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    • 4. 发明授权
    • Semiconductor device applied to composite insulative film manufacturing method thereof
    • 半导体装置应用于复合绝缘膜的制造方法
    • US06171977B2
    • 2001-01-09
    • US08777098
    • 1996-12-30
    • Yoshio KasaiTakashi SuzukiTakanori TsudaYuuichi MikataHiroshi AkahoriAkihito Yamamoto
    • Yoshio KasaiTakashi SuzukiTakanori TsudaYuuichi MikataHiroshi AkahoriAkihito Yamamoto
    • H01L2131
    • H01L29/66181H01L21/28167H01L21/3185
    • A semiconductor wafer having an impurity diffusion layer formed in an inner surface of a trench is cleaned. The semiconductor wafer is inserted into a furnace, and NH3 gas is introduced into the furnace in the low-pressure condition to create an atmosphere in which the temperature is set at 800° C. to 1200° C. and the partial pressures of H2O and O2 are set at 1×10−4 Torr or less. A natural oxide film formed on the inner surface of the trench is removed, and substantially at the same time, a thermal nitride film is formed on the impurity diffusion layer. Then, a CVD silicon nitride film is formed on the thermal nitride film without exposing the thermal nitride film to the outside air in the same furnace. Next, a silicon oxide film is formed on the CVD nitride film. As a result, a composite insulative film formed of the thermal nitride film, CVD silicon nitride film and silicon oxide film is obtained. Then, an electrode for the composite insulative film is formed in the trench.
    • 清洁在沟槽的内表面形成有杂质扩散层的半导体晶片。 将半导体晶片插入炉中,并将NH 3气体在低压条件下引入炉中以产生温度设定在800℃至1200℃的气氛,并且将H 2 O和 O2设定在1×10-4乇或更低。 去除形成在沟槽内表面上的自然氧化膜,并且基本上同时在杂质扩散层上形成氮化氮膜。 然后,在氮化硅膜上形成CVD氮化硅膜,而不会在同一炉内将氮化氮膜暴露于外部空气。 接着,在CVD氮化膜上形成氧化硅膜。 结果,得到由氮化物膜,CVD氮化硅膜和氧化硅膜形成的复合绝缘膜。 然后,在沟槽中形成用于复合绝缘膜的电极。