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1. 发明授权

US07210221B2 Transfer system for assembling a head gimbal assembly 失效
标题翻译：用于组装头部万向架组件的传送系统
公开(公告)号：US07210221B2
公开(公告)日：2007-05-01
申请号：US10929512
申请日：2004-08-30
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： B23P19/02
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.
摘要翻译：用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接其上的端子。当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

2. 发明申请

US20050028353A1 Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly 失效
标题翻译：底盘结构，传送系统以及用于组装头万向架组件的方法和装置
公开(公告)号：US20050028353A1
公开(公告)日：2005-02-10
申请号：US10929322
申请日：2004-08-30
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： G11B21/21 , G11B5/48 , G11B21/20 , G11B5/012 , G11B17/00
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assemblingjigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.
摘要翻译：用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接其上的端子。当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。因此，需要其数量至少等于在各个组装过程中保留的未完成的HG组件的数量的组装。因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

3. 发明授权

US07380329B2 Method of assembling a head gimbal assembly 失效
标题翻译：头部万向节组件的组装方法
公开(公告)号：US07380329B2
公开(公告)日：2008-06-03
申请号：US10929322
申请日：2004-08-30
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： G11B5/48
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.
摘要翻译：头部万向节组件的组装方法。该方法包括一系列步骤，其包括：堆叠基板，负载梁和挠曲件以形成至少底层为基板系列的三层堆叠系列; 将所述负载梁的部分接合到所述基板，并且将所述弯曲部分连接到所述三层堆叠系列中的所述负载梁以形成悬挂部; 将滑块附接到悬架部分中的挠曲件以制造头部万向节组件; 负载弯曲形成在头部万向节组件中的铰链部分; 并加热铰链部分，以便以预定的弯曲角度将铰链部分上的弯曲载荷调整到预定值。

4. 发明授权

US07161766B2 Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly 失效
标题翻译：底盘结构，传送系统以及用于组装头万向架组件的方法和装置
公开(公告)号：US07161766B2
公开(公告)日：2007-01-09
申请号：US10929507
申请日：2004-08-30
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： G11B5/48
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. The base plate structure comprises a band portion having conveying holes and positioning holes formed at a predetermined pith respectively in a longitudinal direction. A plurality of the base plates are disposed via connecting portions integrally formed at a predetermined pitch at edges on one side of the band portion.
摘要翻译：用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接其上的端子。基板结构包括具有分别在纵向方向上形成在预定的髓上的输送孔和定位孔的带部分。多个基板通过在带部分的一侧的边缘处以预定间距整体形成的连接部分设置。

5. 发明申请

US20050024777A1 Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly 失效
公开(公告)号：US20050024777A1
公开(公告)日：2005-02-03
申请号：US10929507
申请日：2004-08-30
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： G11B21/21 , G11B5/48 , G11B21/20
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

6. 发明申请

US20050022372A1 Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly 失效
标题翻译：底盘结构，传送系统以及用于组装头万向架组件的方法和装置
公开(公告)号：US20050022372A1
公开(公告)日：2005-02-03
申请号：US10929512
申请日：2004-08-30
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： G11B21/21 , G11B5/48 , G11B21/20 , B23P19/00
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.
摘要翻译：用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接其上的端子。当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

7. 发明授权

US06823581B2 Apparatus for assembling a head gimbal assembly 失效
标题翻译：用于组装头部万向节组件的装置
公开(公告)号：US06823581B2
公开(公告)日：2004-11-30
申请号：US09989633
申请日：2001-11-20
申请人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
发明人： Takao Kidachi , Tadaaki Tomiyama , Yoshio Uematsu , Hiromi Ishikawa Ishikawa , Tatsushi Yoshida , Hiroyoshi Yokome , Yukihiro Nakamura , Hisashi Ohyama , Tatsumi Tsuchiya
IPC分类号： B23P1902
CPC分类号： G11B5/4826 , Y10T29/49025 , Y10T29/49027 , Y10T29/4998 , Y10T29/5313 , Y10T29/53165 , Y10T29/53174 , Y10T29/53187 , Y10T29/53191 , Y10T29/53252 , Y10T29/5327
摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.
摘要翻译：用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接其上的端子。当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

8. 发明授权

US06336581B1 Solder ball connection device and capillary tube thereof 失效
标题翻译：焊球连接装置及其毛细管
公开(公告)号：US06336581B1
公开(公告)日：2002-01-08
申请号：US09629481
申请日：2000-06-19
申请人： Tatsumi Tuchiya , Tatsushi Yoshida , Yasuhiro Mita , Tadaaki Tomiyama , Takao Kidachi , Surya Pattanaik
发明人： Tatsumi Tuchiya , Tatsushi Yoshida , Yasuhiro Mita , Tadaaki Tomiyama , Takao Kidachi , Surya Pattanaik
IPC分类号： B23K100
CPC分类号： B23K3/0623 , B23K3/0615 , H01L2224/11334 , H01L2224/742 , H05K3/3478
摘要： A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.
摘要翻译：用于焊球连接装置的毛细管用焊球将焊盘的第一连接表面连接到焊盘的第二连接表面。第一连接表面形成在由盘单元中的滑块保持器保持的滑块上。第二连接表面形成在连接到滑块保持器的引线的端部。毛细管具有大致圆锥形的中空部分的球调节器。焊球调节器在其顶部具有通向中空部分的尖端的开口。中空部分和开口的中心轴是常见的。焊球调节器还具有围绕开口的中心轴线的一对突起，其中突起彼此面对，其间具有中心轴线。突起调节焊球的运动。当从连接一对突起和锥形尖端部分的末端的线观察时，中空部分的尖端是锥形的。

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