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    • 1. 发明授权
    • Method for generating program and method for operating system
    • 用于生成操作系统的程序和方法的方法
    • US08510529B2
    • 2013-08-13
    • US12888614
    • 2010-09-23
    • Takahisa SuzukiHiromasa YamauchiHideo MiyakeMakiko Ito
    • Takahisa SuzukiHiromasa YamauchiHideo MiyakeMakiko Ito
    • G06F12/00
    • G06F9/445G06F9/44557
    • An information processing apparatus sequentially selects a function whose execution frequency is high as a selected function that is to be stored in an internal memory, in a source program having a hierarchy structure. The information processing apparatus allocates the selected function to a memory area of the internal memory, allocates a function that is not the selected function and is called from the selected function to an area close to the memory area of the internal memory, and generates an internal load module. The information processing apparatus allocates a remaining function to an external memory coupled to a processor and generates an external load module. Then, a program executed by the processor having the internal memory is generated.
    • 在具有层次结构的源程序中,信息处理装置顺序选择执行频率高的功能作为要存储在内部存储器中的选择功能。 信息处理装置将所选择的功能分配给内部存储器的存储区域,分配不是所选功能的功能,并且从所选择的功能调用到靠近内部存储器的存储区域的区域,并且生成内部 加载模块。 信息处理装置将剩余的功能分配给耦合到处理器的外部存储器,并生成外部负载模块。 然后,生成由具有内部存储器的处理器执行的程序。
    • 4. 发明授权
    • Asynchronous remote procedure calling method and computer product in shared-memory multiprocessor
    • 共享内存多处理器中的异步远程过程调用方法和计算机产品
    • US08117626B2
    • 2012-02-14
    • US12182846
    • 2008-07-30
    • Takahisa SuzukiHideo Miyake
    • Takahisa SuzukiHideo Miyake
    • G06F3/00
    • G06F9/547H04L67/40
    • A first processor makes a procedure call, specifying an address of a procedure in an address space controlled by a second processor and an address of procedure control information generated in an address space controlled by the first processor. The second processor executes the procedure present at the address specified by the first processor. Upon finishing of execution of the procedure, the second processor returns the address of the procedure control information to the first processor. The first processor changes the execution status included in the procedure control information at the address returned from the second processor from “being executed” to “completed”.
    • 第一处理器进行程序调用,指定由第二处理器控制的地址空间中的过程的地址以及由第一处理器控制的地址空间中生成的过程控制信息的地址。 第二处理器执行存在于由第一处理器指定的地址的过程。 在完成该过程的执行之后,第二处理器将过程控制信息的地址返回给第一处理器。 第一处理器将从第二处理器返回的地址的过程控制信息中包括的执行状态从“被执行”改变为“已完成”。
    • 8. 发明授权
    • Vapor deposition for formation of plating layer
    • 用于形成镀层的蒸镀
    • US5429843A
    • 1995-07-04
    • US087731
    • 1993-07-19
    • Katsuhiko MasakiMinoru SaitoHideo MiyakeMasahiko SoudaYukihiro MoritaYasushi Fukui
    • Katsuhiko MasakiMinoru SaitoHideo MiyakeMasahiko SoudaYukihiro MoritaYasushi Fukui
    • C23C14/02C23C14/16C23C14/24B05D3/06C23C16/00
    • C23C14/16C23C14/022C23C14/24
    • The surface of a steel material is irradiated with ion beams, held at a temperature of 100.degree.-400.degree. C. and then subjected to vapor deposition plating in vacuo. The vapor deposition plating may be performed by successively or simultaneously depositing different plating metals. The temperature control may use the sensible heat of the steel material, wherein the vapor deposition plating is applied to the surface of the steel material, which is in the temperature range of 100.degree.-400.degree. C. during cooling after ion beam irradiation, in a vacuum atmosphere. Since the surface of the steel material is held at a temperature of 100.degree.-400.degree.C., a lot of active spots remain on the surface. The active spots serve as starting points for the vapor deposition of the plating metals. The obtained plating layer is excellent in adhesiveness, workability, corrosion resistance and conformability to paint.
    • PCT No.PCT / JP92 / 01511 Sec。 371日期:1993年7月19日 102(e)日期1993年7月19日PCT 1991年11月19日PCT PCT。 公开号WO93 / 10275 日期:1993年5月27日。钢材表面用离子束照射,保持在100〜400℃,真空蒸镀。 可以通过连续或同时沉积不同的电镀金属来进行蒸镀。 温度控制可以使用钢材的显热,其中在离子束照射之后的冷却期间,在钢材表面施加气相沉积电镀,其在100-400℃的温度范围内 真空气氛。 由于钢材的表面保持在100-400℃的温度下,表面上仍留有大量活性斑点。 活性斑点作为电镀金属气相沉积的起点。 所得到的镀层的粘合性,加工性,耐腐蚀性和涂料适应性优异。