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1. 发明授权

US08038824B2 Sheet peeling apparatus and peeling method 有权
标题翻译：薄片剥离装置和剥离方法
公开(公告)号：US08038824B2
公开(公告)日：2011-10-18
申请号：US13060925
申请日：2009-07-22
申请人： Kenji Kobayashi , Takahisa Yoshioka , Takeshi Takano
发明人： Kenji Kobayashi , Takahisa Yoshioka , Takeshi Takano
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10S156/93 , Y10S156/941 , Y10T156/1105 , Y10T156/1174 , Y10T156/1906 , Y10T156/1978
摘要： A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.
摘要翻译：片剥离装置10包括：支撑装置11，用于支撑粘贴有粘合片S的半导体晶片W; 用于将剥离带T粘贴到粘合片S上的胶带粘贴装置14; 用于拉动剥离带T的拉动装置13; 剥离辅助装置15，其包括定位在粘合片S上的环形构件45，并缠绕在引导构件41上; 以及夹持装置16，用于将粘合片S夹在环形构件45和夹持装置16之间。在片材剥离装置10中，由于拉动装置13和支撑装置的相对运动，粘合片S被剥离在粘合片S夹在剥离辅助装置15和夹持装置16之间的状态下，

2. 发明申请

US20110198038A1 SHEET PEELING APPARATUS AND PEELING METHOD 审中-公开
标题翻译：薄膜剥离装置和剥离方法
公开(公告)号：US20110198038A1
公开(公告)日：2011-08-18
申请号：US13124939
申请日：2009-10-13
申请人： Takahisa Yoshioka , Takeshi Takano
发明人： Takahisa Yoshioka , Takeshi Takano
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10T156/1712
摘要： A sheet peeling apparatus 10 includes: a holding means 11 for holding a wafer W on which an adhesive sheet S is stuck; a sticking means 16 for sticking a peeling tape PT on the adhesion sheet S; and a peeling means 15 for peeling off the adhesive sheet S from the wafer W through the peeling tape PT. The peeling means 15 has first and second rollers 31, 32 between which the peeling tape PT and the adhesive sheet S may be pinched. The first roller 31 is provided such that a peeled section of the adhesive sheet S and an unpeeled section of the adhesive sheet S are bendable so as to be opposed to each other. The first roller 31 is displaced in a direction toward and away from the wafer W through a displacing means 30, and provided such that the peeling angle α between the peeling tape PT and/or the adhesive sheet S and the wafer W may be adjusted.
摘要翻译：片材剥离装置10包括：保持装置11，用于保持粘合了粘合片S的晶片W; 用于将剥离带PT粘附在粘合片S上的粘贴装置16; 以及用于通过剥离带PT从晶片W剥离粘合片S的剥离装置15。剥离装置15具有第一和第二辊31,32，剥离带PT和粘合片S可夹在其之间。第一辊31被设置成使得粘合片S的剥离部分和粘合片S的未剥离部分可弯曲成彼此相对。第一辊31通过位移装置30朝向和离开晶片W的方向移位，并且设置为可以调节剥离带PT和/或粘合片S和晶片W之间的剥离角α。

3. 发明授权

US07713368B2 Sheet peeling apparatus and peeling method 有权
标题翻译：薄片剥离装置和剥离方法
公开(公告)号：US07713368B2
公开(公告)日：2010-05-11
申请号：US11779046
申请日：2007-07-17
申请人： Takahisa Yoshioka , Yoshiaki Sugishita
发明人： Takahisa Yoshioka , Yoshiaki Sugishita
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1978
摘要： A sheet S is stuck on the front surface of a wafer W, and the wafer W is supported on a table 20. A peeling tape T is stuck onto a peripheral portion of the sheet S and the peeling tape T is held by a peeling head 13. The peeling head 13 and the table 20 perform a relative movement along guide rails 25, the table 20 rotates a predetermined angle in clockwise and counterclockwise directions alternately via a swing mechanism 21 thereby peeling off the sheet S from the wafer W accompanying a zigzag movement.
摘要翻译：将片材S粘贴在晶片W的前表面上，并将晶片W支撑在工作台20上。剥离带T粘贴在片材S的周边部分上，剥离带T由剥离头剥皮头13和工作台20沿着导轨25进行相对移动，工作台20经由摆动机构21交替地沿顺时针和逆时针方向旋转预定角度，从而从伴随着之字形的晶片W剥离片材S 运动。

4. 发明授权

US07611600B2 Sticking apparatus and sticking method 有权
标题翻译：粘贴装置和粘贴方法
公开(公告)号：US07611600B2
公开(公告)日：2009-11-03
申请号：US11587853
申请日：2005-04-27
申请人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
发明人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
IPC分类号： B32B37/26 , B29C65/02 , B29C63/00 , C09J5/06 , B32B38/10 , B32B38/04
CPC分类号： H01L21/67132 , Y10T156/108 , Y10T156/11 , Y10T156/1195 , Y10T156/12 , Y10T156/16 , Y10T156/17 , Y10T156/19 , Y10T156/1994
摘要： A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.
摘要翻译：粘贴装置10包括支撑半导体晶片W的粘贴台11和将热敏粘合片S粘贴到半导体晶片W的粘贴单元12.粘贴单元12包括：剥离部，当将具有将剥离衬垫PS的一个侧面层合的粘合片S剥离剥离衬垫PS和粘合片S，以及在原料的放出方向上设置在剥离部的上游侧的片材预剥离部40 片。片材预剥离单元40包括在被剥离衬垫PS和粘合片S之间夹持的状态下移动的移动构件50.预先剥离的剥离衬垫PS和粘合片S暂时重新粘合通过临时重新接合单元41，能够将粘合片S粘合在晶片W上。

5. 发明申请

US20070169895A1 Suction unit 有权
标题翻译：抽油机
公开(公告)号：US20070169895A1
公开(公告)日：2007-07-26
申请号：US11578990
申请日：2005-04-20
申请人： Kenji Kobayashi , Masaki Tsujimoto , Takahisa Yoshioka
发明人： Kenji Kobayashi , Masaki Tsujimoto , Takahisa Yoshioka
IPC分类号： H01L21/304 , B29C63/00
CPC分类号： H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2924/3025 , Y10T156/1132 , Y10T156/1168 , Y10T156/19 , Y10T156/1944 , Y10T156/1978
摘要： A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.
摘要翻译：晶片W通过环形框架R通过切割带T支撑在其后表面侧，保护带H粘贴在晶片W的正面侧。抽吸单元12包括具有吸力面15在上面。抽吸面15通过执行预定的吸力吸附切割带T以保持晶片W。至少在沿着吸附面15的周边的局部区域中形成有槽24。通过从吸附面15吸引，槽24的内部成为负压，切割带T下沉。

6. 发明授权

US07967048B2 Transferring device and transferring method 有权
标题翻译：转移装置和转移方法
公开(公告)号：US07967048B2
公开(公告)日：2011-06-28
申请号：US12111483
申请日：2008-04-29
申请人： Takahisa Yoshioka , Yoshiaki Sugishita
发明人： Takahisa Yoshioka , Yoshiaki Sugishita
IPC分类号： B29C65/48 , B32B37/12 , B32B38/10 , B32B39/00 , B32B37/14 , B32B37/26 , B31F5/06 , B32B37/10 , B65H29/02
CPC分类号： H01L21/67132 , H01L21/67115 , H01L21/67742 , H01L21/67766 , Y10T156/10 , Y10T156/16 , Y10T156/17 , Y10T156/1744
摘要： A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.
摘要翻译：用于在第一台T1，第二台T2和第三台T3中传送诸如半导体晶片等的板状构件的转印装置10。转印装置10包括设置有用于半导体晶片W的支撑面的支撑单元和用于转移支撑单元11的多关节机器人12.支撑面包括粘合剂层S，其中粘合剂层A层压在片材基材SB，并且可以通过在粘合片S和半导体晶片之间的粘贴和剥离操作在台T1至T3之间进行转印。

7. 发明授权

US07846289B2 Sheet peeling apparatus and sheet peeling method 有权
标题翻译：薄片剥离装置和薄片剥离方法
公开(公告)号：US07846289B2
公开(公告)日：2010-12-07
申请号：US11587854
申请日：2005-04-27
申请人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
发明人： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
IPC分类号： B32B38/10
CPC分类号： H01L21/68714 , B29C63/0013 , H01L21/67092 , H01L21/67132 , H01L2221/6834 , H01L2221/68395 , H01L2224/16 , H01L2924/01004 , H01L2924/01078 , Y10T156/1168 , Y10T156/1174 , Y10T156/195 , Y10T156/1978
摘要： A peeling apparatus 10 includes a peeling table 11 supporting a wafer W on which a sheet S is stuck and a sheet peeling unit 12 disposed above the peeling table 11, in which sheet S can be peeled off with relative movement of the sheet peeling unit 12 and the peeling table 11. The peeling apparatus 10 includes a support roll 20 of peeling tape PT, first and second rolls 30, 31 bonding the peeling tape PT to the sheet S surface, and a winding roll 21 of the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle a1 such that a peeling tape PT is folded in an aperture C formed between the second roll 31 and the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle a2 corresponding to a diameter of the second roll 31.
摘要翻译：剥离装置10包括：支撑粘贴有片材S的晶片W的剥离台11和设置在剥离台11上方的片材剥离单元12，其中片材S可以通过片材剥离单元12的相对运动而被剥离和剥离台11.剥离装置10包括剥离带PT的支撑辊20，将剥离带PT粘合到片材S表面的第一和第二辊30,31以及剥离带PT的卷绕辊21。在形成初始剥离角度a1的状态下执行剥离，使得剥离带PT在形成在第二辊31和片材S之间的孔C中折叠，然后在随后的剥离角度剥离片材S a2对应于第二辊31的直径。

8. 发明申请

US20100096090A1 STICKING APPARATUS 审中-公开
标题翻译：手提装置
公开(公告)号：US20100096090A1
公开(公告)日：2010-04-22
申请号：US11914903
申请日：2006-04-24
申请人： Takahisa Yoshioka , Masaki Tsujimoto , Kenji Kobayashi
发明人： Takahisa Yoshioka , Masaki Tsujimoto , Kenji Kobayashi
IPC分类号： B32B41/00
CPC分类号： B29C63/02 , B29C63/0095 , B29C65/4825 , B29C65/5057 , B29C65/5092 , B29C65/526 , B29C65/7861 , B29C65/7867 , B29C66/1122 , B29C66/452 , B29C66/8223 , B29C66/8242 , B29C66/83411 , B29L2017/005 , B32B37/025 , B32B2457/14 , H01L21/00 , H01L21/67132 , H01L21/68 , H01L21/6835 , H01L24/27 , H01L24/743 , H01L24/83 , H01L2224/274 , H01L2224/743 , H01L2224/83191 , H01L2924/01004 , H01L2924/01029 , B29C65/00 , H01L2924/00
摘要： A sticking apparatus includes a sticking table 21 for supporting a semiconductor wafer W and a sticking unit 24 that peels off an adhesive sheet S1 from a release liner PS and sticks the adhesive sheet to the semiconductor wafer W. The sticking unit 24 has a detector 60. The detector 60 is disposed above a feed-out path of a raw strip sheet L for detecting a displacement amount S of the adhesive sheet S1 in the lateral direction perpendicular to the feed-out direction thereof. When the displacement amount S is detected, a displacement correction device 51 is activated and the sticking table 21 is moved by a distance corresponding to the displacement amount S, thereby the adhesive sheet S1 can be stuck onto the semiconductor wafer W in accordance with the outer shape thereof. The adhesive sheet S1 is stuck onto the wafer W by a sticking roll 61, which is brought into a contact with the release liner PS to impart a pressing force thereto.
摘要翻译：粘贴装置包括用于支撑半导体晶片W的粘贴台21和从剥离衬垫PS剥离粘合片S1的粘贴单元24，并将粘合片粘贴到半导体晶片W.粘贴单元24具有检测器60 检测器60设置在用于检测粘合片S1在与其输出方向垂直的横向方向上的位移量S的原纸片材L的送出路径的上方。当检测到位移量S时，位移校正装置51被启动，并且粘贴台21移动与位移量S相对应的距离，从而粘合片S1可以根据外部粘合剂粘贴到半导体晶片W上形状。粘合片S1通过与剥离衬垫PS接触以对其施加压力的粘着辊61粘附在晶片W上。

9. 发明授权

US07686916B2 Sheet peeling apparatus and peeling method 有权
标题翻译：薄片剥离装置和剥离方法
公开(公告)号：US07686916B2
公开(公告)日：2010-03-30
申请号：US10577258
申请日：2004-10-21
申请人： Masaki Tsujimoto , Takahisa Yoshioka
发明人： Masaki Tsujimoto , Takahisa Yoshioka
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , H01L2221/68395 , Y10T156/1168 , Y10T156/195 , Y10T156/1978
摘要： There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units. A sheet peeling apparatus for peeling off a sheet stuck on the surface of a semiconductor wafer by using an adhesive tape of a width narrower than that of the sheet, which is equipped with a peeling head for peeling off the sheet by pulling the adhesive tape in an obtuse angled direction in a state stuck to the end portion of the sheet; and first and second rollers for peeling off the sheet by pulling the adhesive tape in the substantially right angle or acute angle direction in a state stuck with the adhesive tape in the direction across the sheet. Either of the peeling units are selectively used in accordance with the type of the sheet.
摘要翻译：提供了使用多个剥离单元的片材剥离装置和剥离方法。一种片剥离装置，用于通过使用宽度窄于片材的宽度的胶带剥离粘附在半导体晶片的表面上的片材，该带材具有用于通过将粘合带拉出来剥离片材的剥离头在粘贴在片材端部的状态下的钝角方向; 以及第一和第二辊，用于通过在粘合带沿着穿过纸张的方向的状态下拉动粘合带以大致直角或锐角方向剥离片材。根据片材的类型选择性地使用任一剥离单元。

10. 发明申请

US20090165958A1 TAPE STICKING APPARATUS AND STICKING METHOD 有权
标题翻译：胶带手提装置和方法
公开(公告)号：US20090165958A1
公开(公告)日：2009-07-02
申请号：US12093571
申请日：2006-12-04
申请人： Takahisa Yoshioka , Yoshiaki Sugishita
发明人： Takahisa Yoshioka , Yoshiaki Sugishita
IPC分类号： B32B41/00 , B32B38/04
CPC分类号： H01L21/67132 , Y10T156/1064 , Y10T156/1075 , Y10T156/1082 , Y10T156/1085 , Y10T156/12 , Y10T156/1322 , Y10T156/1339 , Y10T156/1707 , Y10T156/1712
摘要： A raw sheet L, in which a strip-shaped tape base material TB having a die bonding sheet portion DS with a size of substantially corresponding to the shape of a semiconductor wafer W is temporarily stuck to a strip-shaped release liner S, is fed out, and a cut-line detecting device 14 detects whether any cut-line C is already formed on the outer circumference side of the die bonding sheet portion DS, on the pathway of the feeding out. According to the result of detection, the die cutting device 13 lets the raw sheet L pass straight through without forming any cut-line C when the cut-line C is judged to be already formed thereon. On the other hand, the die cutting device 13 forms a cut-line C to form a sticking tape DDT when no cut-line C is detected. The sticking tape DDT is peeled by a peeling device 15 to be stuck to the ring frame RF in the position that the die bonding sheet portion DS is to be corresponding to the semiconductor wafer W.
摘要翻译：将具有基本上对应于半导体晶片W的形状的芯片接合片部分DS的条状带基材TB临时粘贴到条形剥离衬垫S的原料片L被供给并且切断线检测装置14检测在送出的通路上是否在芯片接合片部分DS的外周侧上形成了任何切割线C. 根据检测结果，当切断线C被判断为已经形成在其上时，模切装置13使原料片L直线穿过而不形成任何切割线C. 另一方面，当没有检测到切割线C时，模切装置13形成切割线C以形成粘着带DDT。粘贴带DDT由剥离装置15剥离以粘贴到环形框架RF上，使得芯片接合片部分DS将对应于半导体晶片W.

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