/12 , B32B15/08 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2255/205 , B32B2255/28 , B32B2307/202 , B32B2307/306 , B32B2457/08 , H05K1/036 , H05K3/146 , H05K3/381 , Y10T428/12569 , Y10T428/31681
摘要： A laminate which comprises a thermoplastic polyimide layer and a metal layer, or comprises a non-thermoplastic polyimide film layer and, formed on one or both surfaces, a thermoplastic polyimide layer and a metal layer; and a printed wiring board comprising the laminate. The laminate can be used for forming a high density circuit thereon, exhibits good resistance to further processing such as desmearing and excellent adhesion, and is excellent in adhesion reliability in a high temperature atmosphere.
摘要翻译：一种层压体，其包含热塑性聚酰亚胺层和金属层，或包含非热塑性聚酰亚胺膜层，并且在一个或两个表面上形成热塑性聚酰亚胺层和金属层; 以及包括层压体的印刷线路板。该层叠体可用于在其上形成高密度电路，显示出良好的抵抗进一步加工如耐磨和优异的粘合性，并且在高温气氛中的粘合可靠性优异。

4. 发明授权

US08501874B2 Thermosetting resin composition, multilayer body using same, and circuit board 有权
标题翻译：热固性树脂组合物，使用其的多层体和电路板
公开(公告)号：US08501874B2
公开(公告)日：2013-08-06
申请号：US12188898
申请日：2008-08-08
申请人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
发明人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
IPC分类号： A47G19/08 , B32B15/04 , B32B15/08 , C07F9/24 , C08F283/00 , C08F283/04 , C08G18/77 , C08G59/14 , C08G65/32 , C08G65/48 , C08G69/48 , C08G79/02 , C08K5/49 , C08K5/51 , C08K5/5399 , C08L61/00 , C08L61/04 , C08L63/00 , C08L67/00 , C08L71/02 , C08L71/12 , C08L75/04 , C08L77/00 , C08L85/02
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions.A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc.A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
摘要翻译：本发明涉及适合用于制造柔性印刷电路板（FPC）和积聚电路板的电路板的热固性树脂组合物以及使用这种热固性树脂组合物制造的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂组分（A），酚醛树脂组分（B）和环氧树脂组分（C）。重量比（A）/ [（B）+（C）]的混合比在0.4至2.0的范围内，重量比为组分（A）的重量与总重量的比例组分（B）和组分（C）。通过使用这种热固性树脂组合物，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂（A），磷腈化合物（D）和氰酸酯化合物（E）。磷腈化合物（D）包括通过使苯氧基磷腈化合物（D-1）交联而制得的交联的苯氧基磷腈化合物（D-1）和/或交联的苯氧基磷腈化合物（D-1），交联的苯氧基磷腈化合物 -2）具有至少一个酚羟基。通过使用这种热固性树脂组合物，可以制造介电特性，加工性，耐热性和阻燃性优异的多层体和电路板。

5. 发明授权

US07115681B2 Resin composition 失效
标题翻译：树脂组成
公开(公告)号：US07115681B2
公开(公告)日：2006-10-03
申请号：US10482897
申请日：2002-07-08
申请人： Kanji Shimo-Ohsako , Takashi Itoh , Masaru Nishinaka , Shigeru Tanaka , Mutsuaki Murakami
发明人： Kanji Shimo-Ohsako , Takashi Itoh , Masaru Nishinaka , Shigeru Tanaka , Mutsuaki Murakami
IPC分类号： C08L79/08
CPC分类号： H05K1/0346 , C08G59/08 , C08G59/5033 , C08L63/00 , C08L79/08 , C08L2666/20 , C08L2666/22
摘要： The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.
摘要翻译：本发明提供一种包含含有特定二酐和二胺的聚酰亚胺和环氧树脂的树脂组合物。树脂组合物可以在相对较低的温度下结合，具有优异的耐热性，粘附性，耐焊接性和PCT后剥离强度的保持率。通过使用包含该树脂组合物的金属箔的聚酰亚胺树脂片或聚酰亚胺树脂片根据半添加方法形成具有良好布线形状，电路牢固牢固和绝缘电阻高的印刷线路板的电路在微电路空间可以获得。

6. 发明授权

US08313831B2 Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same 有权
标题翻译：热塑性聚酰亚胺树脂膜，多层体及其制造方法
公开(公告)号：US08313831B2
公开(公告)日：2012-11-20
申请号：US10537959
申请日：2003-12-12
申请人： Shigeru Tanaka , Takashi Itoh , Masaru Nishinaka , Kanji Shimo-Ohsako , Mutsuaki Murakami
发明人： Shigeru Tanaka , Takashi Itoh , Masaru Nishinaka , Kanji Shimo-Ohsako , Mutsuaki Murakami
IPC分类号： B32B27/00
CPC分类号： H05K1/0346 , B32B7/10 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/03 , B32B2274/00 , B32B2307/204 , B32B2307/206 , B32B2307/306 , B32B2307/5825 , B32B2307/734 , B32B2457/00 , B32B2457/08 , C23C18/1653 , C23C18/22 , C23C18/26 , C23C18/38 , H05K1/036 , Y10T29/49126 , Y10T29/49155 , Y10T428/12493 , Y10T428/24917 , Y10T428/249991
摘要： The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 μm to 1 μm measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.
摘要翻译：本发明提供了一种具有包括非热塑性聚酰亚胺膜和设置在其一个或两个表面上的热塑性聚酰亚胺层的双层或三层结构的层压体，热塑性聚酰亚胺层的表面被表面处理; 包括聚合物膜和设置在其一个或两个表面上的层的层压体，所述层包括包含具有特定结构的聚酰亚胺树脂和热固性组分的聚酰亚胺树脂组合物; 以及具有该树脂膜的树脂膜和层叠体，至少具有以0.002mm的截止值测定的算术平均粗糙度的Ra1值为0.05μm〜1μm的表面，Ra1 / Ra2比为0.4的层叠体至1，Ra2是以0.1mm的截止值测量的值。这些层压体可以提供具有优异粘附性的印刷电路板，可以在其上形成微结构电路。

7. 发明申请

US20070269665A1 Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board 审中-公开
标题翻译：聚酰亚胺树脂组合物，含聚酰胺树脂的聚合物膜和使用其的层压板以及制造印刷线路板的方法
公开(公告)号：US20070269665A1
公开(公告)日：2007-11-22
申请号：US10557307
申请日：2004-05-17
申请人： Kanji Shimoohsako , Shigeru Tanaka , Masaru Nishiaka , Takashi Itoh , Mutsuaki Murakami
发明人： Kanji Shimoohsako , Shigeru Tanaka , Masaru Nishiaka , Takashi Itoh , Mutsuaki Murakami
IPC分类号： B32B15/08 , C23C28/00 , C08L81/00
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/06 , B32B27/34 , C08K5/37 , H05K1/0373 , H05K3/181 , H05K3/389 , H05K3/4661 , H05K2201/0154 , Y10T428/31681 , C08L79/08
摘要： The present invention relates to a polyimide resin composition including an organic thiol compound and a thermoplastic polyimide resin, a polymeric film containing the polyimide resin, a laminate including the same, and a printed circuit board. By using the polyimide resin composition, it is possible to form an electroless plating film having high adhesive strength even under high-temperature, high-humidity conditions in spite of the fact that the surface roughness of the insulating layer is extremely low. Furthermore, by using the polymeric film and a laminate including the polymeric film and a metal layer, it is possible to obtain a printed circuit board capable of forming high-density circuit and having excellent adhesiveness, and excellent adhesion reliability in a high-temperature, high-humidity environment.
摘要翻译：本发明涉及包含有机硫醇化合物和热塑性聚酰亚胺树脂的聚酰亚胺树脂组合物，含有聚酰亚胺树脂的聚合物膜，包含该聚酰亚胺树脂的层压体和印刷电路板。通过使用聚酰亚胺树脂组合物，即使在绝缘层的表面粗糙度非常低的情况下，即使在高温，高湿度条件下也可以形成具有高粘合强度的化学镀膜。此外，通过使用聚合物膜和包含聚合物膜和金属层的层压体，可以获得能够形成高密度电路并且具有优异的粘合性的印刷电路板，并且在高温下具有优异的粘附可靠性，高湿度环境。

8. 发明申请

US20060115670A1 Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same 有权
标题翻译：热塑性聚酰亚胺树脂膜，多层体及其制造方法
公开(公告)号：US20060115670A1
公开(公告)日：2006-06-01
申请号：US10537959
申请日：2003-12-12
申请人： Shigeru Tanaka , Takashi Itoh , Masaru Nishinaka , Kanji Shimo-Ohsako , Mutsuaki Murakami
发明人： Shigeru Tanaka , Takashi Itoh , Masaru Nishinaka , Kanji Shimo-Ohsako , Mutsuaki Murakami
IPC分类号： H05K3/10 , C25D5/10
CPC分类号： H05K1/0346 , B32B7/10 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/16 , B32B27/281 , B32B2250/03 , B32B2274/00 , B32B2307/204 , B32B2307/206 , B32B2307/306 , B32B2307/5825 , B32B2307/734 , B32B2457/00 , B32B2457/08 , C23C18/1653 , C23C18/22 , C23C18/26 , C23C18/38 , H05K1/036 , Y10T29/49126 , Y10T29/49155 , Y10T428/12493 , Y10T428/24917 , Y10T428/249991
摘要： The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 μm to 1 μm measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.
摘要翻译：本发明提供了一种具有包括非热塑性聚酰亚胺膜和设置在其一个或两个表面上的热塑性聚酰亚胺层的双层或三层结构的层压体，热塑性聚酰亚胺层的表面被表面处理; 包括聚合物膜和设置在其一个或两个表面上的层的层压体，所述层包括包含具有特定结构的聚酰亚胺树脂和热固性组分的聚酰亚胺树脂组合物; 以及具有该表面的树脂膜和层叠体，至少具有以0.002mm的截止值测定的算术平均粗糙度的Ra1值为0.05μm〜1μm的表面，Ra1 / Ra2的比例为0.4 至1，Ra2是以0.1mm的截止值测量的值。这些层压体可以提供具有优异粘附性的印刷电路板，可以在其上形成微结构电路。

9. 发明申请

US20050119381A1 Thermosetting resin composition and laminates and circuit board substrates made by using the same 审中-公开
标题翻译：热固性树脂组合物和使用它们的层压板和电路板基底
公开(公告)号：US20050119381A1
公开(公告)日：2005-06-02
申请号：US10505727
申请日：2003-03-06
申请人： Shigeru Tanaka , Kanji Shimo-Ohsako , Takashi Itoh , Mutsuaki Murakami
发明人： Shigeru Tanaka , Kanji Shimo-Ohsako , Takashi Itoh , Mutsuaki Murakami
IPC分类号： C08G59/40 , C08L63/00 , C08L79/08 , H05K1/03 , C08K5/29
CPC分类号： H05K1/0353 , C08G59/4014 , C08L63/00 , C08L79/08 , H05K2201/0154 , C08L2666/20 , C08L2666/22
摘要： A thermosetting resin composition of the present invention includes (A) a polyimide resin, and as thermosetting components, at least one of (B) a multifunctional cynate ester and (C) an epoxy resin. The (A) polyimide resin is soluble polyimide obtained by reacting, with diamines, acid dianhydride including an ether bond. As (B) the multifunctional cynate esters, a compound having a specific structure, and/or an oligomer thereof is used. As (C) the epoxy resin, an epoxy resin having a dicyclopentadiene bone structure and/or an alkoxy-group-including silane denatured epoxy resin (suitable epoxy resin) is preferably used.
摘要翻译：本发明的热固性树脂组合物包含（A）聚酰亚胺树脂，作为热固性成分，可以使用（B）多官能酯类酯和（C）环氧树脂中的至少一种。（A）聚酰亚胺树脂是通过与二胺，包括醚键的酸二酐反应获得的可溶性聚酰亚胺。作为（B）多功能的Cynate酯，使用具有特定结构的化合物和/或其低聚物。作为（C）环氧树脂，优选使用具有二环戊二烯骨结构的环氧树脂和/或含烷氧基的硅烷变性环氧树脂（适合的环氧树脂）。

10. 发明授权

US07521511B2 Thermosetting resin composition, multilayer body using same, and circuit board 有权
标题翻译：热固性树脂组合物，使用其的多层体和电路板
公开(公告)号：US07521511B2
公开(公告)日：2009-04-21
申请号：US10552540
申请日：2004-04-12
申请人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
发明人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
IPC分类号： A47G19/08 , B32B15/04 , B32B15/08 , C08J3/00 , C08K5/49 , C08K5/51 , C08L61/00 , C08L61/04 , C08L63/00 , C08L67/00 , C08L71/02 , C08L71/12
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group. By using such a composition, multilayer bodies and circuit boards with excellent properties can be manufactured.
摘要翻译：提供了用于制造电路板和积聚电路板和堆积板的热固性树脂组合物，以及使用这些组合物制造的多层体和电路板。组合物含有聚酰亚胺树脂（A），酚醛树脂（B）和环氧树脂（C）成分。混合比例（A）/ [（B）+（C）]为0.4〜2.0，该比例为（A）与（B）和（C）的总重量之比。通过使用这样的组成，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。组合物含有聚酰亚胺树脂（A），磷腈（D）和氰酸酯（E）。 D包括通过交联（D-1），具有至少一个酚羟基的（D-2））制备的含酚羟基的苯氧基磷腈（D-1）和/或交联的苯氧基磷腈（D-2）。通过使用这样的组合物，可以制造具有优异性能的多层体和电路板。

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