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1. 发明申请

US20070117119A1 Carriers having biological substance 有权
标题翻译：载体具有生物物质
公开(公告)号：US20070117119A1
公开(公告)日：2007-05-24
申请号：US11514162
申请日：2006-09-01
申请人： Takashi Akita , Chiho Ito , Teruta Ishimaru , Haruko Miyauchi , Kei Murase , Atsushi Takahashi , Toshinori Sumi , Osamu Maehara , Tadanobu Ikeda , Nobuko Oogami , Takayuki Makino , Fujio Yu , Fumiaki Watanabe , Toshitaka Uragaki , Wataru Fujii , Takeharu Morishita
发明人： Takashi Akita , Chiho Ito , Teruta Ishimaru , Haruko Miyauchi , Kei Murase , Atsushi Takahashi , Toshinori Sumi , Osamu Maehara , Tadanobu Ikeda , Nobuko Oogami , Takayuki Makino , Fujio Yu , Fumiaki Watanabe , Toshitaka Uragaki , Wataru Fujii , Takeharu Morishita
IPC分类号： C12Q1/68 , B32B38/04 , C12M1/34
CPC分类号： D06M23/00 , D06M15/13 , D06M15/15 , D06M15/263 , D06M15/285 , D06M15/333 , D06M15/3562 , D06M15/53 , D06M16/00 , D06M23/02 , Y10T156/1052 , Y10T436/143333
摘要： The present invention relates to biological substance-immobilized fibers wherein a biological substance is immobilized on a fiber, fibers retaining a biological substance-immobilized gel, and fiber alignments having bundles of the above-described fibers and slices of the same.
摘要翻译：本发明涉及生物物质固定化纤维，其中将生物物质固定在纤维上，保留固定有生物物质的凝胶的纤维，以及具有上述纤维束和纤维的纤维排列。

2. 发明授权

US07122378B1 Carriers having biological substance 有权
标题翻译：载体具有生物物质
公开(公告)号：US07122378B1
公开(公告)日：2006-10-17
申请号：US09914782
申请日：2000-03-06
申请人： Takashi Akita , Chiho Ito , Teruta Ishimaru , Haruko Miyauchi , Kei Murase , Atsushi Takahashi , Toshinori Sumi , Osamu Maehara , Tadanobu Ikeda , Nobuko Oogami , Takayuki Makino , Fujio Yu , Fumiaki Watanabe , Toshitaka Uragaki , Wataru Fujii , Takeharu Morishita
发明人： Takashi Akita , Chiho Ito , Teruta Ishimaru , Haruko Miyauchi , Kei Murase , Atsushi Takahashi , Toshinori Sumi , Osamu Maehara , Tadanobu Ikeda , Nobuko Oogami , Takayuki Makino , Fujio Yu , Fumiaki Watanabe , Toshitaka Uragaki , Wataru Fujii , Takeharu Morishita
IPC分类号： G01N33/00 , C12M3/00 , C07H21/02 , C07H21/04
CPC分类号： D06M23/00 , D06M15/13 , D06M15/15 , D06M15/263 , D06M15/285 , D06M15/333 , D06M15/3562 , D06M15/53 , D06M16/00 , D06M23/02 , Y10T156/1052 , Y10T436/143333
摘要： By the present invention, there is provided a fiber having nucleic acid immobilized thereon, an alignment of fibers having nucleic acid immobilized thereon, and a slice thereof.
摘要翻译：通过本发明，提供了其上固定有核酸的纤维，其上固定有核酸的纤维的取向及其切片。

3. 发明申请

US20140203222A1 COPPER PARTICLES, COPPER PASTE, PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM 有权
标题翻译：铜颗粒，铜浆，生产导电涂膜的方法和导电涂膜
公开(公告)号：US20140203222A1
公开(公告)日：2014-07-24
申请号：US14117970
申请日：2012-05-17
申请人： Chiho Ito , Takeshi Yatsuka , Yasuo Kakihara
发明人： Chiho Ito , Takeshi Yatsuka , Yasuo Kakihara
IPC分类号： C09D5/24 , H01B1/02
CPC分类号： C09D5/24 , B22F1/0011 , B22F1/0074 , B22F7/04 , B22F9/24 , B22F2998/10 , C22C1/0425 , H01B1/026 , H01B1/22 , H05K1/095 , H05K2201/0272 , H05K2201/0323 , B22F3/22 , B22F2003/248 , C23C18/00
摘要： There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.05 to 2 μm as measured by observation using SEM in which a BET specific surface area value (SSA) (m2/g) and a carbon content (C) (% by weight) of the copper particles satisfy a relationship represented the following formula [1]: C/SSA·7×10−2 [1], and a copper paste comprising the copper particles; drying the coating film to obtain a copper powder-containing coating film; and then subjecting the resulting coating film to electroless metal plating or heat treatment with superheated steam.
摘要翻译：提供了铜颗粒和用于含铜粉末涂膜的铜浆，其可以在不使用钯等昂贵催化剂的情况下进行无电镀金属镀覆，以及通过使含铜粉末的通过使用铜浆形成的涂膜通过无电镀金属镀层或用过热蒸汽进行热处理。导电性涂膜的制造方法技术领域本发明涉及导电性涂膜的制造方法，其特征在于，包括以下步骤：使用平均粒径为0.05〜2μm的铜粒子，在绝缘性基材上形成涂膜，铜颗粒的面积值（SSA）（m2 / g）和碳含量（C）（重量％）满足下式[1]所示的关系：C / SSA·7×10-2 [1] 以及包含铜颗粒的铜浆料; 干燥涂膜得到含铜粉末的涂膜; 然后对所得到的涂膜进行化学镀金属或用过热蒸汽的热处理。

4. 发明授权

US10154585B2 Process for producing conductive coating film, and conductive coating film 有权
公开(公告)号：US10154585B2
公开(公告)日：2018-12-11
申请号：US14117976
申请日：2012-05-17
申请人： Takeshi Yatsuka , Chiho Ito , Yasuo Kakihara , Hirotoshi Kizumoto , Koji Shoki
发明人： Takeshi Yatsuka , Chiho Ito , Yasuo Kakihara , Hirotoshi Kizumoto , Koji Shoki
IPC分类号： H05K1/00 , H05K1/09 , C09D5/24 , C08J7/04 , H05K3/22 , C09D7/61 , C08K3/08
摘要： An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5 μm on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.

5. 发明授权

US09221979B2 Copper particles, copper paste, process for producing conductive coating film, and conductive coating film 有权
标题翻译：铜颗粒，铜浆，导电涂膜生产工艺及导电涂膜
公开(公告)号：US09221979B2
公开(公告)日：2015-12-29
申请号：US14117970
申请日：2012-05-17
申请人： Chiho Ito , Takeshi Yatsuka , Yasuo Kakihara
发明人： Chiho Ito , Takeshi Yatsuka , Yasuo Kakihara
IPC分类号： B22F1/00 , C09D5/24 , H01B1/02 , H01B1/22 , H05K1/09 , C22C1/04 , B22F7/04 , B22F9/24
CPC分类号： C09D5/24 , B22F1/0011 , B22F1/0074 , B22F7/04 , B22F9/24 , B22F2998/10 , C22C1/0425 , H01B1/026 , H01B1/22 , H05K1/095 , H05K2201/0272 , H05K2201/0323 , B22F3/22 , B22F2003/248 , C23C18/00
摘要： There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.05 to 2 μm as measured by observation using SEM in which a BET specific surface area value (SSA) (m2/g) and a carbon content (C) (% by weight) of the copper particles satisfy a relationship represented the following formula [1]: C/SSA·7×10−2 [1], and a copper paste comprising the copper particles; drying the coating film to obtain a copper powder-containing coating film; and then subjecting the resulting coating film to electroless metal plating or heat treatment with superheated steam.
摘要翻译：提供了铜颗粒和用于含铜粉末涂膜的铜浆，其可以在不使用钯等昂贵催化剂的情况下进行无电镀金属镀覆，以及通过使含铜粉末的通过使用铜浆形成的涂膜通过无电镀金属镀层或用过热蒸汽进行热处理。导电性涂膜的制造方法技术领域本发明涉及导电性涂膜的制造方法，其特征在于，包括以下步骤：使用平均粒径为0.05〜2μm的铜粒子，在绝缘性基材上形成涂膜，铜颗粒的面积值（SSA）（m2 / g）和碳含量（C）（重量％）满足下式[1]所示的关系：C / SSA·7×10-2 [1] 以及包含铜颗粒的铜浆料; 干燥涂膜得到含铜粉末的涂膜; 然后对所得到的涂膜进行化学镀金属或用过热蒸汽的热处理。

6. 发明申请

US20140141238A1 PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM 审中-公开
标题翻译：生产导电涂膜的方法和导电涂膜
公开(公告)号：US20140141238A1
公开(公告)日：2014-05-22
申请号：US14117976
申请日：2012-05-17
申请人： Takeshi Yatsuka , Chiho Ito , Yasuo Kakihara , Hirotoshi Kizumoto , Koji Shoki
发明人： Takeshi Yatsuka , Chiho Ito , Yasuo Kakihara , Hirotoshi Kizumoto , Koji Shoki
IPC分类号： H05K1/09 , H05K3/22
CPC分类号： H05K1/095 , C08J7/045 , C08J2379/08 , C08K3/08 , C09D5/24 , C09D7/61 , H05K3/227 , Y10T428/266
摘要： An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5 μm on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.
摘要翻译：本发明的目的是提供一种通过使用能够表现出良好的导电性和对绝缘基板具有良好粘合性的金属粉末膏，形成在聚酰亚胺系绝缘基板上的导电性涂膜。通过在聚酰亚胺系绝缘基板上形成溶剂可溶物含量为20重量％以下且5μm以下的树脂固化层，通过使用金属粉末膏在树脂固化层上形成含金属粉末的涂层; 然后对所得到的涂层进行过热蒸汽的热处理，可以获得能够表现出良好的导电性和对绝缘基板的良好粘接性的导电性涂膜。

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