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1. 发明授权

US08409884B2 Process for producing organic electroluminescent panel 失效
标题翻译：制备有机电致发光面板的方法
公开(公告)号：US08409884B2
公开(公告)日：2013-04-02
申请号：US13003269
申请日：2009-06-30
申请人： Takamasa Hirayama , Akihisa Murata , Yukio Arimitsu , Takashi Yamaoka , Masaaki Sato
发明人： Takamasa Hirayama , Akihisa Murata , Yukio Arimitsu , Takashi Yamaoka , Masaaki Sato
IPC分类号： H01L51/50 , C09J5/06 , C09J7/02
CPC分类号： H01L51/50 , C08K7/22 , C09J5/06 , C09J7/38 , C09J2201/128 , C09J2205/102 , C09J2205/11 , C09J2205/302 , H01L51/001 , H01L51/0096 , H01L2227/326 , Y10T156/1163 , Y10T156/1195
摘要： The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.
摘要翻译：根据本发明的有机EL面板的制造方法是通过真空蒸镀法在超薄玻璃板上形成有机电致发光元件来制造有机电致发光面板的方法，包括在超薄玻璃板上形成电极，通过暂时固定超薄玻璃板通过双面胶带连接到支撑板上，该双面胶带具有形成在基材层的至少一个表面上的热分解粘合剂层，该热剥离粘合剂层含有在高于所述基材层的温度下开始膨胀和/或发泡的热膨胀性微球真空沉积温度。

2. 发明申请

US20110124136A1 PROCESS FOR PRODUCING ORGANIC ELECTROLUMINESCENT PANEL 失效
标题翻译：生产有机电致发光面板的方法
公开(公告)号：US20110124136A1
公开(公告)日：2011-05-26
申请号：US13003269
申请日：2009-06-30
申请人： Takamasa Hirayama , Akihisa Murata , Yukio Arimitsu , Takashi Yamaoka , Masaaki Sato
发明人： Takamasa Hirayama , Akihisa Murata , Yukio Arimitsu , Takashi Yamaoka , Masaaki Sato
IPC分类号： H01L33/00
CPC分类号： H01L51/50 , C08K7/22 , C09J5/06 , C09J7/38 , C09J2201/128 , C09J2205/102 , C09J2205/11 , C09J2205/302 , H01L51/001 , H01L51/0096 , H01L2227/326 , Y10T156/1163 , Y10T156/1195
摘要： Provided is a process for producing an organic EL panel by using an ultrathin glass plate, in which the ultrathin glass plate is not “fractured” or “cut” in the production process, the organic EL element is formed reliably when formed by vacuum deposition, and recovered without damage after the production process, and there is no need for installing an additional step of cleaning the rear face of the ultrathin glass plate. The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, comprising forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.
摘要翻译：本发明提供一种通过使用超薄玻璃板在生产过程中不“断裂”或“切割”的超薄玻璃板制造有机EL面板的方法，当通过真空沉积形成时可靠地形成有机EL元件，并且在生产过程之后没有损坏地恢复，并且不需要安装清洁超薄玻璃板的后表面的附加步骤。根据本发明的有机EL面板的制造方法是通过真空蒸镀法在超薄玻璃板上形成有机电致发光元件来制造有机电致发光面板的方法，其特征在于，在所述超薄玻璃板上，通过临时固定超薄玻璃板通过双面胶带连接到支撑板上，该双面胶带具有形成在基材层的至少一个表面上的热分解粘合剂层，该热剥离粘合剂层含有在高于所述基材层的温度下开始膨胀和/或发泡的热膨胀性微球真空沉积温度。

3. 发明授权

US08524361B2 Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet 有权
标题翻译：用于切割层叠陶瓷片的热剥离性压敏粘合片和切割层压陶瓷片的方法
公开(公告)号：US08524361B2
公开(公告)日：2013-09-03
申请号：US12716306
申请日：2010-03-03
申请人： Kazuki Soejima , Takamasa Hirayama , Daisuke Shimokawa , Masaaki Sato , Yukio Arimitsu
发明人： Kazuki Soejima , Takamasa Hirayama , Daisuke Shimokawa , Masaaki Sato , Yukio Arimitsu
IPC分类号： B32B7/12 , B32B15/04
CPC分类号： H01G4/12 , C09J7/22 , C09J7/38 , C09J2205/302 , C09J2433/00 , C09J2467/006 , H01G4/308 , Y10T156/1052 , Y10T428/14 , Y10T428/266 , Y10T428/28 , Y10T428/2813 , Y10T428/2852 , Y10T428/31504
摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.
摘要翻译：本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成在基材的至少一个表面上，含有压敏粘合剂和发泡剂的热膨胀性压敏粘合剂层，其中热膨胀性压敏粘合剂层的凝胶分数为50重量％以上，热膨胀性粘合剂层的玻璃化转变温度为-40℃〜30℃。

4. 发明申请

US20100028669A1 RE-RELEASABLE ADHESIVE AGENT AND RE-RELEASABLE ADHESIVE SHEET 审中-公开
标题翻译：可再发胶粘剂和可再发胶粘胶板
公开(公告)号：US20100028669A1
公开(公告)日：2010-02-04
申请号：US12509742
申请日：2009-07-27
申请人： Takashi HABU , Tomokazu Takahashi , Fumiteru Asai , Takamasa Hirayama
发明人： Takashi HABU , Tomokazu Takahashi , Fumiteru Asai , Takamasa Hirayama
IPC分类号： B32B27/30 , C08J3/28
CPC分类号： C09J133/066 , C08L2312/06 , Y10T428/2809
摘要： A re-releasable adhesive agent comprises a radiation-reactive polymer and a radiation polymerization initiator, the radiation-reactive polymer has a side chain derived from at least one monomer expressed by the formula (1): CH2═CR1COOR2 (1), where R1 is a hydrogen atom or a methyl group, and R2 is a C6 or higher alkyl group, and a side chain having one carbon-carbon double bond, and the monomer of formula (1) is contained in a ratio of less than 50 mol % with respect to the total monomer constituting the main chain of the radiation-reactive polymer.
摘要翻译：可再释放的粘合剂包括辐射反应性聚合物和辐射聚合引发剂，辐射反应性聚合物具有衍生自由式（1）表示的至少一种单体的侧链：CH2-CR1COOR2（1），其中R1 是氢原子或甲基，R2是C6或更高级的烷基，具有一个碳 - 碳双键的侧链和式（1）的单体的含量小于50摩尔％相对于构成辐射反应性聚合物主链的总单体。

5. 发明申请

US20140044957A1 PRODUCTION METHOD FOR ELECTRONIC COMPONENT AND PRESSURE-SENSITIVE ADHESIVE SHEET TO BE USED IN THE PRODUCTION METHOD 审中-公开
标题翻译：用于生产方法的电子元件和压敏粘合片的生产方法
公开(公告)号：US20140044957A1
公开(公告)日：2014-02-13
申请号：US14113254
申请日：2012-07-06
申请人： Takamasa Hirayama , Daisuke Shimokawa
发明人： Takamasa Hirayama , Daisuke Shimokawa
IPC分类号： C09J7/02
CPC分类号： C09J7/38 , C09J2201/134 , C09J2201/36 , C09J2203/326 , C09J2205/11 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/68 , H01L23/293 , H01L23/3114 , H01L24/97 , H01L2924/0002 , Y10T428/254 , H01L2924/00012
摘要： A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.The production method of the present invention includes: attaching a pressure-sensitive adhesive sheet to a substrate, the pressure-sensitive adhesive sheet including a base, a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microspheres provided on one surface of the base, and a dielectric layer including a weak pressure-sensitive adhesive layer and an adhesive layer provided on another surface of the base in this order from a side of the base, so that the thermally expandable pressure-sensitive adhesive layer is placed on a side of the substrate; attaching and fixing a plurality of chip-shaped electronic components to a surface of the pressure-sensitive adhesive sheet on a side of the adhesive layer so that electrode surfaces of the plurality of chip-shaped electronic components are placed on the side of the adhesive layer; covering an entire surface of the plurality of chip-shaped electronic components excluding fixed surfaces with a protective substance to obtain an encapsulated body including the plurality of chip-shaped electronic components; subjecting the pressure-sensitive adhesive sheet to heating treatment to cause the thermally expandable microspheres in the thermally expandable pressure-sensitive adhesive layer to expand to decrease an adhesion of the thermally expandable pressure-sensitive adhesive layer and peeling the thermally expandable pressure-sensitive adhesive layer from the substrate; peeling the weak pressure-sensitive adhesive layer from the adhesive layer to obtain a laminate of the adhesive layer and the encapsulated body; and cutting the laminate between the plurality of chip-shaped electronic components to separate individual chip-shaped electronic components.
摘要翻译：提供了诸如半导体芯片的芯片形电子部件的简化制造方法。本发明的制造方法包括：将压敏粘合片粘贴在基材上，所述粘合片包括基材，含有设置在基材的一个表面上的可热膨胀性微球的热膨胀性压敏粘合剂层，以及包含弱压敏粘合剂层和介电层的介电层，该介电层从基体的一侧依次设置在基体的另一个表面上，使得可热膨胀的压敏粘合剂层位于基底的一侧基质; 将多个芯片状电子部件附着并固定在粘合剂层一侧的粘合片的表面，使得多个芯片状电子部件的电极表面位于粘合层的一侧 ; 用保护物质覆盖除了固定表面的多个芯片形电子部件的整个表面，以获得包括多个芯片形电子部件的封装体; 对压敏粘合片进行加热处理，使热膨胀性压敏粘合剂层中的热膨胀性微球膨胀，降低热膨胀性粘合剂层的粘合性，剥离热膨胀性粘合剂层从底物; 从粘合剂层剥离弱粘合剂层，得到粘合剂层和包封体的层压体; 并且切割多个芯片形电子部件之间的层压体以分离各个芯片形电子部件。

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