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1. 发明授权

US07252881B2 Multilayer structure and multilayer wiring board using the same 失效
标题翻译：多层结构和使用其的多层布线板
公开(公告)号：US07252881B2
公开(公告)日：2007-08-07
申请号：US10257502
申请日：2001-04-12
申请人： Takashi Itoh , Shoji Hara , Hirosaku Nagano , Masaru Nishinaka
发明人： Takashi Itoh , Shoji Hara , Hirosaku Nagano , Masaru Nishinaka
IPC分类号： B32B15/08 , B32B27/28 , H05K1/03
CPC分类号： H05K3/4655 , B32B27/06 , H05K3/386 , H05K3/388 , H05K3/389 , H05K3/4652 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/0358 , H05K2201/068 , H05K2203/121 , Y10T428/24917 , Y10T428/2804 , Y10T428/2848 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.
摘要翻译：一种多层结构，包括导体层，粘合剂层和介于导体层和粘合剂层之间的聚合物膜层。多层结构可以用于提供具有优异的电性能和良好的物理平衡性，高耐热性，窄间距布线图案，小直径孔，均匀绝缘层厚度，适当低的系数线膨胀，金属与聚合物膜之间的粘合性稳定。聚合物膜层可以在分子中含有至少一个由式（1）表示的重复单元。本发明还提供从多层结构体获得的多层布线基板。

2. 发明授权

US06773809B1 Copper foil with insulating adhesive 失效
标题翻译：铜箔带绝缘胶
公开(公告)号：US06773809B1
公开(公告)日：2004-08-10
申请号：US09707882
申请日：2000-11-08
申请人： Takashi Itoh , Shoji Hara , Hirosaku Nagano
发明人： Takashi Itoh , Shoji Hara , Hirosaku Nagano
IPC分类号： B32B712
CPC分类号： H05K3/4655 , B32B7/12 , C09J183/14 , H05K3/4652 , H05K2201/0162 , H05K2201/0358 , Y10T428/2852 , Y10T428/2878 , Y10T428/2883
摘要： There is provided a copper foil with an insulating adhesive which is excellent in that an insulating adhesive layer has low dieletric constant, low dieletric loss tangent and high adhering force at a normal temperature and a high temperature, and steps for manufacturing a multilayer printed circuit board can be shortened due to the presence of a copper foil on which a circuit can be formed by etching or the like. An insulating adhesive composition containing as an essential component an organic compound having at least two alkenyl groups having the reactivity with a SiH group in one molecule, and a silicon compound containing at least two SiH groups in one molecule and a copper foil are incorporated.
摘要翻译：提供了一种具有绝缘粘合剂的铜箔，其绝缘粘合剂层具有低常压，高温下的低缺陷常数，低损耗切线和高粘附力，以及用于制造多层印刷电路板的步骤可以由于存在可以通过蚀刻等形成电路的铜箔而被缩短。一种绝缘粘合剂组合物，其含有具有至少两个具有与SiH基反应性的烯基的有机化合物作为必要成分一分子和一分子中含有至少两个SiH基团的硅化合物和铜箔。

3. 发明授权

US5641852A Thermosetting resin composition and method of manufacturing it from an epoxy resin, cyanate and phenol 失效
标题翻译：热固性树脂组合物及其制备方法，由环氧树脂，氰酸酯和苯酚制成
公开(公告)号：US5641852A
公开(公告)日：1997-06-24
申请号：US586464
申请日：1996-01-11
申请人： Hiroyuki Tsuji , Shoji Hara , Hirosaku Nagano
发明人： Hiroyuki Tsuji , Shoji Hara , Hirosaku Nagano
IPC分类号： B32B15/08 , B32B27/38 , C08G59/62 , C08G73/06 , C08L63/00 , C08L79/04 , C09J163/00 , C08G73/10
CPC分类号： C08L63/00 , B32B15/08 , B32B27/38 , C08G59/621 , C08G73/0655 , C08L79/04
摘要： Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.
摘要翻译：公开了一种热固性树脂组合物，其包含氰酸酯树脂，含有酚羟基和环氧树脂中的至少一种或多种的化合物，其中所述树脂具有优异的粘合和耐热性能，同时具有低的硬化收缩速率和有助于更高的尺寸稳定性，以及制造它们的方法。

4. 发明授权

US5759693A Laminate 失效
标题翻译：层压板
公开(公告)号：US5759693A
公开(公告)日：1998-06-02
申请号：US811366
申请日：1997-03-10
申请人： Hiroyuki Tsuji , Shoji Hara , Hirosaku Nagano
发明人： Hiroyuki Tsuji , Shoji Hara , Hirosaku Nagano
IPC分类号： B32B15/08 , B32B27/38 , C08G73/06 , C08L63/00
CPC分类号： C08G73/0655 , B32B15/08 , B32B27/38 , C08L63/00 , Y10T428/31511 , Y10T428/31529 , Y10T428/31721
摘要： The object of the invention is to solve a problem of bending of laminate caused by hardening contraction of epoxy resin that has been a subject in laminate used conventional epoxy resinous composition in laminate of two or more than two layers used for electric and electronic parts, and to provide a novel laminate obtaining excellent adhesive property and heat resistant property, and exhibiting no bending. The inventive laminate achieving the above object comprises laminating at least the following two components (a) and (b): (a) resin composition comprising thermosetting resin composed of imide carbonate synthesized by reacting cyanate resin and compound which containing at least 1 or more than 1 phenolic hydroxyl, and epoxy resin (b) heat resistant resin obtaining glass transition temperature of 150.degree. C. or more than 150.degree. C. and thermal expansion coefficient of 0.4 to 3.8.times.10.sup.-5 cm/cm/.degree.C. at the temperature of 20.degree. (ordinary temperature) to 150.degree. C. The inventive thermosetting resin composition has been consummated by converting cyanate resin into imide carbonate under the presence of epoxy resin.
摘要翻译：本发明的目的是解决由层压体中使用的常规环氧树脂组合物中已经存在的环氧树脂的硬化收缩引起的层叠体的两层或两层以上用于电气和电子部件的层压体弯曲问题，以及提供一种获得优异的粘合性和耐热性，并且不显示弯曲的新颖的层压体。实现上述目的的本发明层压体包括至少层压以下两种组分（a）和（b）：（a）包含由氰酸酯树脂和含有至少1个以上的化合物的化合物合成的由酰亚胺碳酸酯组成的热固性树脂的树脂组合物 1酚羟基和环氧树脂（b）耐热树脂获得玻璃化转变温度为150℃或大于150℃，热膨胀系数为0.4至3.8×10-5厘米/厘米/℃，温度为 20℃（常温）至150℃。本发明的热固性树脂组合物通过在环氧树脂存在下将氰酸酯树脂转化为碳酸亚
乙酯而完成。

5. 发明授权

US07011905B2 Solid polymer electrolyte membrane, solid polymer electrolyte fuel cell using the membrane and method of fabricating the same 失效
标题翻译：固体聚合物电解质膜，使用该膜的固体高分子电解质燃料电池及其制造方法
公开(公告)号：US07011905B2
公开(公告)日：2006-03-14
申请号：US11003598
申请日：2004-12-06
申请人： Shigeru Sakamoto , Hiroko Sanda , Hirosaku Nagano , Hidekazu Kuromatsu , Kiyoyuki Namura
发明人： Shigeru Sakamoto , Hiroko Sanda , Hirosaku Nagano , Hidekazu Kuromatsu , Kiyoyuki Namura
IPC分类号： H01M8/10
CPC分类号： H01M8/1004 , H01B1/122 , H01M8/1023 , H01M8/1032 , H01M8/1039 , H01M8/1053 , H01M2300/0082 , H01M2300/0094 , Y10T29/49108 , Y10T29/49112 , Y10T29/49114 , Y10T29/49115 , Y10T29/53135
摘要： A solid polymer electrolyte membrane and a catalytic layer are properly assembled even when the solid polymer electrolyte membrane and an ion exchange resin in the catalytic layer are formed of different materials. In a fuel cell, a solid polymer electrolyte membrane 20 is provided with a first solid polymer electrolyte membrane 200, and second solid polymer electrolyte membranes 202 and 204 provided at respective sides thereof. The second solid polymer electrolyte membranes 202 and 204 are formed of the same material as the ion exchange resin (not shown) included in a catalytic layer 26 and a catalytic layer 30.
摘要翻译：即使固体高分子电解质膜和催化剂层中的离子交换树脂由不同的材料形成，也能够适当地组装固体高分子电解质膜和催化剂层。在燃料电池中，固体高分子电解质膜20设置有第一固体聚合物电解质膜200和设置在其各自侧的第二固体聚合物电解质膜202和204。第二固体聚合物电解质膜202和204由与催化剂层26和催化剂层30中所包含的离子交换树脂（未示出）相同的材料形成。

6. 发明授权

US5665802A Polyimide film and manufacturing method thereof 失效
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：US5665802A
公开(公告)日：1997-09-09
申请号：US711072
申请日：1996-09-09
申请人： Haruhiko Maki , Hirosaku Nagano , Yoshiaki Inaba
发明人： Haruhiko Maki , Hirosaku Nagano , Yoshiaki Inaba
IPC分类号： C08J5/18 , C08K5/49 , C08L79/08 , H05K1/03 , C08K5/523 , C08K5/521 , C08K5/53
CPC分类号： C08J5/18 , C08K5/49 , H05K1/0346 , C08J2379/08 , H05K1/0373 , Y10T428/31721
摘要： The present invention provides an improved grade of polyimide containing an organic phosphorus compound, a film composed thereof and a method of making the aforementioned film. According to the present invention, it is possible to obtain a polyimide film improved in mechanical strength.
摘要翻译：本发明提供一种改进的含有有机磷化合物的聚酰亚胺等，其组成的膜和制备上述膜的方法。根据本发明，可以获得提高机械强度的聚酰亚胺膜。

7. 发明授权

US5081229A Polyimide having excellent thermal dimensional stability 失效
标题翻译：具有优异热稳定性的聚酰亚胺
公开(公告)号：US5081229A
公开(公告)日：1992-01-14
申请号：US362793
申请日：1989-06-07
申请人： Kiyokazu Akahori , Hideki Kawai , Hirosaku Nagano
发明人： Kiyokazu Akahori , Hideki Kawai , Hirosaku Nagano
IPC分类号： C08G73/10 , H05K1/03
CPC分类号： C08G73/1071 , C08G73/1042 , C08G73/1067 , H05K1/0346
摘要： The present invention provides a copolyimide characterized in that the copolyimide contains units represented by formulas (I) and (II) ##STR1## (wherein R.sub.0 represents an aromatic tetracarboxylic residue). The polyimide has excellent thermal dimensional stability, and can be fabricated by using conventional inexpensive materials.

8. 发明授权

US4451621A Heat resistant resin composition comprising modified polyamide-imide resin having carboxyl groups 失效
标题翻译：含有具有羧基的改性聚酰胺 - 酰亚胺树脂的耐热树脂组合物
公开(公告)号：US4451621A
公开(公告)日：1984-05-29
申请号：US452432
申请日：1982-12-23
申请人： Kazuya Yonezawa , Kazuaki Kira , Hiroshi Wakabayashi , Hirosaku Nagano
发明人： Kazuya Yonezawa , Kazuaki Kira , Hiroshi Wakabayashi , Hirosaku Nagano
IPC分类号： C08F299/00 , C08F290/00 , C08F299/02 , C08G73/00 , C08G73/14 , H01B3/30 , H05K1/03 , C08G73/10
CPC分类号： C08G73/14 , H01B3/305 , H01B3/306 , H05K1/0346
摘要： A heat resistant resin composition comprising a, polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl- amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.

9. 发明授权

US5861192A Method of improving adhesive property of polyimide film and polymidefilm having improved adhesive property 失效
标题翻译：提高聚酰亚胺膜粘合性能和改善粘合性能的聚酰亚胺膜的方法
公开(公告)号：US5861192A
公开(公告)日：1999-01-19
申请号：US690975
申请日：1996-08-01
申请人： Masao Nakata , Kosuke Kataoka , Hirosaku Nagano
发明人： Masao Nakata , Kosuke Kataoka , Hirosaku Nagano
IPC分类号： C08J7/00 , B05D3/08 , B05D3/10 , B05D3/12 , B29C59/00 , B29C59/02 , B29C59/08 , B29C71/00 , C08J7/02 , C08J7/12 , H05K1/03 , H05K3/38 , B05D3/00
CPC分类号： C08J7/12 , B05D3/08 , B05D3/101 , B05D3/12 , B29C59/005 , B29C59/02 , B29C59/08 , B29C71/0009 , H05K3/381 , B29C2059/027 , B29C2791/001 , B29K2079/08 , C08J2379/08 , H05K1/0346
摘要： The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property.A method for improving adhesive property of polyimide film according to the present invention comprises a combination of steps of;execution of a liquid applying process for treating polyimide film surface by exerting physical mechanical force on said film surface under the condition of that said film surface remains wet with water or organic solvent, or solution of organic solvent or aqueous solution; and execution of a surface treatment process for treating polyimide film surface by performing selected treatment among flame treatment, alkaline treatment, coupling agent treatment or surface treatment by way of projecting grinding material of fine grading onto film surface at high velocity, and said steps are performed in an arbitrary order. For example, using a surface treating device 10 shown in FIG. 1, consecutive execution of a surface treatment process for treating film surface, a liquid applying process and a drying process is realized by that polyimide film 22 is run from a feeding device 18 to a winding device 20.
摘要翻译：本发明解决了通过常规的表面处理不能获得足够的粘合强度以满足最近对高粘合性能的要求的问题，并且提供了改进聚酰亚胺膜的粘合性能并且显着提高粘合性能的效果的方法。本发明还提供了具有改进的粘合性能的新型聚酰亚胺膜。根据本发明的改进聚酰亚胺薄膜的粘合性的方法包括以下步骤的组合：执行用于在所述膜表面保持用水或有机溶剂润湿的条件下或在有机溶剂或水溶液的溶液的条件下在所述膜表面上施加物理机械力来处理聚酰亚胺膜表面的液体施加过程; 并且通过在火焰处理，碱处理，偶联剂处理或表面处理中进行选择的处理，通过以高速投影细微分级的研磨材料到薄膜表面上来执行用于处理聚酰亚胺膜表面的表面处理工艺，并且执行所述步骤以任意顺序。例如，使用图1所示的表面处理装置10，如图1所示，通过聚酰亚胺膜22从供给装置18向卷绕装置20运行，连续执行用于处理膜表面的表面处理工艺，液体施加处理和干燥处理。

10. 发明授权

US5621068A Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate 失效
标题翻译：热塑性聚酰亚胺聚合物; 热塑性聚酰亚胺膜; 聚酰亚胺层压板; 和层叠体的制造方法
公开(公告)号：US5621068A
公开(公告)日：1997-04-15
申请号：US381890
申请日：1995-02-22
申请人： Yoshifumi Okamoto , Hiroyuki Furutani , Kazuhisa Danno , Junya Ida , Hirosaku Nagano
发明人： Yoshifumi Okamoto , Hiroyuki Furutani , Kazuhisa Danno , Junya Ida , Hirosaku Nagano
IPC分类号： B32B15/08 , C08G73/10 , C08L79/08 , C09J179/08 , H05K1/03 , H05K3/28 , H05K3/38
CPC分类号： C08G73/1042 , B32B15/08 , C09J179/08 , C08L79/08 , H05K1/0346 , H05K3/281 , H05K3/386 , Y10S428/901 , Y10T428/31504 , Y10T428/31674 , Y10T428/31721
摘要： A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.
摘要翻译： PCT No.PCT / JP94 / 01286 Sec。 371日期1995年2月22日 102（e）日期1995年2月22日PCT 1994年8月3日PCT PCT。第WO95 / 04100号公报日期1995年2月9日一种热塑性聚酰亚胺薄膜，其包含热塑性聚酰亚胺聚合物，聚酰亚胺层压材料，分别适合用作覆盖层粘合剂和覆盖层，其能够发挥显着的耐热性，加工性和粘附性，柔性印刷电路板的制造，并且适用于柔性铜包覆层压板和双面粘合片的粘合剂层; 和聚酰亚胺层叠体的制造方法。由下述通式（1）表示的热塑性聚酰亚胺聚合物：其中Ar1，Ar2，Ar4和Ar6表示二价有机基团，Ar 3和Ar 5表示四价有机基团其中l，m amd n表示0〜15的正整数，其中1和m的和为1或大于1，其中t表示1或大于1的正整数。

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