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    • 2. 发明授权
    • Low voltage read cascode for 2V/3V and different bank combinations without metal options for a simultaneous operation flash memory device
    • 低电压读取共源共栅,适用于2V / 3V和不同的组合组合,无需金属选项,可同时操作闪存器件
    • US06359808B1
    • 2002-03-19
    • US09421985
    • 1999-10-19
    • Tien-Min ChenKazuhiro KuriharaTakao Akaogi
    • Tien-Min ChenKazuhiro KuriharaTakao Akaogi
    • G11C1606
    • G11C16/26
    • A pre-amplifier portion of a sense amplifier for a dual bank architecture simultaneous operation flash memory device is provided. The sense pre-amplifier circuit includes two inverting amplifiers, the second inverting amplifier providing a feedback loop for the first inverting amplifier. In addition, special “kicker” circuitry raises the sense pre-amplifier's input signal line to its operating level. The combination of inverting amplifiers, feedback loop and level raising circuitry is configured to provide higher bandwidths for the sense pre-amplifier to accommodate low capacitive loading resulting from a small memory bank. The combination is also configured to provide faster raising of the input signal line to operating level to accommodate high capacitive loading resulting from a large memory bank. The combination is also configured to provide increased signal margins at the output of the sense pre-amplifier.
    • 提供了用于双存储体架构同时操作闪速存储器件的读出放大器的前置放大器部分。 感测预放大器电路包括两个反相放大器,第二反相放大器为第一反相放大器提供反馈回路。 另外,特殊的“咔icker”电路将感应前置放大器的输入信号线提升到其工作电平。 反相放大器,反馈回路和电平提升电路的组合被配置为为感测前置放大器提供更高的带宽以适应由小存储器组成的低容性负载。 该组合还被配置为将输入信号线更快地提升到操作电平以适应由大存储器组造成的高容性负载。 该组合还被配置为在感测前置放大器的输出处提供增加的信号余量。
    • 10. 发明授权
    • Power interconnect structure for balanced bitline capacitance in a memory array
    • 用于存储器阵列中平衡位线电容的功率互连结构
    • US07227768B2
    • 2007-06-05
    • US11173930
    • 2005-07-01
    • Takao Akaogi
    • Takao Akaogi
    • G11C5/06
    • H01L23/5286H01L23/5222H01L27/105H01L2924/0002H01L2924/00
    • According to one exemplary embodiment, a semiconductor die includes a memory core array situated over a substrate, where the memory core array includes a number of bitlines, where the bitlines can be situated in a first interconnect metal layer in the semiconductor die. The semiconductor die further includes an interconnect structure situated over the memory core array, where the interconnect structure is situated in a second interconnect metal layer in the semiconductor die and situated over each of the bitlines. The interconnect structure can include at least one interconnect line, which can form an angle with respect to the bitlines that can be greater than 0.0 degrees and less than or equal to 90.0 degrees. The interconnect structure can form one of a number of capacitances with each of the bitlines, where each of the capacitances can be substantially equal in value to each other of the capacitances.
    • 根据一个示例性实施例,半导体管芯包括位于衬底上的存储器芯阵列,其中存储器芯阵列包括多个位线,其中位线可以位于半导体管芯中的第一互连金属层中。 半导体管芯还包括位于存储器芯阵列上方的互连结构,其中互连结构位于半导体管芯中的第二互连金属层中并且位于每个位线上。 互连结构可以包括至少一个互连线,其可以相对于位线形成可以大于0.0度且小于或等于90.0度的角度。 互连结构可以形成与每个位线的多个电容中的一个,其中每个电容可以在电容中彼此的值基本相等。