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1. 发明授权

US07954534B2 Tape sticking apparatus and sticking method 有权
标题翻译：贴纸装置和贴纸方法
公开(公告)号：US07954534B2
公开(公告)日：2011-06-07
申请号：US12093571
申请日：2006-12-04
申请人： Takahisa Yoshioka , Yoshiaki Sugishita
发明人： Takahisa Yoshioka , Yoshiaki Sugishita
IPC分类号： B32B37/00 , B32B38/10 , B29C65/00
CPC分类号： H01L21/67132 , Y10T156/1064 , Y10T156/1075 , Y10T156/1082 , Y10T156/1085 , Y10T156/12 , Y10T156/1322 , Y10T156/1339 , Y10T156/1707 , Y10T156/1712
摘要： A tape sticking apparatus includes a feed-out device for feeding out a raw sheet in which a strip-shaped tape base material is temporarily stuck on one surface of a strip-shaped release liner. A cutting device is configured to form a closed-loop-shaped cut-line on the tape base material to form a sticking tape. The apparatus further includes a peeling device for peeling the sticking tape from the release liner, and a sticking device for sticking the sticking tape to a workpiece. A collecting device collects the raw sheet after being peeled off the sticking tape by the peeling device.
摘要翻译：胶带粘贴装置包括：送出装置，用于将条形胶带基材临时粘贴在带状剥离衬垫的一个表面上的原料片。切割装置构造成在带基材上形成闭环形切割线以形成粘着带。该装置还包括用于从剥离衬垫剥离粘着带的剥离装置和用于将粘附带粘贴到工件上的粘贴装置。收集装置通过剥离装置从剥离带剥离后收集原料片。

2. 发明授权

US07713368B2 Sheet peeling apparatus and peeling method 有权
标题翻译：薄片剥离装置和剥离方法
公开(公告)号：US07713368B2
公开(公告)日：2010-05-11
申请号：US11779046
申请日：2007-07-17
申请人： Takahisa Yoshioka , Yoshiaki Sugishita
发明人： Takahisa Yoshioka , Yoshiaki Sugishita
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1978
摘要： A sheet S is stuck on the front surface of a wafer W, and the wafer W is supported on a table 20. A peeling tape T is stuck onto a peripheral portion of the sheet S and the peeling tape T is held by a peeling head 13. The peeling head 13 and the table 20 perform a relative movement along guide rails 25, the table 20 rotates a predetermined angle in clockwise and counterclockwise directions alternately via a swing mechanism 21 thereby peeling off the sheet S from the wafer W accompanying a zigzag movement.
摘要翻译：将片材S粘贴在晶片W的前表面上，并将晶片W支撑在工作台20上。剥离带T粘贴在片材S的周边部分上，剥离带T由剥离头剥皮头13和工作台20沿着导轨25进行相对移动，工作台20经由摆动机构21交替地沿顺时针和逆时针方向旋转预定角度，从而从伴随着之字形的晶片W剥离片材S 运动。

3. 发明授权

US07967048B2 Transferring device and transferring method 有权
标题翻译：转移装置和转移方法
公开(公告)号：US07967048B2
公开(公告)日：2011-06-28
申请号：US12111483
申请日：2008-04-29
申请人： Takahisa Yoshioka , Yoshiaki Sugishita
发明人： Takahisa Yoshioka , Yoshiaki Sugishita
IPC分类号： B29C65/48 , B32B37/12 , B32B38/10 , B32B39/00 , B32B37/14 , B32B37/26 , B31F5/06 , B32B37/10 , B65H29/02
CPC分类号： H01L21/67132 , H01L21/67115 , H01L21/67742 , H01L21/67766 , Y10T156/10 , Y10T156/16 , Y10T156/17 , Y10T156/1744
摘要： A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.
摘要翻译：用于在第一台T1，第二台T2和第三台T3中传送诸如半导体晶片等的板状构件的转印装置10。转印装置10包括设置有用于半导体晶片W的支撑面的支撑单元和用于转移支撑单元11的多关节机器人12.支撑面包括粘合剂层S，其中粘合剂层A层压在片材基材SB，并且可以通过在粘合片S和半导体晶片之间的粘贴和剥离操作在台T1至T3之间进行转印。

4. 发明申请

US20090165958A1 TAPE STICKING APPARATUS AND STICKING METHOD 有权
标题翻译：胶带手提装置和方法
公开(公告)号：US20090165958A1
公开(公告)日：2009-07-02
申请号：US12093571
申请日：2006-12-04
申请人： Takahisa Yoshioka , Yoshiaki Sugishita
发明人： Takahisa Yoshioka , Yoshiaki Sugishita
IPC分类号： B32B41/00 , B32B38/04
CPC分类号： H01L21/67132 , Y10T156/1064 , Y10T156/1075 , Y10T156/1082 , Y10T156/1085 , Y10T156/12 , Y10T156/1322 , Y10T156/1339 , Y10T156/1707 , Y10T156/1712
摘要： A raw sheet L, in which a strip-shaped tape base material TB having a die bonding sheet portion DS with a size of substantially corresponding to the shape of a semiconductor wafer W is temporarily stuck to a strip-shaped release liner S, is fed out, and a cut-line detecting device 14 detects whether any cut-line C is already formed on the outer circumference side of the die bonding sheet portion DS, on the pathway of the feeding out. According to the result of detection, the die cutting device 13 lets the raw sheet L pass straight through without forming any cut-line C when the cut-line C is judged to be already formed thereon. On the other hand, the die cutting device 13 forms a cut-line C to form a sticking tape DDT when no cut-line C is detected. The sticking tape DDT is peeled by a peeling device 15 to be stuck to the ring frame RF in the position that the die bonding sheet portion DS is to be corresponding to the semiconductor wafer W.
摘要翻译：将具有基本上对应于半导体晶片W的形状的芯片接合片部分DS的条状带基材TB临时粘贴到条形剥离衬垫S的原料片L被供给并且切断线检测装置14检测在送出的通路上是否在芯片接合片部分DS的外周侧上形成了任何切割线C. 根据检测结果，当切断线C被判断为已经形成在其上时，模切装置13使原料片L直线穿过而不形成任何切割线C. 另一方面，当没有检测到切割线C时，模切装置13形成切割线C以形成粘着带DDT。粘贴带DDT由剥离装置15剥离以粘贴到环形框架RF上，使得芯片接合片部分DS将对应于半导体晶片W.

5. 发明申请

US20090014124A1 Sheet peeling apparatus and peeling method 有权
标题翻译：薄片剥离装置和剥离方法
公开(公告)号：US20090014124A1
公开(公告)日：2009-01-15
申请号：US10577258
申请日：2004-10-21
申请人： Masaki Tsujimoto , Takahisa Yoshioka
发明人： Masaki Tsujimoto , Takahisa Yoshioka
IPC分类号： B65H41/00
CPC分类号： H01L21/67132 , H01L2221/68395 , Y10T156/1168 , Y10T156/195 , Y10T156/1978
摘要： There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units capable of performing peeling off operation under optimum condition in accordance with the material, thickness or the like of a protective sheet. A sheet peeling apparatus 10 for peeling off a sheet S stuck on the surface of a semiconductor wafer W by using an adhesive tape T of a width narrower than that of the sheet S, which is equipped with a peeling head 15 (second peeling unit) for peeling off the sheet S by pulling the adhesive tape T in an obtuse angled direction in a state stuck to the end portion of the sheet; and first and second rollers 21, 22 (first peeling unit) for peeling off the sheet S by pulling the adhesive tape T in the substantially right angle or acute angle direction in a state stuck with the adhesive tape T in the direction across the sheet S. Either one of the peeling units are selectively used in accordance with the type of the sheet S.
摘要翻译：提供了一种片材剥离装置和使用多个剥离装置的剥离装置，该剥离装置能够根据保护片的材料，厚度等在最佳条件下进行剥离操作。通过使用宽度窄于片材S的宽度的粘合带T，剥离粘附在半导体晶片W的表面上的片材S的片材剥离装置10，其具有剥离头15（第二剥离单元）用于通过在粘贴到片材的端部的状态下将胶带T拉成钝角度方向来剥离片材S; 以及第一和第二辊21,22（第一剥离单元），用于通过在粘合带T的状态下沿着片材S的方向拉动粘合带T以大致直角或锐角方向剥离片材S. 根据片材S的类型选择性地使用任一个剥离单元。

6. 发明申请

US20080011412A1 Sheet Peeling Apparatus and Peeling Method 审中-公开
标题翻译：薄片剥皮设备和剥皮方法
公开(公告)号：US20080011412A1
公开(公告)日：2008-01-17
申请号：US11629863
申请日：2005-06-22
申请人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
发明人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
IPC分类号： H01L21/68
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2224/274 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , Y10T156/1978
摘要： A sheet peeling apparatus 50 which, after sticking a web material LS laminated with heat sensitive adhesive type adhesive sheet S on a release liner PS to a semiconductor wafer W, cuts the web material along the periphery of a semiconductor wafer and peels off a release liner PS portion positioned on the semiconductor wafer and a web material portion S1 positioned at the periphery side around the semiconductor wafer. The apparatus is equipped with a roll 135 capable of performing a relative movement with respect to the table 47 supporting the wafer W, and is arranged to stick a peeling tape ST to the web material LS with the roll, and then winds to peel off the tape; thus, only the adhesive sheet S is left on the wafer W.
摘要翻译：在剥离衬垫PS上粘合有热敏粘合型粘合片S的纤维网材料LS粘贴到半导体晶片W之后，将片材材料沿着半导体晶片的周边切割并剥离剥离衬垫位于半导体晶片上的PS部分和位于半导体晶片周围的周边侧的幅材材料部分S1。该装置配备有能够相对于支撑晶片W的工作台47执行相对移动的辊135，并且布置成将剥离带ST粘贴到具有辊的卷材LS上，然后卷绕胶带; 因此，只有粘合片S留在晶片W.

7. 发明申请

US20070227648A1 Sticking Apparatus and Sticking Method 有权
标题翻译：粘贴装置和粘贴方法
公开(公告)号：US20070227648A1
公开(公告)日：2007-10-04
申请号：US11587853
申请日：2005-04-27
申请人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
发明人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
IPC分类号： B29C65/78
CPC分类号： H01L21/67132 , Y10T156/108 , Y10T156/11 , Y10T156/1195 , Y10T156/12 , Y10T156/16 , Y10T156/17 , Y10T156/19 , Y10T156/1994
摘要： A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a Sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.
摘要翻译：粘贴装置10包括支撑半导体晶片W的粘贴台11和将热敏粘合片S粘贴到半导体晶片W的粘贴单元12.粘贴单元12包括：剥离部，当将具有将剥离衬垫PS的一个侧面层合的粘合片S剥离剥离衬垫PS和粘合片S，以及在原料的放出方向上设置在剥离部的上游侧的片材预剥离部40 片。片材预剥离单元40包括在被剥离衬垫PS和粘合片S之间夹持的状态下移动的移动构件50.预先剥离的剥离衬垫PS和粘合片S暂时重新粘合通过临时重新接合单元41，能够将粘合片S粘合在晶片W上。

8. 发明申请

US20070131344A1 Mounting apparatus and mounting method 有权
标题翻译：安装装置及安装方法
公开(公告)号：US20070131344A1
公开(公告)日：2007-06-14
申请号：US10574847
申请日：2004-09-29
申请人： Masaki Tsujimoto , Kenji Kobayashi , Takahisa Yoshioka
发明人： Masaki Tsujimoto , Kenji Kobayashi , Takahisa Yoshioka
IPC分类号： H01L21/301 , B32B37/12 , B32B38/04 , B32B37/00
CPC分类号： H01L21/6836 , H01L21/67132 , H01L2221/68327 , Y10T156/1062 , Y10T156/1075 , Y10T156/1085 , Y10T156/1322 , Y10T156/1339 , Y10T156/1352
摘要： There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer. The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.
摘要翻译：提供一种能够在送出带状材料的过程中形成切割带并将切割带粘贴到环形框架上以固定半导体晶片的安装装置。安装装置10将切割带粘贴到环形框架RF上，以将环形框架RF和半导体晶片W设置在工作台11上的状态将半导体晶片固定到环形框架上。安装装置10包括：切割装置13，用于在条带材料A的膜FL中形成半切状态的切割L，以在送出条带材料A的过程中形成切割条T.以及用于剥离切割带的粘贴装置34 从基片S将切割带粘贴到环形框架RF上。

9. 发明授权

US08196632B2 Mounting apparatus and mounting method 有权
标题翻译：安装装置及安装方法
公开(公告)号：US08196632B2
公开(公告)日：2012-06-12
申请号：US10574847
申请日：2004-09-29
申请人： Masaki Tsujimoto , Kenji Kobayashi , Takahisa Yoshioka
发明人： Masaki Tsujimoto , Kenji Kobayashi , Takahisa Yoshioka
IPC分类号： B29C65/00 , B32B37/00 , B32B38/04 , B32B38/10
CPC分类号： H01L21/6836 , H01L21/67132 , H01L2221/68327 , Y10T156/1062 , Y10T156/1075 , Y10T156/1085 , Y10T156/1322 , Y10T156/1339 , Y10T156/1352
摘要： There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer.The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.
摘要翻译：提供一种能够在送出带状材料的过程中形成切割带并将切割带粘贴到环形框架上以固定半导体晶片的安装装置。安装装置10将切割带粘贴到环形框架RF上，以将环形框架RF和半导体晶片W设置在工作台11上的状态将半导体晶片固定到环形框架上。安装装置10包括：切割装置13，用于在条带材料A的膜FL中形成半切状态的切割L，以在送出条带材料A的过程中形成切割条T.以及用于剥离切割带的粘贴装置34 从基片S将切割带粘贴到环形框架RF上。

10. 发明申请

US20110155328A1 SHEET PEELING APPARATUS AND PEELING METHOD 有权
标题翻译：薄膜剥离装置和剥离方法
公开(公告)号：US20110155328A1
公开(公告)日：2011-06-30
申请号：US13060925
申请日：2009-07-22
申请人： Kenji Kobayashi , Takahisa Yoshioka , Takeshi Takano
发明人： Kenji Kobayashi , Takahisa Yoshioka , Takeshi Takano
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10S156/93 , Y10S156/941 , Y10T156/1105 , Y10T156/1174 , Y10T156/1906 , Y10T156/1978
摘要： A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.
摘要翻译：片剥离装置10包括：支撑装置11，用于支撑粘贴有粘合片S的半导体晶片W; 用于将剥离带T粘贴到粘合片S上的胶带粘贴装置14; 用于拉动剥离带T的拉动装置13; 剥离辅助装置15，其包括定位在粘合片S上的环形构件45，并缠绕在引导构件41上; 以及用于将粘合片S夹在环形构件45和夹持装置16之间的夹持装置16.在片材剥离装置10中，由于拉动装置13和支撑装置的相对运动，粘合片S被剥离在粘合片S夹在剥离辅助装置15和夹持装置16之间的状态下，

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