专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120076886A1 METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND MOLD FOR MOLDING RESIN 审中-公开
标题翻译：评估粘合性能，低粘合材料和模塑树脂模具的方法
公开(公告)号：US20120076886A1
公开(公告)日：2012-03-29
申请号：US13307768
申请日：2011-11-30
申请人： Takaki KUNO , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
发明人： Takaki KUNO , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
IPC分类号： B29C33/56
CPC分类号： B29C33/38 , B29C33/56 , G01N19/04 , H01L2224/48091 , Y10T428/2839 , H01L2924/00014
摘要： A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：流体树脂与其接触的上模具（1）的模具表面（6）在其中具有氧化物（3）。氧化物（3）含有金属阳离子和离子。基于金属阳离子的价数和离子的离子半径计算场强。基于在强度值和固化树脂与模具表面（6）之间的粘合强度之间建立的预定关系，评估了固化树脂和模具表面（6）之间的脱模性。由此，建立了评价固化树脂与模具表面（6）之间的脱模性的方法。通过该评价方法，可以容易地提供具有高脱模性（3）的材料。此外，如果将具有高脱模性（3）的材料用于上模（1）的模具表面（6），则可以获得用于模制具有优异的剥离性的树脂的模具。

2. 发明授权

US07784764B2 Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material 有权
标题翻译：低粘合性材料，使用其的树脂成型用模具和防污染防止材料
公开(公告)号：US07784764B2
公开(公告)日：2010-08-31
申请号：US11262897
申请日：2005-11-01
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
IPC分类号： B29C33/38 , B32B3/24
CPC分类号： B29C33/60 , B29C33/56 , B29C45/02 , B29C45/37 , B29C70/72 , Y10T428/12549 , Y10T428/1259
摘要： A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：将含有稀土元素的低粘合材料作为层或膜形成在用于模制树脂的模具的模具表面上。低粘合性材料的主要成分是稀土类化合物，以Y2O3为例。低粘合性材料中的稀土类化合物的含量为40体积％以上。由此，能够得到脱模性优异的树脂成形用模具。

3. 发明授权

US07614293B2 Method of evaluating adhesion property, low-adhesion material, and mold for molding resin 有权
标题翻译：粘合性评价方法，低粘合性材料和树脂成形用模具
公开(公告)号：US07614293B2
公开(公告)日：2009-11-10
申请号：US10571683
申请日：2005-03-03
申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
发明人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
IPC分类号： G01N19/04
CPC分类号： B29C33/38 , B29C33/56 , G01N19/04 , H01L2224/48091 , Y10T428/2839 , H01L2924/00014
摘要： A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：流体树脂与其接触的上模的模具表面具有氧化物。氧化物含有金属阳离子和离子。场强基于金属阳离子的价数和离子的离子半径计算。基于在强度值和固化树脂与模具表面之间的粘合强度之间建立的预定关系，评估固化树脂和模具表面之间的脱模性。由此，建立了评价固化树脂与模具表面之间的剥离性的方法。通过该评价方法，可以容易地提供具有高脱模性的材料。此外，如果将具有高脱模性的材料用于上模的模具表面，则可以获得具有优异的脱模性的树脂模制用模具。

4. 发明申请

US20060286346A1 Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material 失效
标题翻译：导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
公开(公告)号：US20060286346A1
公开(公告)日：2006-12-21
申请号：US10557003
申请日：2005-01-25
申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
发明人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： B32B3/10
CPC分类号： B29C43/18 , B29C33/10 , B29C33/3814 , B29C43/10 , B29C45/14639 , B29C45/345 , B29C2043/3222 , C04B38/02 , C04B2111/00267 , C04B2111/00293 , H01L2224/48091 , H01L2924/181 , Y10T428/24273 , Y10T428/24322 , Y10T428/249953 , Y10T428/249956 , Y10T428/249957 , Y10T428/249969 , Y10T428/249986 , C04B35/00 , H01L2924/00014 , H01L2924/00012
摘要： A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.
摘要翻译：导电性多孔材料包括具有氧化物烧结体的基体，在基体中形成的连通孔，具有小直径并且可透气并且不可渗透气体以外的物质，导电层设置在内壁上连通开口并接收电流以产生热量。作为导电材料，有机物粘附在连通孔的内壁上。为了解决这个问题，导电层产生热分解，从而除去有机物质，从而防止连通开口堵塞。

5. 发明申请

US20060093693A1 Low-adhesion material and mold for molding resin using the same 有权
标题翻译：低粘附性材料和模塑树脂使用它们
公开(公告)号：US20060093693A1
公开(公告)日：2006-05-04
申请号：US11262897
申请日：2005-11-01
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
IPC分类号： B29C70/44
CPC分类号： B29C33/60 , B29C33/56 , B29C45/02 , B29C45/37 , B29C70/72 , Y10T428/12549 , Y10T428/1259
摘要： A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：将含有稀土元素的低粘合材料作为层或膜形成在用于模制树脂的模具的模具表面上。低附着材料的主要成分是稀土类化合物，作为实例使用Y 2 O 3 O 3。低粘合性材料中的稀土类化合物的含量为40体积％以上。由此，能够得到脱模性优异的树脂成形用模具。

6. 发明授权

US07732037B2 Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material 失效
标题翻译：导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
公开(公告)号：US07732037B2
公开(公告)日：2010-06-08
申请号：US10557003
申请日：2005-01-25
申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
发明人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： B32B3/24 , C04B38/02 , B29C33/38
CPC分类号： B29C43/18 , B29C33/10 , B29C33/3814 , B29C43/10 , B29C45/14639 , B29C45/345 , B29C2043/3222 , C04B38/02 , C04B2111/00267 , C04B2111/00293 , H01L2224/48091 , H01L2924/181 , Y10T428/24273 , Y10T428/24322 , Y10T428/249953 , Y10T428/249956 , Y10T428/249957 , Y10T428/249969 , Y10T428/249986 , C04B35/00 , H01L2924/00014 , H01L2924/00012
摘要： A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.
摘要翻译：导电性多孔材料包括具有氧化物烧结体的基体，在基体中形成的连通孔，具有小直径并且可透气并且不可渗透气体以外的物质，导电层设置在内壁上连通开口并接收电流以产生热量。作为导电材料，有机物粘附在连通孔的内壁上。为了解决这个问题，导电层产生热分解，从而除去有机物质，从而防止连通开口堵塞。

7. 发明申请

US20090107361A1 Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material 有权
标题翻译：低粘合材料，树脂成型模具和抗土材料
公开(公告)号：US20090107361A1
公开(公告)日：2009-04-30
申请号：US11988802
申请日：2006-12-27
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： C09D1/00
CPC分类号： B29C33/38 , B29C33/56 , C04B37/001 , C04B2237/34 , C04B2237/348
摘要： An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).
摘要翻译：上模具（1）具有构成空腔（4）的内底面（5）的空腔构件（6）和周围构件（7）。空腔构件（6）由根据本发明的低粘合材料形成，并且包括主体部分（8）和形成在主体部分（8）的下表面（9）上的表面层（10）流体树脂。主体部分（8）由3YSZ的第一材料和以预定比例混合的ZrN的第二材料形成。表面层（10）由相对于固化树脂具有低粘合性的Y 2 O 3形成，并且具有比体部（8）的热膨胀系数小的热膨胀系数。通过在高温下接合主体部分（8）和表面层（10），然后将其冷却，由于其热膨胀系数的差异，在表面层（10）中引起压缩残余应力，压缩残余应力存在于表面层（10）中。

8. 发明申请

US20080213674A1 SECONDARY BATTERY 审中-公开
标题翻译：二次电池
公开(公告)号：US20080213674A1
公开(公告)日：2008-09-04
申请号：US12035486
申请日：2008-02-22
申请人： Shigeto Okada , Plashnitsa Larisa , Eiji Kobayashi , Yoshinori Noguchi , Takayuki Doi , Jun-ichi Yamaki , Toshihiro Yoshida , Kazuhiro Yamamoto , Hiroyuki Katsukawa
发明人： Shigeto Okada , Plashnitsa Larisa , Eiji Kobayashi , Yoshinori Noguchi , Takayuki Doi , Jun-ichi Yamaki , Toshihiro Yoshida , Kazuhiro Yamamoto , Hiroyuki Katsukawa
IPC分类号： H01M10/26 , H01M10/28
CPC分类号： H01M4/5825 , H01M4/136 , H01M10/0525 , H01M10/054 , H01M10/0566 , Y10T29/49108
摘要： The present invention provides a secondary battery using a liquid electrolyte excellent in storage characteristics. The secondary battery includes a cathode, an anode, and a liquid electrolyte, where the cathode and the anode contain at least one mutual active material. This symmetrical electrode configuration, that the at least one active material for the cathode and the anode is mutual, enables equalization of an electrode electric potential difference before charge or after discharge; and thus electrolyte degradation is efficiently restrained to improve storage characteristics.
摘要翻译：本发明提供使用储存特性优异的液体电解质的二次电池。二次电池包括阴极，阳极和液体电解质，其中阴极和阳极包含至少一种相互活性材料。用于阴极和阳极的至少一种活性材料相互的对称电极结构使得能够在充电之前或放电之后均衡电极电位差; 因此有效地抑制电解质降解以改善储存特性。

9. 发明授权

US5308218A Transportation device having an air-foil bearing 失效
标题翻译：具有空气箔轴承的运输装置
公开(公告)号：US5308218A
公开(公告)日：1994-05-03
申请号：US866923
申请日：1992-04-10
申请人： Hisami Kobayashi , Yoshinori Noguchi
发明人： Hisami Kobayashi , Yoshinori Noguchi
IPC分类号： B60V1/00 , B61B13/08 , B62B3/065 , B65G7/06 , B65G25/02
CPC分类号： B62B3/0618 , B65G7/06
摘要： A transportation device for transporting an object comprises a base body, a depression provided on a top surface of the base body, a lifting mechanism provided on the base body in correspondence to the depression and including a lift plate for supporting the object thereon and an air envelope unit supplied with compressed air for causing a dilatation in response thereto, the lift plate being connected to the air envelope unit such that the lift plate is lifted upward upon a supply of the compressed air, and an air foil bearing provided on the base body such that a top surface of the air foil bearing is located at a level above a bottom surface of the base body.
摘要翻译：用于运输物体的运输装置包括基体，设置在基体的顶表面上的凹陷，对应于凹陷设置在基体上的升降机构，并且包括用于在其上支撑物体的升降板和空气提供压缩空气的信封单元，用于响应于此而引起膨胀，提升板连接到空气包壳单元，使得升降板在供应压缩空气时向上提升，并且设置在基体上的空气箔轴承使得所述气翼轴承的顶表面位于所述基体的底表面的上方。

10. 发明申请

US20110042857A1 METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND MOLD FOR MOLDING RESIN 审中-公开
标题翻译：评估粘合性能，低粘合材料和模塑树脂模具的方法
公开(公告)号：US20110042857A1
公开(公告)日：2011-02-24
申请号：US12914371
申请日：2010-10-28
申请人： Takaki KUNO , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
发明人： Takaki KUNO , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
IPC分类号： B28B7/36
CPC分类号： B29C33/38 , B29C33/56 , G01N19/04 , H01L2224/48091 , Y10T428/2839 , H01L2924/00014
摘要： A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：流体树脂与其接触的上模具（1）的模具表面（6）在其中具有氧化物（3）。氧化物（3）含有金属阳离子和离子。基于金属阳离子的价数和离子的离子半径计算场强。基于在强度值和固化树脂与模具表面（6）之间的粘合强度之间建立的预定关系，评估了固化树脂和模具表面（6）之间的脱模性。由此，建立了评价固化树脂与模具表面（6）之间的脱模性的方法。通过该评价方法，可以容易地提供具有高脱模性（3）的材料。此外，如果将具有高脱模性（3）的材料用于上模（1）的模具表面（6），则可以获得用于模制具有优异的剥离性的树脂的模具。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式