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1. 发明授权

US08659147B2 Power semiconductor circuit device and method for manufacturing the same 有权
标题翻译：功率半导体电路装置及其制造方法
公开(公告)号：US08659147B2
公开(公告)日：2014-02-25
申请号：US12988035
申请日：2009-06-04
申请人： Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi , Yoichi Goto
发明人： Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi , Yoichi Goto
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/3107 , H01L23/3672 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/48 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.
摘要翻译：一种功率半导体电路器件及其制造方法，它们均设置有：至少安装有功率半导体元件的基板; 在基板的与安装有功率半导体元件的表面相对的基板表面露出的基板的部分表面的状态下模制基板和功率半导体元件的树脂; 以及通过按压力与基板接合的散热翅片。在基板上形成有与散热片接合的部分的槽，散热片通过铆接而与沟槽接合。

2. 发明申请

US20110031612A1 POWER SEMICONDUCTOR CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：功率半导体电路装置及其制造方法
公开(公告)号：US20110031612A1
公开(公告)日：2011-02-10
申请号：US12988035
申请日：2009-06-04
申请人： Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi
发明人： Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/3107 , H01L23/3672 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/48 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.
摘要翻译：一种功率半导体电路器件及其制造方法，它们均设置有：至少安装有功率半导体元件的基板; 在基板的与安装有功率半导体元件的表面相对的基板表面露出的基板的部分表面的状态下模制基板和功率半导体元件的树脂; 以及通过按压力与基板接合的散热翅片。在基板上形成有与散热片接合的部分的槽，散热片通过铆接而与沟槽接合。

3. 发明授权

US08643171B1 Power semiconductor device 有权
标题翻译：功率半导体器件
公开(公告)号：US08643171B1
公开(公告)日：2014-02-04
申请号：US13993348
申请日：2012-07-31
申请人： Shigeyuki Nakazato , Yoichi Goto , Kiyofumi Kitai , Toru Kimura
发明人： Shigeyuki Nakazato , Yoichi Goto , Kiyofumi Kitai , Toru Kimura
IPC分类号： H01L23/10 , H01L23/043
CPC分类号： H01L23/34 , H01L21/4882 , H01L23/3121 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A power semiconductor device includes: a mold unit that includes a power semiconductor element, a base plate, and a mold unit, the power semiconductor element being mounted on one surface of the base plate, a convex portion being formed on an other surface of the base plate, the convex portion including a plurality of grooves, the mold unit having a mold resin with which the power semiconductor element is sealed in such a manner as to expose the convex portion; a plurality of radiation fins inserted into the grooves, respectively, and fixedly attached to the base plate by swaging; and a metal plate that includes a opening into which the convex portion is inserted, the metal plate being arranged between the mold unit and the radiation fins with the convex portion inserted into the opening, wherein the metal plate includes a protrusion that protrudes from an edge of the opening and that digs into a side surface of the convex portion when the convex portion is inserted into the opening.
摘要翻译：功率半导体器件包括：模具单元，其包括功率半导体元件，基板和模具单元，所述功率半导体元件安装在所述基板的一个表面上，凸部形成在所述基板的另一表面上底板，所述凸部包括多个凹槽，所述模具单元具有模制树脂，所述功率半导体元件以这样的方式被密封以暴露所述凸部; 分别插入槽中的多个辐射翅片，并通过型锻固定地固定到基板上; 以及金属板，其包括插入所述凸部的开口，所述金属板布置在所述模具单元和所述散热片之间，所述凸部插入到所述开口中，其中所述金属板包括突出部，并且当所述凸部插入到所述开口中时，所述凹部挖入所述凸部的侧表面。

4. 发明申请

US20140367702A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20140367702A1
公开(公告)日：2014-12-18
申请号：US14370803
申请日：2012-07-25
申请人： Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
发明人： Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
IPC分类号： H01L23/367 , H01L29/20 , H01L21/56 , H01L29/16 , H01L23/31 , H01L21/48
CPC分类号： H01L23/3672 , H01L21/4871 , H01L21/4882 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.
摘要翻译：目的在于提供一种鳍状集成型半导体器件及其制造方法，其具有简单的结构和良好的散热特性。半导体器件包括：在第一主面上形成有以直立状态排列的翅片的基板; 绝缘层，形成在所述基板的第二主面上，所述第二主面与所述基板的所述第一主面相对; 固定到所述绝缘层的电路图案; 以及连接到电路图案的半导体元件。翅片形成有沿翅片的厚度方向穿过的狭缝。

5. 发明申请

US20140035122A1 POWER SEMICONDUCTOR DEVICE 有权
标题翻译：功率半导体器件
公开(公告)号：US20140035122A1
公开(公告)日：2014-02-06
申请号：US13993348
申请日：2012-07-31
申请人： Shigeyuki Nakazato , Yoichi Goto , Kiyofumi Kitai , Toru Kimura
发明人： Shigeyuki Nakazato , Yoichi Goto , Kiyofumi Kitai , Toru Kimura
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L21/4882 , H01L23/3121 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A power semiconductor device includes: a mold unit that includes a power semiconductor element, a base plate, and a mold unit, the power semiconductor element being mounted on one surface of the base plate, a convex portion being formed on an other surface of the base plate, the convex portion including a plurality of grooves, the mold unit having a mold resin with which the power semiconductor element is sealed in such a manner as to expose the convex portion; a plurality of radiation fins inserted into the grooves, respectively, and fixedly attached to the base plate by swaging; and a metal plate that includes a opening into which the convex portion is inserted, the metal plate being arranged between the mold unit and the radiation fins with the convex portion inserted into the opening, wherein the metal plate includes a protrusion that protrudes from an edge of the opening and that digs into a side surface of the convex portion when the convex portion is inserted into the opening.
摘要翻译：功率半导体器件包括：模具单元，其包括功率半导体元件，基板和模具单元，所述功率半导体元件安装在所述基板的一个表面上，凸部形成在所述基板的另一表面上底板，所述凸部包括多个凹槽，所述模具单元具有模制树脂，所述功率半导体元件以这样的方式被密封以暴露所述凸部; 分别插入槽中的多个辐射翅片，并通过型锻固定地固定到基板上; 以及金属板，其包括插入所述凸部的开口，所述金属板布置在所述模具单元和所述散热片之间，所述凸部插入到所述开口中，其中所述金属板包括突出部，并且当所述凸部插入到所述开口中时，所述凹部挖入所述凸部的侧表面。

6. 发明授权

US09390995B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US09390995B2
公开(公告)日：2016-07-12
申请号：US14370803
申请日：2012-07-25
申请人： Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
发明人： Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
IPC分类号： H01L23/367 , H01L23/34 , B23P15/26 , H01L23/433 , H01L21/48 , H01L23/31 , H01L21/56 , H01L23/373 , H01L29/16 , H01L29/20
CPC分类号： H01L23/3672 , H01L21/4871 , H01L21/4882 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.
摘要翻译：目的在于提供一种鳍状集成型半导体器件及其制造方法，其具有简单的结构和良好的散热特性。半导体器件包括：在第一主面上形成有以直立状态排列的翅片的基板; 绝缘层，形成在所述基板的第二主面上，所述第二主面与所述基板的所述第一主面相对; 固定到所述绝缘层的电路图案; 以及连接到电路图案的半导体元件。翅片形成有沿翅片的厚度方向穿过的狭缝。

7. 发明授权

US09134076B2 Radiator and method of manufacturing radiator 有权
标题翻译：散热器及散热器制造方法
公开(公告)号：US09134076B2
公开(公告)日：2015-09-15
申请号：US13510162
申请日：2009-11-17
申请人： Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
发明人： Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
IPC分类号： F28F3/02 , B23P11/00 , H01L21/48 , H01L23/367 , B21D53/02 , H01L23/00
CPC分类号： F28F3/02 , B23P11/00 , B23P2700/10 , H01L21/4878 , H01L21/4882 , H01L23/3672 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , Y10T29/4935 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.
摘要翻译：一种散热器，包括：多个散热片; 以及辐射翅片支撑基座，其具有安装到其一个表面的加热器元件和安装有辐射翅片的多个平行翅片槽，以及突出部，其将形成的辐射翅片固定到其另一个表面上，其中，突起推动散热片的一个侧表面，以将散热片的另一侧表面推向散热片槽的侧表面，并且其中散热片槽和突起分别沿着翅片槽，并且分割的翅片槽和每个分割的突起在翅片槽的纵向方向上具有相同的长度，并且彼此成对配合。

8. 发明申请

US20120227952A1 RADIATOR AND METHOD OF MANUFACTURING RADIATOR 有权
标题翻译：散热器和制造辐射器的方法
公开(公告)号：US20120227952A1
公开(公告)日：2012-09-13
申请号：US13510162
申请日：2009-11-17
申请人： Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
发明人： Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： F28F3/02 , B23P11/00 , B23P2700/10 , H01L21/4878 , H01L21/4882 , H01L23/3672 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , Y10T29/4935 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.
摘要翻译：一种散热器，包括：多个散热片; 以及辐射翅片支撑基座，其具有安装到其一个表面的加热器元件和安装有辐射翅片的多个平行翅片槽，以及突出部，其将形成的辐射翅片固定到其另一个表面上，其中，突起推动散热片的一个侧表面，以将散热片的另一侧表面推向散热片槽的侧表面，并且其中散热片槽和突起分别沿着翅片槽，并且分割的翅片槽和每个分割的突起在翅片槽的纵向方向上具有相同的长度，并且彼此成对配合。

9. 发明授权

US11168411B2 Impurity control during formation of aluminum nitride crystals and thermal treatment of aluminum nitride crystals 有权
公开(公告)号：US11168411B2
公开(公告)日：2021-11-09
申请号：US16444148
申请日：2019-06-18
申请人： Robert T. Bondokov , James R. Grandusky , Jianfeng Chen , Shichao Wang , Toru Kimura , Thomas Miebach , Keisuke Yamaoka , Leo J. Schowalter
发明人： Robert T. Bondokov , James R. Grandusky , Jianfeng Chen , Shichao Wang , Toru Kimura , Thomas Miebach , Keisuke Yamaoka , Leo J. Schowalter
IPC分类号： C30B33/02 , C30B29/40 , H01L33/32 , C30B23/06 , C01B21/072
摘要： In various embodiments, single-crystal aluminum nitride boules and substrates are formed from the vapor phase with controlled levels of impurities such as carbon. Single-crystal aluminum nitride may be heat treated via quasi-isothermal annealing and controlled cooling to improve its ultraviolet absorption coefficient and/or Urbach energy.

10. 发明授权

US09030280B2 Electromagnetically operated device and switching device including the same 有权
标题翻译：电磁操作装置和包括其的开关装置
公开(公告)号：US09030280B2
公开(公告)日：2015-05-12
申请号：US14129807
申请日：2012-09-10
申请人： Kazuki Takahashi , Mitsuru Tsukima , Tomoko Tanabe , Taehyun Kim , Toru Kimura
发明人： Kazuki Takahashi , Mitsuru Tsukima , Tomoko Tanabe , Taehyun Kim , Toru Kimura
IPC分类号： H01H67/02 , H01H1/54 , H01H33/666
CPC分类号： H01H1/54 , H01F7/1615 , H01H33/6662 , H01H51/2227 , H01H71/32
摘要： An electromagnetically operated device includes: a moving member of the electromagnetically operated device; a drive coil that is energized to generate magnetic flux for driving the moving member; a permanent magnet provided between a stationary member and the moving member for holding the moving member; and a holding force adjusting member for adjusting the holding force applied to the moving member by the permanent magnet, wherein the holding force adjusting member is placed at a position that will not be included in the main magnetic path of the magnetic flux caused by the drive coil so as to be removable.
摘要翻译：电磁操作装置包括：电磁操作装置的移动部件; 驱动线圈，其被通电以产生用于驱动所述移动部件的磁通量; 设置在静止构件和用于保持移动构件的移动构件之间的永磁体; 以及保持力调节构件，用于调节由永磁体施加到移动构件的保持力，其中保持力调节构件被放置在不包括在由驱动器引起的磁通量的主磁路中的位置线圈，以便可拆卸。

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