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    • 10. 发明申请
    • Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material
    • 低粘合材料,树脂成型模具和抗土材料
    • US20090107361A1
    • 2009-04-30
    • US11988802
    • 2006-12-27
    • Takaki KunoYoshinori NoguchiKeiji MaedaSatoshi KitaokaNaoki Kawashima
    • Takaki KunoYoshinori NoguchiKeiji MaedaSatoshi KitaokaNaoki Kawashima
    • C09D1/00
    • B29C33/38B29C33/56C04B37/001C04B2237/34C04B2237/348
    • An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).
    • 上模具(1)具有构成空腔(4)的内底面(5)的空腔构件(6)和周围构件(7)。 空腔构件(6)由根据本发明的低粘合材料形成,并且包括主体部分(8)和形成在主体部分(8)的下表面(9)上的表面层(10) 流体树脂。 主体部分(8)由3YSZ的第一材料和以预定比例混合的ZrN的第二材料形成。 表面层(10)由相对于固化树脂具有低粘合性的Y 2 O 3形成,并且具有比体部(8)的热膨胀系数小的热膨胀系数。 通过在高温下接合主体部分(8)和表面层(10),然后将其冷却,由于其热膨胀系数的差异,在表面层(10)中引起压缩残余应力, 压缩残余应力存在于表面层(10)中。