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1. 发明授权

US08524361B2 Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet 有权
标题翻译：用于切割层叠陶瓷片的热剥离性压敏粘合片和切割层压陶瓷片的方法
公开(公告)号：US08524361B2
公开(公告)日：2013-09-03
申请号：US12716306
申请日：2010-03-03
申请人： Kazuki Soejima , Takamasa Hirayama , Daisuke Shimokawa , Masaaki Sato , Yukio Arimitsu
发明人： Kazuki Soejima , Takamasa Hirayama , Daisuke Shimokawa , Masaaki Sato , Yukio Arimitsu
IPC分类号： B32B7/12 , B32B15/04
CPC分类号： H01G4/12 , C09J7/22 , C09J7/38 , C09J2205/302 , C09J2433/00 , C09J2467/006 , H01G4/308 , Y10T156/1052 , Y10T428/14 , Y10T428/266 , Y10T428/28 , Y10T428/2813 , Y10T428/2852 , Y10T428/31504
摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.
摘要翻译：本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成在基材的至少一个表面上，含有压敏粘合剂和发泡剂的热膨胀性压敏粘合剂层，其中热膨胀性压敏粘合剂层的凝胶分数为50重量％以上，热膨胀性粘合剂层的玻璃化转变温度为-40℃〜30℃。

2. 发明申请

US20140044957A1 PRODUCTION METHOD FOR ELECTRONIC COMPONENT AND PRESSURE-SENSITIVE ADHESIVE SHEET TO BE USED IN THE PRODUCTION METHOD 审中-公开
标题翻译：用于生产方法的电子元件和压敏粘合片的生产方法
公开(公告)号：US20140044957A1
公开(公告)日：2014-02-13
申请号：US14113254
申请日：2012-07-06
申请人： Takamasa Hirayama , Daisuke Shimokawa
发明人： Takamasa Hirayama , Daisuke Shimokawa
IPC分类号： C09J7/02
CPC分类号： C09J7/38 , C09J2201/134 , C09J2201/36 , C09J2203/326 , C09J2205/11 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/68 , H01L23/293 , H01L23/3114 , H01L24/97 , H01L2924/0002 , Y10T428/254 , H01L2924/00012
摘要： A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.The production method of the present invention includes: attaching a pressure-sensitive adhesive sheet to a substrate, the pressure-sensitive adhesive sheet including a base, a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microspheres provided on one surface of the base, and a dielectric layer including a weak pressure-sensitive adhesive layer and an adhesive layer provided on another surface of the base in this order from a side of the base, so that the thermally expandable pressure-sensitive adhesive layer is placed on a side of the substrate; attaching and fixing a plurality of chip-shaped electronic components to a surface of the pressure-sensitive adhesive sheet on a side of the adhesive layer so that electrode surfaces of the plurality of chip-shaped electronic components are placed on the side of the adhesive layer; covering an entire surface of the plurality of chip-shaped electronic components excluding fixed surfaces with a protective substance to obtain an encapsulated body including the plurality of chip-shaped electronic components; subjecting the pressure-sensitive adhesive sheet to heating treatment to cause the thermally expandable microspheres in the thermally expandable pressure-sensitive adhesive layer to expand to decrease an adhesion of the thermally expandable pressure-sensitive adhesive layer and peeling the thermally expandable pressure-sensitive adhesive layer from the substrate; peeling the weak pressure-sensitive adhesive layer from the adhesive layer to obtain a laminate of the adhesive layer and the encapsulated body; and cutting the laminate between the plurality of chip-shaped electronic components to separate individual chip-shaped electronic components.
摘要翻译：提供了诸如半导体芯片的芯片形电子部件的简化制造方法。本发明的制造方法包括：将压敏粘合片粘贴在基材上，所述粘合片包括基材，含有设置在基材的一个表面上的可热膨胀性微球的热膨胀性压敏粘合剂层，以及包含弱压敏粘合剂层和介电层的介电层，该介电层从基体的一侧依次设置在基体的另一个表面上，使得可热膨胀的压敏粘合剂层位于基底的一侧基质; 将多个芯片状电子部件附着并固定在粘合剂层一侧的粘合片的表面，使得多个芯片状电子部件的电极表面位于粘合层的一侧 ; 用保护物质覆盖除了固定表面的多个芯片形电子部件的整个表面，以获得包括多个芯片形电子部件的封装体; 对压敏粘合片进行加热处理，使热膨胀性压敏粘合剂层中的热膨胀性微球膨胀，降低热膨胀性粘合剂层的粘合性，剥离热膨胀性粘合剂层从底物; 从粘合剂层剥离弱粘合剂层，得到粘合剂层和包封体的层压体; 并且切割多个芯片形电子部件之间的层压体以分离各个芯片形电子部件。

3. 发明申请

US20110200744A1 ADHESIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND METHOD OF CUTTING MULTILAYERED CERAMIC SHEET 审中-公开
标题翻译：粘合片及其制造方法以及切割多层陶瓷片的方法
公开(公告)号：US20110200744A1
公开(公告)日：2011-08-18
申请号：US13093940
申请日：2011-04-26
申请人： Takamasa HIRAYAMA , Kazuyuki Kiuchi , Masaaki Sato , Yukio Arimitsu , Daisuke Shimokawa , Tomoko Kishimoto
发明人： Takamasa HIRAYAMA , Kazuyuki Kiuchi , Masaaki Sato , Yukio Arimitsu , Daisuke Shimokawa , Tomoko Kishimoto
IPC分类号： B05D5/10 , B05D1/12
CPC分类号： H01L21/6836 , C08K7/22 , C09J7/29 , C09J7/385 , C09J2201/162 , C09J2203/326 , C09J2205/106 , C09J2205/11 , C09J2433/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2924/19041 , H01L2924/30105 , Y10T83/0405 , Y10T428/25
摘要： The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
摘要翻译：本发明涉及一种粘合片，其包括基材和包含热膨胀性微球的粘合层，所述粘合层设置在所述基材的至少一侧，所述粘合层的厚度为10〜38μm，并且其中所述热膨胀性微球具有等于或小于所述粘着层的厚度的最大粒径，并且具有5至30μm的模式直径。本发明的粘合片能够在小型陶瓷电容器等电子部件的加工工序中进行高精度加工，从而大大提高产品特性和生产率。

4. 发明申请

US20110111563A1 ADHESIVE TAPE FOR RESIN-ENCAPSULATING AND METHOD OF MANUFACTURE OF RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于树脂封装的粘合带和树脂封装半导体器件的制造方法
公开(公告)号：US20110111563A1
公开(公告)日：2011-05-12
申请号：US12944459
申请日：2010-11-11
申请人： Yuichiro YANAGI , Hiroyuki Kondo , Shinji Hoshino , Daisuke Shimokawa
发明人： Yuichiro YANAGI , Hiroyuki Kondo , Shinji Hoshino , Daisuke Shimokawa
IPC分类号： H01L21/56 , C09J7/02 , B32B33/00
CPC分类号： H01L23/3107 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2221/68345 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15747 , H01L2924/181 , H01L2924/20105 , H01L2924/20106 , Y10T428/1476 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： An adhesive tape for resin-encapsulating used in a method of manufacture of a resin-encapsulated semiconductor device has a base material layer and an adhesive agent layer laminated on the base material layer, a total film thickness of the base material layer and the adhesive agent layer of 25 to 40 μm. According to the adhesive tape for resin encapsulating of the present invention, resin leakage can be efficiently prevented during the resin encapsulating operation.
摘要翻译：用于制造树脂封装的半导体器件的方法中的用于树脂封装的胶带具有层叠在基材层上的基材层和粘合剂层，基材层和粘合剂的总膜厚度 25〜40μm。根据本发明的树脂封装用胶带，能够在树脂封装动作中有效地防止树脂的泄漏。

5. 发明授权

US07635516B2 Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet 失效
标题翻译：热剥离性粘合片和使用该热剥离性粘合片加工被粘物的方法
公开(公告)号：US07635516B2
公开(公告)日：2009-12-22
申请号：US10591940
申请日：2005-02-18
申请人： Yukio Arimitsu , Daisuke Shimokawa
发明人： Yukio Arimitsu , Daisuke Shimokawa
IPC分类号： B32B7/12 , B32B15/04 , C08J9/16 , H01L21/00
CPC分类号： H01L21/6835 , C09J5/08 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2205/302 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2924/19041 , H01L2924/30105 , H05K3/0058 , Y10T428/249984 , Y10T428/26 , Y10T428/28 , Y10T428/2813 , Y10T428/2848
摘要： Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer caused by pressurization, further reduce chipping in grinding and cutting processes, be easily peeled off from a processed article after processing, and can be easily applied to an adhered at ordinary temperature. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate, the heat-expandable pressure-sensitive adhesive layer containing a foaming agent and having a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The adhesive sheet further includes a pressure-sensitive adhesive layer being arranged on or above heat-expandable pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a shear modulus (23° C.) of less than 7×106 Pa and a thickness of 0.01 to 10 μm.
摘要翻译：公开了一种可以防止由加压引起的压敏粘合剂层的变形的热剥离性粘合片，进一步减少研磨和切割过程中的碎屑，在加工后容易从加工品中剥离，并且可以容易在普通温度下施加于粘附物。热剥离性粘合片包括基材和布置在基材的至少一侧上方的热膨胀性压敏粘合剂层，所述热膨胀性压敏粘合剂层含有发泡剂，并且具有在7×10 6 Pa以上的未发泡状态下的剪切模量（23℃）。粘合片还包括布置在热膨胀压敏粘合剂层上或上方的压敏粘合剂层，其中压敏粘合剂层的剪切模量（23℃）小于7×10 6 Pa，厚度为0.01〜10um。

6. 发明申请

US20080160293A1 Heat-Peelable Pressure-Sensitive Adhesive Sheet and Method for Processing Adherend Using the Heat-Peelable Pressure-Sensitive Adhesive Sheet 失效
标题翻译：热剥离性压敏粘合片和使用热剥离性压敏粘合片加工被粘物的方法
公开(公告)号：US20080160293A1
公开(公告)日：2008-07-03
申请号：US10591940
申请日：2005-02-18
申请人： Yukio Arimitsu , Daisuke Shimokawa
发明人： Yukio Arimitsu , Daisuke Shimokawa
IPC分类号： B32B5/18 , B32B37/12
CPC分类号： H01L21/6835 , C09J5/08 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2205/302 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2924/19041 , H01L2924/30105 , H05K3/0058 , Y10T428/249984 , Y10T428/26 , Y10T428/28 , Y10T428/2813 , Y10T428/2848
摘要： Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer caused by pressurization, further reduce chipping in grinding and cutting processes, be easily peeled off from a processed article after processing, and can be easily applied to an adhered at ordinary temperature.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate, the heat-expandable pressure-sensitive adhesive layer containing a foaming agent and having a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The adhesive sheet further includes a pressure-sensitive adhesive layer being arranged on or above the heat-expandable pressure-sensitive adhesive layer and having a shear modulus (23° C.) of less than 7×106 Pa. The pressure-sensitive adhesive layer arranged on the heat-expandable pressure-sensitive adhesive layer preferably has a thickness of 0.01 to 10 μm.
摘要翻译：公开了一种可以防止由加压引起的压敏粘合剂层的变形的热剥离性粘合片，进一步减少研磨和切割过程中的碎屑，在加工后容易从加工品中剥离，并且可以容易在普通温度下施加于粘附物。热剥离性粘合片包括基材和布置在基材的至少一侧上方的热膨胀性压敏粘合剂层，所述热膨胀性压敏粘合剂层含有发泡剂，并且具有在7×10 -6 Pa以上的未发泡状态下的剪切模量（23℃）。粘合片还包括压敏粘合剂层，其设置在热膨胀性压敏粘合剂层上或上方，并且具有小于7×10 6 Pa的剪切模量（23℃）。布置在热膨胀性压敏粘合剂层上的压敏粘合剂层的厚度优选为0.01〜10μm。

7. 发明申请

US20050236107A1 Method of thermal adherend release and apparatus for thermal adherend release 审中-公开
标题翻译：热粘合剂释放方法和热粘贴层释放装置
公开(公告)号：US20050236107A1
公开(公告)日：2005-10-27
申请号：US11108778
申请日：2005-04-19
申请人： Tomoko Doi , Masakazu Tanimoto , Yukio Arimitsu , Daisuke Shimokawa , Michirou Kawanishi
发明人： Tomoko Doi , Masakazu Tanimoto , Yukio Arimitsu , Daisuke Shimokawa , Michirou Kawanishi
IPC分类号： C09J5/00 , C09J7/02 , C09J11/00 , H01L21/00 , H01L21/301 , H01L21/52 , H01L21/68 , B32B1/00
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2205/302 , H01L21/6836 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2221/68381 , H01L2924/19041 , Y10T156/1147 , Y10T156/1153 , Y10T156/1911
摘要： The present invention intends to provide a method of thermal adherend release by which, when part of adherends on a heat-peelable pressure-sensitive adhesive sheet are desired to be thermally released therefrom, the desired part only can be easily and speedily released. A method of thermal adherend release, wherein part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet, wherein the method comprises partly heating the heat-peelable pressure-sensitive adhesive sheet in an atmosphere having a temperature of 50° C. or higher at which the heat-expandable layer does not expand to thereby selectively release the adherends.
摘要翻译：本发明旨在提供一种热粘贴层剥离方法，当热可剥离粘合片上的被粘物的一部分期望被热释放时，所需的部分只能容易且快速地释放。一种热粘贴层剥离方法，其特征在于，粘贴于具有含有发泡剂的热膨胀层的热剥离性粘合片的被粘物部分从所述压敏粘合片中选择性地释放，其特征在于，在可膨胀层不膨胀的温度为50℃以上的气氛中，热剥离性粘合片选择性地剥离被粘物。

8. 发明申请

US20100119757A1 HEAT-PEELABLE DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET 审中-公开
标题翻译：耐高温双面压敏粘合片
公开(公告)号：US20100119757A1
公开(公告)日：2010-05-13
申请号：US12450917
申请日：2008-04-15
申请人： Daisuke Shimokawa , Yukio Arimitsu
发明人： Daisuke Shimokawa , Yukio Arimitsu
IPC分类号： B32B7/06 , C09J7/00 , B32B7/04
CPC分类号： H01G4/308 , C08K3/346 , C09J7/38 , C09J11/04 , C09J2201/134 , C09J2205/102 , C09J2205/11 , H01G4/30 , Y10T156/1052 , Y10T428/1405
摘要： Provided is a heat-peelable double-sided pressure-sensitive adhesive sheet that is advantageously usable in the step of cutting a multilayer ceramic sheet performed in a high-temperature atmosphere. Also provided is a process for the cutting of a multilayer ceramic sheet using the above-mentioned sheet.The heat-peelable double-sided pressure-sensitive adhesive sheet includes a substrate; arranged on one side thereof, a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres; and arranged on the other side, a temporary-fixing pressure-sensitive adhesive layer containing a lipophilic layered clay mineral. The lipophilic layered clay mineral is preferably a layered silicate. The lipophilic layered clay mineral may be present in an amount of 0.1 to 45 parts by weight per 100 parts by weight of a base polymer of a pressure-sensitive adhesive constituting the temporary-fixing pressure-sensitive adhesive layer.
摘要翻译：提供一种可热切剥离的双面粘合片，其有利地用于在高温气氛中进行的多层陶瓷片的切割工序。还提供了使用上述片材切割多层陶瓷片的方法。可热剥离的双面粘合片包括基材; 设置在其一侧，包含热膨胀性微球的热膨胀性压敏粘合剂层; 并且在另一侧上布置有包含亲油层状粘土矿物的临时固定压敏粘合剂层。亲油性层状粘土矿物优选为层状硅酸盐。亲水性层状粘土矿物质可以以每100重量份构成临时定影压敏粘合剂层的压敏粘合剂的基础聚合物计为0.1至45重量份的量存在。

9. 发明授权

US07641760B2 Method of thermal adherend release and apparatus for thermal adherend release 失效
标题翻译：热粘合剂释放方法和热粘贴层释放装置
公开(公告)号：US07641760B2
公开(公告)日：2010-01-05
申请号：US11296323
申请日：2005-12-08
申请人： Tomoko Doi , Daisuke Shimokawa , Yukio Arimitsu
发明人： Tomoko Doi , Daisuke Shimokawa , Yukio Arimitsu
IPC分类号： B32B38/10
CPC分类号： H01L21/6836 , B29C63/0013 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2205/302 , H01L2221/68327 , H01L2924/19041 , Y10S438/976 , Y10T156/1147 , Y10T156/1153 , Y10T156/1911
摘要： A method of thermal adherend release, wherein a part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet by partly heating the heat-peelable pressure-sensitive adhesive sheet, wherein the method comprises previously heating a sticking site of an adherend to be released at a temperature at which the heat-expandable layer of the heat-peelable pressure-sensitive adhesive sheet does not expand and then heating the sticking site of the adherend in the heat-peelable pressure-sensitive adhesive sheet at a temperature at which the heat-expandable layer expands to thereby selectively releasing the adherend.
摘要翻译：一种热粘贴体的剥离方法，其特征在于，将具有含有发泡剂的具有热膨胀层的热剥离性粘合片附着的被粘附物的一部分从所述压敏粘合片选择性地释放，压敏粘合片，其中，所述方法包括在所述可热剥离性粘合片的热膨胀层未膨胀的温度下预先加热待剥离的被粘物的粘贴部位，然后加热所述粘贴部位在热膨胀层膨胀的温度下，在热剥离粘合片中的被粘物，从而选择性地释放被粘物。

10. 发明申请

US20130330546A1 HEAT-PEELABLE ADHESIVE SHEET 审中-公开
标题翻译：热粘胶布
公开(公告)号：US20130330546A1
公开(公告)日：2013-12-12
申请号：US13810342
申请日：2012-03-01
申请人： Yoshihito Takami , Daisuke Shimokawa , Akihisa Murata
发明人： Yoshihito Takami , Daisuke Shimokawa , Akihisa Murata
IPC分类号： C09J7/02
CPC分类号： C09J7/38 , B32B7/12 , B32B27/20 , B32B27/308 , B32B2457/00 , C08K3/013 , C08K5/0041 , C08K9/10 , C09J5/06 , C09J7/22 , C09J7/29 , C09J2203/326 , C09J2205/102 , C09J2205/106 , C09J2205/11 , C09J2205/302 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2924/00013 , Y10T428/28 , Y10T428/2848 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： A heat-peelable adhesive sheet is provided which includes a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and the coloring agent and that is provided on one side or both sides of the substrate, or a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and is provided on one side or both sides of the substrate through a colored intermediate layer, and which has a total light transmittance of 50% or more.
摘要翻译：提供了一种可热剥离的粘合片，其包括热膨胀性压敏粘合剂层，其包含热膨胀性微球和着色剂，并且设置在基底的一侧或两侧，或热膨胀型压敏粘合剂层其含有热膨胀性微球，并通过有色中间层设置在基板的一侧或两侧，并且其总透光率为50％以上。

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